ATSAMD51J20A-MFT - 120MHz Cortex-M4F MCU, 1MB Flash | Microchip
부품 번호: ATSAMD51J20A-MFT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.85 | $7.85 |
| 10 | $7.04 | $70.40 |
| 100 | $5.93 | $593.00 |
| 500 | $5.42 | $2,710.00 |
| 1,000 | $5.1 | $5,100.00 |
ATSAMD51J20A-MFT 개요
A microcontroller (MCU) is an integrated circuit that combines a CPU core, memory (Flash/SRAM), and programmable peripherals on a single die. Within the embedded hierarchy, the ATSAMD51J20A-MFT sits in the high-performance Cortex-M4F tier, above Cortex-M0+ entry-level devices (e.g., SAMD20) and below Cortex-M7 high-end parts (e.g., SAME70). The Cortex-M4F core adds hardware single-precision floating-point and DSP instructions, enabling efficient fixed- and floating-point signal processing without software emulation. The SAM D51 specifically adds Floating Point Unit (FPU) for single-precision arithmetic, hardware AES, and a rich peripheral set including HS USB, CAN-FD, SD card, and I2S.
Key features of the ATSAMD51J20A-MFT include 1 MB dual-panel Flash with ECC for reliable in-application updates, 256 KB SRAM with ECC, a 12-bit, 1 MSPS ADC with up to 16 channels, two 12-bit DACs, multiple SERCOM interfaces (configurable as UART/SPI/I2C), HS USB 2.0 with on-chip PHY, CAN-FD, and an Event System for hardware-triggered inter-peripheral signalling. The 120 MHz Cortex-M4F delivers 150 CoreMark and supports DSP instructions and single-precision FPU, making it suitable for motor control, audio processing, and sensor fusion. Power consumption is optimized through multiple Sleep modes (IDLE, STANDBY, BACKUP) with RTC running, plus a Backup domain with battery switchover.
Architecturally, the SAM D51 uses a multi-bus AHB/APB matrix to allow parallel peripheral DMA access without CPU stalls. The Peripheral Access Controller (PAC) provides software-configurable write-protect on critical registers, and the System Control Block (SCB) supports configurable fault escalation. The integrated High-Speed USB 2.0 PHY eliminates external crystals, and the on-chip 32 kHz RTC oscillator reduces BOM. The dual-panel Flash enables live in-field updates while running from the other panel, with ECC on both Flash and SRAM to mitigate soft errors in industrial environments.
Typical applications include industrial IoT edge nodes, sensor hubs, USB peripherals, motor control FOC drives, audio processing, and human-machine interface (HMI) touch panels. It is also widely used in building automation, smart energy metering, and consumer wearables. The combination of HS USB, CAN-FD, and SD card interfaces makes it especially attractive for connected, mains-powered appliances and industrial gateways.
When designing with this device, ensure the 64-pin QFN has adequate ground paddle soldering to achieve the datasheet thermal resistance of approximately 31 C/W. Decoupling must use 100 nF ceramic on each VDD pin plus bulk 4.7 uF; the internal regulator requires a 1 uF capacitor on DECOUPLE. The BOOTPROT fuse must be programmed to lock the bootloader if secure OTA updates are required. The HS USB differential pair (DP/DM) needs 90 ohm differential impedance routing and a 1 M ohm pull-up on DP for full-speed detection. Mbed OS, Harmony 3, and the SAMD51 SDK are the recommended software frameworks for development.
드롭인 대체품: ATSAMD51J20A-MFT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMD51J20A-MFT (동일 폼 팩터 및 풋프린트) — 차이점: Package, DAC, ADC, SRAM, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMD51J20A-MUT
✅ 드롭인✓ 재고 있음
$6.2 / 개
데이터시트 보기 →ATSAMD51J20A-MF
✅ 드롭인✓ 재고 있음
$5.2 / 개
데이터시트 보기 →ATSAME51J19A-MFT
✅ 드롭인✓ 재고 있음
$5.78 / 개
데이터시트 보기 →ATSAMD51G19A-MFT
✅ 드롭인✓ 재고 있음
$4.02 / 개
데이터시트 보기 →ATSAMD51J19A-MFT
✅ 드롭인✓ 재고 있음
$5.94 / 개
데이터시트 보기 →ATSAMD51J20A-MFT 최대 정격 & 전기적 특성
| Core | ARM Cortex-M4F with FPU and DSP instructions |
| 최대 클록 주파수 | 120 MHz |
| Program Memory | 1 MB Flash with ECC (dual-panel) |
| SRAM | 256 KB with ECC |
| Supply Voltage (VDD) | 1.71 V to 3.6 V |
| 동작 온도 | -40C to +125C (extended industrial) |
| 패키지 | 64-pin QFN (9x9 mm) with exposed pad |
| ADC | 12-bit, up to 1 MSPS, 16 channels |
| DAC | 2x 12-bit, 1 MSPS |
| USB | HS USB 2.0 Device/Host with on-chip PHY |
| CAN | CAN 2.0B and CAN-FD |
| SERCOM | Up to 8 configurable SERCOM (UART/SPI/I2C/LIN) |
| Timers/Counters | TC and TCC channels for PWM |
| 실장 유형 | Surface Mount (QFN) |
| Packaging | Tape & Reel (suffix -MFT) |
| RoHS 상태 | Compliant |
ATSAMD51J20A-MFT 핀 구성
| 핀 1 | VDDIO — Digital I/O supply (1.71V to 3.6V) |
| 핀 2 | PA00 — General I/O / XIN32 (32 kHz crystal) |
| 핀 3 | PA01 — General I/O / XOUT32 |
| 핀 4 | PA02 — AIN[0] / VREFA / DAC0_OUT |
| 핀 5 | PA03 — AIN[1] / VREFB / DAC1_OUT |
| 핀 6 | GND — Ground |
| 핀 7 | PA04 — AIN[2] / TC0_WO[0] |
| 핀 8 | PA05 — AIN[3] / TC0_WO[1] |
| 핀 9 | PA06 — AIN[4] / TC1_WO[0] |
| 핀 10 | PA07 — AIN[5] / TC1_WO[1] |
| 핀 11 | VDDIN — Main supply input |
| 핀 12 | PA08 — AIN[6] / TC2_WO[0] |
| 핀 13 | PA09 — AIN[7] / TC2_WO[1] |
| 핀 14 | PA10 — AIN[8] / TCC0_WO[0] |
| 핀 15 | PA11 — AIN[9] / TCC0_WO[1] / SERCOM0_PAD3 |
| 핀 16 | PA12 — AIN[10] / TCC0_WO[2] |
| 핀 17 | PA13 — AIN[11] / TCC0_WO[3] |
| 핀 18 | PA14 — AIN[12] / TCC0_WO[4] |
| 핀 19 | PA15 — AIN[13] / TCC0_WO[5] |
| 핀 20 | GND — Ground |
| 핀 21 | PA16 — AIN[14] / TCC0_WO[6] |
| 핀 22 | PA17 — AIN[15] / TCC0_WO[7] |
| 핀 23 | PA18 — SERCOM1_PAD0 / TCC1_WO[0] |
| 핀 24 | PA19 — SERCOM1_PAD1 / TCC1_WO[1] |
| 핀 25 | PA20 — SERCOM1_PAD2 / TCC1_WO[2] |
| 핀 26 | PA21 — SERCOM1_PAD3 / TCC1_WO[3] |
| 핀 27 | PA22 — SERCOM2_PAD0 / TCC2_WO[0] |
| 핀 28 | PA23 — SERCOM2_PAD1 / TCC2_WO[1] |
| 핀 29 | PA24 — USB_DM |
| 핀 30 | PA25 — USB_DP |
| 핀 31 | PA26 — SERCOM2_PAD2 |
| 핀 32 | PA27 — SERCOM2_PAD3 |
| 핀 33 | PA28 — AIN[16] |
| 핀 34 | PA29 — AIN[17] |
| 핀 35 | PA30 — AIN[18] / SERCOM3_PAD0 |
| 핀 36 | PA31 — AIN[19] / SERCOM3_PAD1 |
| 핀 37 | PB00 — SERCOM3_PAD2 / AIN[20] |
| 핀 38 | PB01 — SERCOM3_PAD3 / AIN[21] |
| 핀 39 | PB02 — SERCOM4_PAD0 / AIN[22] |
| 핀 40 | PB03 — SERCOM4_PAD1 / AIN[23] |
| 핀 41 | PB04 — SERCOM4_PAD2 |
| 핀 42 | PB05 — SERCOM4_PAD3 |
| 핀 43 | PB06 — SERCOM5_PAD0 |
| 핀 44 | PB07 — SERCOM5_PAD1 |
| 핀 45 | PB08 — SERCOM5_PAD2 / CAN0_RX |
| 핀 46 | PB09 — SERCOM5_PAD3 / CAN0_TX |
| 핀 47 | PB10 — SERCOM6_PAD0 |
| 핀 48 | PB11 — SERCOM6_PAD1 |
| 핀 49 | PB12 — SERCOM6_PAD2 / TCC3_WO[0] |
| 핀 50 | PB13 — SERCOM6_PAD3 / TCC3_WO[1] |
| 핀 51 | PB14 — SERCOM7_PAD0 / TCC4_WO[0] |
| 핀 52 | PB15 — SERCOM7_PAD1 / TCC4_WO[1] |
| 핀 53 | PB16 — SERCOM7_PAD2 / TCC4_WO[2] |
| 핀 54 | PB17 — SERCOM7_PAD3 / TCC4_WO[3] |
| 핀 55 | VDDIO — Digital I/O supply |
| 핀 56 | PB18 — SERCOM3_PAD2 / I2S_SD1 |
| 핀 57 | PB19 — SERCOM3_PAD3 |
| 핀 58 | PB20 — GCLK / SWO / SERCOM3_PAD2 |
| 핀 59 | PB21 — SERCOM3_PAD3 |
| 핀 60 | PB22 — SERCOM0_PAD2 |
| 핀 61 | PB23 — SERCOM0_PAD3 |
| 핀 62 | PB24 — SERCOM0_PAD0 |
| 핀 63 | PB25 — SERCOM0_PAD1 |
| 핀 64 | GND — Ground |
일반적인 애플리케이션
ATSAMD51J20A-MFT 적합 용도: 6 애플리케이션s: Industrial IoT Edge Node, USB Audio Class Peripheral, Sensor Hub / Wearable, Brushless DC Motor Control (FOC), Human-Machine Interface (HMI) with TFT Display, Building Automation Gateway.
Industrial IoT Edge Node
The ATSAMD51J20A-MFT is a strong fit for industrial IoT edge nodes that aggregate sensor data, run local DSP pre-processing, and forward results to a gateway. Its 120 MHz Cortex-M4F core with hardware FPU delivers approximately 150 CoreMark, sufficient for FFT, Kalman filtering, and anomaly detection on vibration or current sensors in real time. The 1 MB Flash accommodates OTA-capable dual-image firmware with ECC, while 256 KB SRAM supports data buffers for multi-channel sensor sampling. The integrated HS USB and CAN-FD enable direct connection to industrial PLCs, and the SERCOM interfaces accept UART/SPI/I2C sensors without external protocol converters. Compared with a discrete Cortex-M7 + external PHY approach, this single-chip solution reduces BOM cost and PCB area for energy-harvesting or battery-powered sensor hubs.
추천
USB Audio Class Peripheral
The ATSAMD51J20A-MFT is purpose-built for USB audio class peripherals such as USB microphones, USB DACs, and USB audio interfaces. Its integrated High-Speed USB 2.0 PHY eliminates the need for an external transceiver, while the dual-panel Flash enables live firmware updates for bug fixes and codec additions. The two on-chip 12-bit 1 MSPS DACs can drive line-level outputs for headphone monitoring, and the 12-bit ADC handles stereo line-level inputs. The Cortex-M4F core has sufficient MIPS for 96 kHz/24-bit USB audio streaming with on-the-fly mixing and DSP effects. Designers should pay attention to 90 ohm differential USB impedance and provide a clean 3.3 V analog supply separate from digital VDDIO for best THD+N performance.
추천
Sensor Hub / Wearable
The ATSAMD51J20A-MFT fits sensor hub and wearable applications that combine motion, biometric, and environmental sensing with BLE/USB tethering. Its Cortex-M4F DSP instructions accelerate sensor fusion algorithms (complementary, Madgwick, or Kalman filters) on 6-axis IMU data in real time, offloading the host phone and improving battery life. The 120 MHz operation supports multi-sensor sampling at high ODR without dropping packets, and the SERCOM interfaces can directly connect to SPI/IC MEMS sensors. Multiple low-power Sleep modes plus a 0.9 V VBAT battery-backup domain allow the device to idle below 5 uA while still keeping RTC wakeup logic active. The 64-QFN (9x9 mm) is small enough for wrist-worn enclosures, and the exposed pad enables efficient thermal dissipation during sustained Bluetooth transmissions.
추천
Brushless DC Motor Control (FOC)
Field-Oriented Control (FOC) of brushless DC and permanent-magnet synchronous motors demands deterministic PWM timing, fast ADC sampling synchronized to PWM edges, and sufficient CPU bandwidth for the Park/Clarke transforms - all of which the ATSAMD51J20A-MFT delivers. The Timer/Counter for Control (TCC) peripherals generate complementary 3-phase PWM with programmable dead-time insertion and hardware fault shutoff, while the Event System routes PWM-edge triggers directly to ADC conversions, eliminating jitter. The Cortex-M4F FPU executes FOC math in single-precision floating point without software penalty, achieving control-loop rates above 20 kHz. The CAN-FD peripheral supports CANopen or CiA 402 motion profiles for multi-axis industrial drives. Compared with a discrete DSP + gate driver solution, this single-chip approach simplifies firmware and reduces BOM cost for sub-1 kW motor drives.
추천
Human-Machine Interface (HMI) with TFT Display
The ATSAMD51J20A-MFT drives small to medium-size TFT HMI panels in appliances, industrial controls, and consumer products. It includes an on-chip TFT display controller (PCK2/HSSLINK2/SERCOM-based) and an integrated 2D graphics peripheral (GFX) that accelerates block transfers and alpha blending. The 256 KB SRAM is sufficient for a 320x240 RGB565 framebuffer plus compressed asset storage in 1 MB Flash. The Cortex-M4F runs LVGL or Microchip's Legato graphics library at 60 fps with smoothing. The 64-QFN footprint keeps the mainboard compact, and the on-chip HS USB provides the field-update channel for new HMI languages and graphics assets without external ISP hardware.
추천
Building Automation Gateway
Building automation gateways aggregate HVAC, lighting, and security sensors into a single point-of-presence on the network. The ATSAMD51J20A-MFT provides enough performance to run BACnet/Modbus/Thread stacks concurrently, while its CAN-FD interface supports BACnet MS/TP over twisted-pair wiring. The SERCOM ports connect to RS-485 transceivers for legacy Modbus RTU equipment, and the HS USB port can host a Wi-Fi or NB-IoT dongle for cloud uplink. The dual-panel Flash and TrustZone-like Secure Boot (via BOOTPROT fuse) make OTA updates safe across thousands of deployed units. Compared with a Linux-on-Raspberry-Pi approach, this 64-QFN solution reduces cost and power while keeping deterministic real-time response.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMD51J20A-MFT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMD51J20A-MUT | ATSAME51J19A-MFT | ATSAMD51G19A-MFT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash | 1 MB (dual-panel, ECC) | 1 MB (dual-panel, ECC) | 1 MB (dual-panel, ECC) | 512 KB (dual-panel, ECC) |
| SRAM | 256 KB (ECC) | 256 KB (ECC) | 256 KB (ECC) | 192 KB (ECC) |
| USB | HS USB 2.0 with PHY | HS USB 2.0 with PHY | Ethernet MAC (no USB) | FS USB 2.0 |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C |
| Price (qty-1, USD, as of 2026-09-21) | 7.85 | 7.50 | 8.10 | 6.80 |
주요 차별점
- Dual-panel Flash with ECC for OTA-capable in-field firmware updates (vs ATSAME51J19A-MFT)
- Integrated High-Speed USB 2.0 PHY (no external transceiver) (vs ATSAMD21J18A-MFT)
- HS USB + CAN-FD in a single MCU (vs ATSAMD51G19A-MFT)
설계 노트
The 64-QFN (9x9 mm) package relies on the exposed thermal pad for heat dissipation. According to the SAM D51 datasheet, thermal resistance (theta_JA) is approximately 31 C/W when the exposed pad is soldered to at least 25 mm^2 of 1 oz copper. If running at full 120 MHz across all peripherals in a sealed enclosure, the designer must either reduce clock speed during peak activity or provide adequate copper pour. For enclosed industrial designs, an additional copper layer on the top side connected to the pad with thermal vias is recommended. The maximum junction temperature of 125C must be respected under extended-temperature operation.
Place 100 nF ceramic decoupling capacitors on every VDDIO/VDDIN pin, located within 2 mm of the pad. Add a single 4.7 uF bulk capacitor on each power rail, and a 1 uF capacitor on the DECOUPLE pin (internal regulator). For USB applications, route DP/DM as a 90 ohm differential pair with controlled impedance, keeping the pair length-matched within 150 mil. The exposed thermal pad requires an array of 4x4 thermal vias (0.3 mm drill) connecting top-layer copper to the inner ground plane for both thermal and electrical grounding.
Common pitfalls when designing with the ATSAMD51J20A-MFT include: (1) Forgetting to enable the HS USB clock in the GCLK peripheral before configuring USB - the chip silently fails enumeration; (2) leaving the BOOTPROT fuse at default, which permits bootloader overwrite and breaks secure OTA updates; (3) attempting to drive HS USB without checking the 3.3 V supply ramp rate - USB compliance fails below 0.5 V/us; (4) exceeding 16 mA per GPIO on source/sink for more than 100 hours cumulative without derating; (5) using software-based Servicing of the Flash controller while interrupts are disabled, which can cause missed interrupt latency. Always read the SAM D51 errata (DS80000797) before finalizing firmware.
The HS USB 2.0 differential pair (DP/DM) requires 90 ohm differential impedance with 45 ohm common-mode return path. Differential skew must be held below 50 mil (1.27 mm) for compliance. For high-speed SERCOM SPI buses above 50 MHz, add 22-33 ohm series-termination resistors at the source to dampen reflections. The SD card interface signals (SDCK, SDCMD, SDDAT) require 50 ohm single-ended impedance and series terminators when routing over 50 mm. Shield flexing of long traces for SDIO must be avoided; use serpentine routing only on matching delay lines, not on data lines.
Power sequencing: VDDIO must reach 0.7 V before VDDIN exceeds 0.4 V to avoid latch-up. If separate supplies are used, add a Schottky diode (BSS138 or similar) from VDDIO to VDDIN to enforce sequencing. The core logic draws approximately 4 mA/MHz at 1.2 V (DECOUPLE pin); for battery-powered designs, leverage the BACKUP sleep mode (1.5 uA with RTC running) and STANDBY mode (50 uA) to meet energy budgets. The VBAT input accepts 0.9 V to 3.6 V for RTC retention, ideal for coin-cell or super-cap backup.
규정 준수 정보
RoHS compliant per Microchip product page. AEC-Q100 qualification is available only on the SAM V71 automotive family (ATSAMV71Q20B-AABT); the SAMD51 is industrial/consumer grade. Lead-free reflow to JEDEC J-STD-020 is supported up to peak 260C.
