ATSAMA5D24A-CUR - 500MHz Cortex-A5 MPU, 256-TFBGA | Microchip
부품 번호: ATSAMA5D24A-CUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $13.45 | $13.45 |
| 10 | $12.18 | $121.80 |
| 100 | $10.85 | $1,085.00 |
| 500 | $9.62 | $4,810.00 |
| 1,000 | $8.95 | $8,950.00 |
ATSAMA5D24A-CUR 개요
An ARM Cortex-A5 MPU is a microprocessor unit based on the ARMv7-A architecture that delivers application-processor class performance with very low power consumption, making it the right choice when an MCU is insufficient but a full power-hungry application processor is overkill. The SAMA5D2 family sits in the hierarchy: ARM Cortex-A core -> application-class MPU -> embedded microprocessor -> integrated circuit. The Cortex-A5 implements the ARMv7-A instruction set with optional NEON SIMD and floating-point unit support, balancing MHz-per-mW efficiency with deterministic real-time behavior.
Key differentiating features of the ATSAMA5D24A-CUR include 5 uA backup-mode current for battery-backed designs, an embedded peripheral touch controller, hardware AES/OTF crypto accelerators for secure boot, an integrated LCD controller up to WXGA resolution, 10/100 Mbps Ethernet MAC, USB 2.0 with HSIC, and multiple connectivity peripherals (CAN, I2S, I2C, SPI, UART). The SAMA5D2 architecture uses a simple power management scheme that eliminates external PMIC complexity for many designs. The 8x8 mm ultra-small BGA package enables high-density PCB layouts while the industrial temperature grade (-40C to +85C) suits HMI and industrial gateway deployments.
Typical applications include industrial HMI panels, smart energy gateways, barcode scanners, building automation controllers, medical patient monitors, and portable data acquisition terminals. The 256-TFBGA package supports high-speed signal routing while keeping the PCB footprint compact enough for space-constrained designs. When designing with this part, allocate sufficient PCB layers (at least 4) for the DDR memory interface and follow Microchip application notes for BGA fanout and decoupling. The enable pin and reset architecture support clean power sequencing with backup battery domains.
드롭인 대체품: ATSAMA5D24A-CUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D24A-CUR (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, Package, USB, Backup Mode Current, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D24A-CU
✅ 드롭인✓ 재고 있음
$9.85 / 개
데이터시트 보기 →ATSAMA5D24B-CU
✅ 드롭인✓ 재고 있음
$10.42 / 개
데이터시트 보기 →ATSAMA5D23A-CUR
✅ 드롭인✓ 재고 있음
$8.95 / 개
데이터시트 보기 →ATSAMA5D22C-CU
✅ 드롭인✓ 재고 있음
$7.14 / 개
데이터시트 보기 →ATSAMA5D21B-CU
✅ 드롭인✓ 재고 있음
$9.8 / 개
데이터시트 보기 →ATSAMA5D24A-CUR 최대 정격 & 전기적 특성
| Manufacturer | Microchip Technology |
| Series | SAMA5D2 |
| Core Processor | ARM Cortex-A5 |
| Core Architecture | ARMv7-A |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Clock Speed | 500 MHz |
| Internal SRAM | 128 KB |
| Instruction/Data Cache | 32 KB each |
| Multimedia Co-processor | NEON MPE |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| 패키지 | 256-TFBGA (8x8 mm) |
| 동작 온도 | -40C to +85C (Industrial) |
| Backup Mode Current | 5 uA |
| Graphics Acceleration | Yes (2D) |
| LCD Controller | Up to WXGA |
| Ethernet | 10/100 Mbps |
| USB | USB 2.0 + HSIC |
| Hardware Crypto | AES, Secure Boot, OTF |
| Supply Voltage I/O | 1.2V, 1.8V, 3.3V |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
ATSAMA5D24A-CUR 256-tfbga (8x8 mm) 핀 구성 가이드
ATSAMA5D24A-CUR(256-tfbga (8x8 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D24A-CUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D24A-CUR 적합 용도: 6 애플리케이션s: Industrial HMI Control Panels, Smart Energy Gateways, Medical Patient Monitors, Building Automation Controllers, Portable Barcode Scanners, Edge IoT Gateways.
Industrial HMI Control Panels
The ATSAMA5D24A-CUR fits industrial HMI panels because it combines a 500 MHz Cortex-A5 core with an integrated LCD controller supporting up to WXGA resolution and a 2D graphics accelerator. NEON MPE accelerates UI rendering, while the 128 KB internal SRAM handles touch event buffering and frame composition. The 5 uA backup current enables RTC retention across power cycles typical of factory-floor installations.
추천
Smart Energy Gateways
The ATSAMA5D24A-CUR is well suited for smart energy gateways thanks to its 10/100 Ethernet MAC, USB 2.0 with HSIC, CAN-FD interface, and hardware AES/OTF crypto for secure protocol handling. The 500 MHz core runs Linux with MQTT or DLMS/COSEM stacks, while NEON accelerates TLS handshake computations. Industrial temperature grade (-40C to +85C) supports outdoor cabinet installations across climate zones.
추천
Medical Patient Monitors
The ATSAMA5D24A-CUR serves medical patient monitors where 500 MHz Cortex-A5 performance runs Linux with vital-sign processing algorithms and a 2D GPU drives the bedside display. Hardware AES encryption secures patient health information (PHI) at rest and in transit. The integrated peripheral touch controller simplifies front-panel glass with capacitive buttons, reducing BOM cost for medical OEMs.
추천
Building Automation Controllers
The ATSAMA5D24A-CUR excels in building automation controllers that aggregate BACnet, Modbus, and KNX traffic over its dual CAN-FD, UART, and Ethernet interfaces. The Cortex-A5 core runs Linux with automation stacks like openHAB or Home Assistant, while 5 uA backup current keeps RTC and scheduling data alive during brownouts. Industrial temperature grade covers rooftop and basement equipment locations.
추천
Portable Barcode Scanners
The ATSAMA5D24A-CUR powers portable barcode scanners because its NEON MPE accelerates 1D/2D barcode decode algorithms (e.g., zxing) while the 2D GPU drives the scanner's preview display. USB 2.0 host mode supports Wi-Fi/Bluetooth dongles for warehouse network connectivity. The 5 uA backup mode extends shelf life between charges for handheld inventory terminals.
추천
Edge IoT Gateways
The ATSAMA5D24A-CUR fits edge IoT gateways that aggregate sensor data from multiple fieldbuses (I2C, SPI, UART, CAN) and publish to cloud brokers via Ethernet or Wi-Fi. Hardware AES and secure boot satisfy IEC 62443 cybersecurity baselines for industrial IoT. The DDR3L/LPDDR3 memory controller supports large inference workloads for on-device anomaly detection at the network edge.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D24A-CUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D24A-CU | ATSAMA5D24B-CU | ATSAMA5D23A-CUR | ATSAMA5D22C-CU | ATSAMA5D21B-CU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-TFBGA (8x8) | 256-TFBGA (8x8) - same | 256-TFBGA (8x8) - same | 256-TFBGA (8x8) - same | 256-TFBGA (8x8) - same | 256-TFBGA (8x8) - same |
| Core | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz |
| Internal SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| LCD Controller | Yes (WXGA) | Yes (WXGA) | Yes (WXGA) | Yes (WXGA) | No | Yes (lower res) |
| Graphics Acceleration | 2D | 2D | 2D | 2D | 2D | No |
| CAN-FD | Yes | Yes | Yes | Yes | Yes | No |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
주요 차별점
- Compact 8x8 mm BGA with full SAMA5D2 peripheral mix (vs ATSAMA5D27-CUR)
- Industrial temperature grade with 5 uA backup mode (vs ATSAMA5D23A-CUR)
- Built-in LCD controller up to WXGA (vs ATSAMA5D22C-CU)
설계 노트
The 256-TFBGA package uses 0.4 mm ball pitch and requires at least a 4-layer HDI PCB with microvia-in-pad or laser-drilled microvia fanout for the inner rows. Allocate a continuous GND plane beneath the BGA and stitch vias on a 1 mm grid to suppress PDN impedance. Estimated: a 6-layer stack-up with 0.2 mm dielectric thickness is recommended for DDR3L signal integrity at 500 MHz.
Although the SAMA5D24 is designed for low-power operation, sustained 500 MHz Cortex-A5 workloads with NEON active can push junction temperature into the 85C ambient ceiling. Use thermal vias under the BGA thermal pad to spread heat into the inner GND/power planes. Estimated: at full load with 1.0 V core, the part dissipates approximately 0.5-0.8 W; a copper area of at least 1 square inch on the top layer is recommended.
The SAMA5D24 requires a simple power management scheme with separate 1.2 V (core), 1.8 V (DDR), and 3.3 V (I/O) rails. Decoupling requires 100 nF X7R on every power pin plus bulk 4.7 uF and 22 uF capacitors near the BGA. Estimated: budget approximately 0.5 W peak for the MPU and another 0.5-1 W for the DDR memory; size the DC-DC converters for at least 3 W continuous headroom.
Do not confuse the A and B silicon revisions: while both share the same 256-TFBGA footprint and 500 MHz Cortex-A5 core, the B revision incorporates errata fixes documented in the SAMA5D2 errata sheet. Always check the latest Microchip errata document before committing to PCB layout, and ensure your Linux4SAM BSP matches the silicon revision. Mixing revisions can cause subtle USB or DDR timing issues at production volumes.
규정 준수 정보
RoHS compliance per Microchip product page. Not AEC-Q100 qualified (industrial grade, not automotive). Halogen-free status not explicitly stated in available data.
