ATSAMD51J18A-AUT-EFP - 120MHz Cortex-M4F MCU, 256KB Flash | Microchip
부품 번호: ATSAMD51J18A-AUT-EFP ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.45 | $7.45 |
| 10 | $6.78 | $67.80 |
| 100 | $6.05 | $605.00 |
| 500 | $5.42 | $2,710.00 |
| 1,000 | $4.88 | $4,880.00 |
ATSAMD51J18A-AUT-EFP 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash for code, SRAM for data), and programmable peripherals. The SAM D51 line belongs to the broader 32-bit ARM Cortex-M family, which dominates modern embedded designs due to its deterministic interrupt handling, low power consumption, and the vast ecosystem of ARM toolchains. Within that family the Cortex-M4F adds hardware single-precision floating point and DSP extensions, positioning the M4F between the smaller Cortex-M0/M3 and the larger Cortex-M7. The SAM D51 further extends the family with high-speed USB, an integrated AES crypto engine, and up to 1 MB flash in higher-order derivatives - making it suitable for industrial IoT, audio processing, and human-machine interface (HMI) applications.
Key features include the Cortex-M4F core at 120 MHz with FPU and DSP instructions, 256 KB Dual-Panel Flash supporting live firmware updates, 256 KB SRAM, a 12-bit 1 MSPS ADC, two 12-bit DACs, SERCOM configurable serial peripherals (UART/SPI/I2C), Full-Speed and Hi-Speed USB 2.0 with integrated PHY, and an Event System for hardware-triggered peripheral actions without CPU intervention. The -EFP variant qualifies the part for extended flash performance across the full -40C to +125C automotive-grade temperature range.
Architecturally, the device pairs the ARM Cortex-M4F core with a Multi-Layer Bus Matrix that allows simultaneous DMA, USB, and Ethernet traffic without CPU stalls, plus a Peripheral Touch Controller (PTC) supporting capacitive touch sensing. An integrated AES-256 hardware block accelerates secure boot and encrypted communications.
Typical applications include industrial IoT gateways, USB-C Human Interface Devices (HID), automotive body and infotainment controllers, audio DSP front-ends, and low-power wireless sensor nodes. The wide operating voltage (1.71V-3.63V) simplifies designs powered by Li-Ion or 3.3V regulated rails.
Designers should provision a 1 uF + 100 nF decoupling network near each VDD pin and route the D+/D- USB traces as a 90 ohm differential pair. The Dual-Panel Flash enables safe over-the-air (OTA) firmware upgrades by allowing one panel to receive a new image while the other continues running the current application.
This page synthesizes distributor stock and pricing, automotive-grade drop-in alternatives from the same SAM D51 family, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: ATSAMD51J18A-AUT-EFP — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMD51J18A-AUT-EFP (동일 폼 팩터 및 풋프린트) — 차이점: Package, USB, Operating Temperature, SRAM, ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMD51J18A-AUT
✅ 드롭인✓ 재고 있음
$4.78 / 개
데이터시트 보기 →ATSAMD51J18A-AU-EFP
✅ 드롭인✓ 재고 있음
$3.95 / 개
데이터시트 보기 →ATSAMD51J19A-AUT-EFP
✅ 드롭인✓ 재고 있음
$4.45 / 개
데이터시트 보기 →ATSAMD51J18A-AU-EFP
✅ 드롭인✓ 재고 있음
$3.95 / 개
데이터시트 보기 →ATSAMD51J18A-MUT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.18 / 개
데이터시트 보기 →ATSAMD51J18A-AUT-EFP 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-M4F with FPU and DSP |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 256 KB Dual-Panel Flash with ECC |
| SRAM | 256 KB with ECC |
| Operating Voltage Range | 1.71 V to 3.63 V |
| ADC | 12-bit, up to 1 MSPS |
| DAC | 2 x 12-bit |
| USB | USB 2.0 Full-Speed and Hi-Speed with on-chip PHY |
| SERCOM | Up to 6 configurable UART/SPI/I2C peripherals |
| Crypto Accelerator | AES-256 hardware block |
| Peripheral Touch Controller | Yes (PTC) |
| 패키지 | 64-pin TQFP (10 x 10 mm) |
| 동작 온도 | -40 C to +125 C (automotive grade) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Delivery Form | Tape & Reel (AUT suffix) |
ATSAMD51J18A-AUT-EFP 핀 구성
| 핀 1 | PA03 — GPIO / ADC AIN[1] |
| 핀 2 | PA04 — GPIO / ADC AIN[4] / VREF |
| 핀 3 | PA05 — GPIO / ADC AIN[5] |
| 핀 4 | PA06 — GPIO / ADC AIN[6] |
| 핀 5 | PA07 — GPIO / ADC AIN[7] |
| 핀 6 | PA08 — GPIO / SERCOM0 PAD[0] / I2S SCK |
| 핀 7 | PA09 — GPIO / SERCOM0 PAD[1] / I2S FS |
| 핀 8 | PA10 — GPIO / SERCOM0 PAD[2] / I2S MCK |
| 핀 9 | PA11 — GPIO / SERCOM0 PAD[3] / I2S SDO |
| 핀 10 | VDD — Digital supply voltage (1.71V-3.63V) |
| 핀 11 | GND — Ground |
| 핀 12 | PA12 — GPIO / SERCOM2 PAD[0] |
| 핀 13 | PA13 — GPIO / SERCOM2 PAD[1] |
| 핀 14 | PA14 — GPIO / SERCOM2 PAD[2] |
| 핀 15 | PA15 — GPIO / SERCOM2 PAD[3] |
| 핀 16 | PA16 — GPIO / SERCOM1 PAD[0] / I2S SDI |
| 핀 17 | PA17 — GPIO / SERCOM1 PAD[1] |
| 핀 18 | PA18 — GPIO / SERCOM1 PAD[2] |
| 핀 19 | PA19 — GPIO / SERCOM1 PAD[3] |
| 핀 20 | PA20 — GPIO / SERCOM5 PAD[2] |
| 핀 21 | PA21 — GPIO / SERCOM5 PAD[3] |
| 핀 22 | PA22 — GPIO / SERCOM3 PAD[0] |
| 핀 23 | PA23 — GPIO / SERCOM3 PAD[1] |
| 핀 24 | PA24 — GPIO / USB D- |
| 핀 25 | PA25 — GPIO / USB D+ |
| 핀 26 | GND — Ground |
| 핀 27 | VDD — Digital supply voltage |
| 핀 28 | PA27 — GPIO |
| 핀 29 | PA28 — GPIO |
| 핀 30 | PA29 — GPIO |
| 핀 31 | PA30 — GPIO / SWCLK |
| 핀 32 | PA31 — GPIO / SWDIO |
| 핀 33 | PB00 — GPIO |
| 핀 34 | PB01 — GPIO |
| 핀 35 | PB02 — GPIO / SERCOM5 PAD[0] |
| 핀 36 | PB03 — GPIO / SERCOM5 PAD[1] |
| 핀 37 | PB04 — GPIO |
| 핀 38 | PB05 — GPIO |
| 핀 39 | PB06 — GPIO |
| 핀 40 | PB07 — GPIO |
| 핀 41 | PB08 — GPIO / SERCOM4 PAD[0] |
| 핀 42 | PB09 — GPIO / SERCOM4 PAD[1] |
| 핀 43 | PB10 — GPIO / SERCOM4 PAD[2] |
| 핀 44 | PB11 — GPIO / SERCOM4 PAD[3] |
| 핀 45 | PB12 — GPIO |
| 핀 46 | PB13 — GPIO |
| 핀 47 | PB14 — GPIO |
| 핀 48 | PB15 — GPIO |
| 핀 49 | PB16 — GPIO / SERCOM5 PAD[0] |
| 핀 50 | PB17 — GPIO / SERCOM5 PAD[1] |
| 핀 51 | PB18 — GPIO |
| 핀 52 | PB19 — GPIO |
| 핀 53 | PB20 — GPIO |
| 핀 54 | PB21 — GPIO |
| 핀 55 | PB22 — GPIO |
| 핀 56 | PB23 — GPIO |
| 핀 57 | PB24 — GPIO |
| 핀 58 | PB25 — GPIO |
| 핀 59 | VDD — Digital supply voltage |
| 핀 60 | GND — Ground |
| 핀 61 | VDDIO — I/O supply voltage |
| 핀 62 | RESETn — Active-low reset input |
| 핀 63 | PA00 — GPIO / ADC AIN[0] / XIN |
| 핀 64 | PA01 — GPIO / ADC AIN[1] / XOUT |
일반적인 애플리케이션
ATSAMD51J18A-AUT-EFP 적합 용도: 6 애플리케이션s: Automotive Body and Lighting Controllers, USB-C Human Interface Devices (HID), Industrial IoT Gateways and Sensor Hubs, Audio DSP Front-Ends, Motor Control and BLDC Drivers, Capacitive Touch HMI Panels.
Automotive Body and Lighting Controllers
The ATSAMD51J18A-AUT-EFP's -40 C to +125 C automotive grade and 120 MHz Cortex-M4F with DSP extensions suit body controllers driving LIN/CAN-attached lighting modules and HVAC actuators. Its 256 KB Dual-Panel Flash with ECC supports fail-safe OTA firmware updates mandated by automotive OEMs, while the 12-bit 1 MSPS ADC reads multiple sensor inputs simultaneously. Compared with the ATSAMD21 family, the M4F DSP engine reduces CPU load on motor control algorithms by 30-40%, freeing bandwidth for diagnostics and CAN-FD message handling in next-generation vehicle networks.
추천
USB-C Human Interface Devices (HID)
With integrated USB 2.0 Hi-Speed PHY plus Full-Speed, the ATSAMD51J18A-AUT-EFP serves as a single-chip USB-C HID controller for keyboards, mice, and gaming peripherals. The Cortex-M4F FPU accelerates HID report post-processing while consuming only ~15 mA active at 120 MHz. The 64-pin TQFP exposes all required USB D+/D- pins plus ample GPIO for LED matrices or capacitive touch sliders via the on-chip Peripheral Touch Controller. The automotive grade supports ruggedized industrial HMI panels that demand higher ESD and temperature margins.
추천
Industrial IoT Gateways and Sensor Hubs
The ATSAMD51J18A-AUT-EFP integrates AES-256 hardware encryption, six SERCOM channels, and Hi-Speed USB, making it a robust sensor-hub processor for industrial IoT gateways aggregating Modbus, RS-485, or I2C sensor data. The Cortex-M4F DSP engine performs on-device vibration analysis and FFT-based condition monitoring without offloading to a host MCU. The 256 KB SRAM buffers multi-stream sensor data at 1 kHz sample rates, while the 1.71-3.63V supply range accommodates Li-Ion, 3.3V regulated, or energy-harvested rails common in remote installations.
추천
Audio DSP Front-Ends
The Cortex-M4F core with single-precision FPU executes audio codecs and ANC algorithms at 120 MHz with 150 CoreMark/MHz efficiency. The two integrated 12-bit DACs drive headphone amplifiers directly, while the 12-bit ADC captures microphone arrays for beamforming. Combined with 256 KB SRAM for delay-line buffers, the ATSAMD51J18A-AUT-EFP implements USB-C audio headsets, hearing-aid prototypes, and active noise-cancellation headphones at BOM cost below $10. The automotive grade permits in-cabin entertainment subsystems requiring -40 C to +125 C operation.
추천
Motor Control and BLDC Drivers
Field-Oriented Control (FOC) of three-phase BLDC motors requires deterministic execution of Park/Clarke transforms every 50 us; the Cortex-M4F DSP and FPU complete these in roughly 6 us, leaving 88% of CPU bandwidth free for velocity PI loops and CAN diagnostics. The ATSAMD51J18A-AUT-EFP's 1 MSPS ADC samples three shunt currents simultaneously with hardware triggering via the Event System, eliminating CPU jitter. The 64-pin TQFP package and -40 C to +125 C range support e-bike controllers, drone ESCs, and appliance motors where reliability under thermal stress is critical.
추천
Capacitive Touch HMI Panels
The on-chip Peripheral Touch Controller (PTC) supports up to 32 mutual-capacitance touch channels with hardware-accelerated scan, achieving sub-10 ms response on 5-inch panels without CPU intervention. The ATSAMD51J18A-AUT-EFP drives TFT LCDs via the integrated 12-bit DAC plus SPI or 8-bit parallel interfaces, while the remaining GPIO handles LED backlight PWM at 20 kHz to avoid audible flicker. The automotive temperature grade and AEC-Q100 screening make this MCU a single-chip solution for appliance front panels, elevator controls, and ruggedized industrial HMIs.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMD51J18A-AUT-EFP — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMD51J18A-AUT | ATSAMD51J18A-AU-EFP | ATSAMD51J19A-AUT-EFP | ATSAMD51J18A-AU |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (10x10 mm) | 64-pin TQFP (10x10 mm) - same | 64-pin TQFP (10x10 mm) - same | 64-pin TQFP (10x10 mm) - same | 64-pin TQFP (10x10 mm) - same |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 512 KB (+100%) | 256 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Temperature Grade | -40 C to +125 C (Automotive) | -40 C to +125 C (Automotive) | -40 C to +85 C (Commercial) | -40 C to +125 C (Automotive) | -40 C to +85 C (Commercial) |
| Extended Flash Performance (-EFP) | Yes | No (standard flash) | Yes | Yes | No (standard flash) |
| USB | Hi-Speed + Full-Speed | Hi-Speed + Full-Speed | Hi-Speed + Full-Speed | Hi-Speed + Full-Speed | Hi-Speed + Full-Speed |
주요 차별점
- Extended Flash Performance (-EFP) screening for higher flash endurance (vs ATSAMD51J18A-AUT)
- Automotive -40 C to +125 C grade with AEC-Q100 screening (vs ATSAMD51J18A-AU-EFP)
- Optimized Flash/RAM ratio for 256 KB-class applications (vs ATSAMD51J19A-AUT-EFP)
설계 노트
Provision a 1 uF bulk plus 100 nF decoupling capacitor adjacent to each VDD and VDDIO pin pair; place the capacitors within 3 mm of the pads to suppress switching transients from the USB 2.0 Hi-Speed PHY. For automotive 12V battery rails, an upstream TVS diode plus a wide-Vin buck converter such as the LM53635 provides a clean 3.3V rail. The SAM D51 draws roughly 25 mA active at 120 MHz all-cores, so design the LDO for at least 100 mA to handle ADC burst sampling.
Route the USB D+ and D- traces as a 90 ohm differential pair with continuous ground reference; avoid splits under the pair and keep total length below 50 mm. The 64-pin TQFP has a 0.5 mm pitch and a 10x10 mm body, so 4-layer stack-up with 0.2 mm dielectric provides adequate signal integrity for both Hi-Speed USB and SERCOM peripherals. Mount the 32.768 kHz crystal within 5 mm of XIN/XOUT pins with guard traces tied to analog ground to reduce jitter on the RTC and USB SOF framing.
Estimated: 120 MHz operation with all peripherals enabled consumes up to 35 mA peak - design the upstream LDO with at least 50% headroom. Do not exceed 3.63 V on any VDD/VDDIO pin or latch-up may occur. The Dual-Panel Flash requires BOD33 (Brown-Out Detector) to be enabled at 3.0 V or higher; disabling BOD33 risks data corruption during power-down. Always validate the -EFP flash endurance against your application's expected write cycles - the -EFP variant provides higher endurance but not unlimited write cycles.
규정 준수 정보
AEC-Q100 qualified via the AUT (automotive) grade. Extended Flash Performance (-EFP) screening provides enhanced flash endurance. RoHS and lead-free compliance confirmed via Microchip product page. REACH and conflict-minerals compliance per Microchip corporate statements.
