ATSAME51J19A-MU-EFP - 120MHz ARM Cortex-M4F MCU, 512KB Flash | Microchip
부품 번호: ATSAME51J19A-MU-EFP ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.45 | $7.45 |
| 10 | $6.8 | $68.00 |
| 100 | $6.05 | $605.00 |
| 500 | $5.4 | $2,700.00 |
| 1,000 | $4.85 | $4,850.00 |
ATSAME51J19A-MU-EFP 개요
A microcontroller (MCU) is a single-chip processor integrating CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals (timers, communication controllers, ADCs). The Cortex-M4F core is one tier above the Cortex-M0/M3 in ARM's embedded hierarchy (Cortex-M0 -> Cortex-M3 -> Cortex-M4F -> Cortex-M7), adding DSP extensions and hardware FPU for floating-point math. The SAM E5x series further augments the core with Microchip-specific peripherals such as the SERCOM (Serial Communication) interface, TCC (Timer/Counter for Control), and the Event System for inter-peripheral signaling without CPU intervention.
Key features of the ATSAME51J19A-MU-EFP include full-speed USB 2.0 with integrated PHY, CAN-FD, and SD/MMC host interfaces. The device provides advanced analog peripherals such as a 12-bit ADC (up to 1 MSPS), a 10-bit DAC, and multiple analog comparators. Integrated security features include a True Random Number Generator (TRNG), secure boot, and hardware cryptographic accelerators (AES, SHA). The Extended Flash Performance (EFP) suffix denotes a 5V-tolerant I/O variant suitable for industrial 24V systems via external translation.
The Cortex-M4F core executes the Thumb-2 instruction set, delivering 1.25 DMIPS/MHz (Dhrystone 2.1) and a single-cycle MAC for DSP workloads. The 120 MHz clock provides 150 DMIPS of integer performance plus IEEE 754 single-precision floating point. The dual-panel flash architecture enables in-application programming without blocking execution, with ECC ensuring reliable operation in electrically noisy industrial environments.
Typical applications include industrial PLCs, motor control (BLDC and PMSM FOC), building automation gateways, smart energy metering, IoT edge nodes with secure cloud connectivity, and human-machine interface (HMI) controllers. The integrated CAN-FD and USB make it suitable for automotive body and infotainment ECUs in non-safety-critical subsystems.
When designing with this device, place decoupling capacitors (100 nF + 1 µF) within 2 mm of each VDD pin and route the exposed pad (EP) to a continuous ground plane for thermal dissipation. Use MPLAB X IDE with the MPLAB Harmony framework for rapid firmware development, and verify the Extended Flash Performance (EFP) variant matches your I/O voltage requirements before PCB fabrication.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the standalone manufacturer datasheet, giving engineers a one-stop reference for sourcing and design-in decisions.
드롭인 대체품: ATSAME51J19A-MU-EFP — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME51J19A-MU-EFP (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core, SRAM, Operating Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMD51J19A-MU-EFP
✅ 드롭인✓ 재고 있음
$6.1 / 개
데이터시트 보기 →ATSAME51J20A-MF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAME51G19A-MU-EFP
✅ 드롭인✓ 재고 있음
$5.2 / 개
데이터시트 보기 →ATSAME51J19A-MU
✅ 드롭인✓ 재고 있음
$4.65 / 개
데이터시트 보기 →ATSAME51J18A-MFT
✅ 드롭인✓ 재고 있음
$4.15 / 개
ATSAMD51J20A-MFT
✅ 드롭인✓ 재고 있음
$5.1 / 개
데이터시트 보기 →ATSAME51J19A-MU-EFP 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-M4F |
| 최대 클록 주파수 | 120 MHz |
| FPU | Yes (single-precision IEEE 754) |
| DSP Extensions | Yes (single-cycle MAC) |
| Program Memory (Flash) | 512 KB (Dual Panel with ECC) |
| Operating Voltage | 3.3 V (typical) |
| 패키지 | 64-VQFN (9x9 mm) with Exposed Pad |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| USB Interface | USB 2.0 Full-Speed with integrated PHY |
| CAN Interface | CAN-FD |
| ADC | 12-bit (1 MSPS capability per datasheet family) |
| Security Features | TRNG, secure boot, AES, SHA accelerators |
| RoHS 상태 | Compliant |
ATSAME51J19A-MU-EFP 64-vqfn (9x9 mm) with exposed pad 핀 구성 가이드
ATSAME51J19A-MU-EFP(64-vqfn (9x9 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAME51J19A-MU-EFP.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAME51J19A-MU-EFP 적합 용도: 6 애플리케이션s: Industrial Motor Control (BLDC/PMSM), IoT Edge Nodes with Secure Cloud Connectivity, Building Automation Gateways, Smart Energy Metering, Human-Machine Interface (HMI) Controllers, Automotive Body and Comfort ECUs.
Industrial Motor Control (BLDC/PMSM)
The ATSAME51J19A-MU-EFP's 120 MHz Cortex-M4F core with single-precision FPU accelerates Park and Clarke transforms required for field-oriented control (FOC) of 3-phase BLDC and PMSM motors. Its TCC (Timer/Counter for Control) peripherals provide complementary PWM outputs with programmable dead-time insertion and hardware fault shutdown, critical for safely driving half-bridge power stages at 20+ kHz switching frequencies. The 512 KB Flash accommodates sinusoidal modulation tables, MTPA (maximum torque per ampere) lookup curves, and adaptive control firmware, while the integrated CAN-FD interface enables real-time communication with supervisory PLCs over industrial networks.
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IoT Edge Nodes with Secure Cloud Connectivity
The ATSAME51J19A-MU-EFP targets IoT edge nodes that require hardware-rooted security and deterministic real-time response. Its hardware AES-128/256 and SHA-2 accelerators enable TLS 1.3 handshake acceleration for MQTT or HTTPS cloud connections without burdening the CPU. The True Random Number Generator (TRNG) seeds cryptographic keys securely, while secure boot prevents unauthorized firmware execution. The full-speed USB 2.0 with integrated PHY simplifies gateway design, and the Cortex-M4F core runs FreeRTOS with TCP/IP stacks plus sensor aggregation tasks at 120 MHz with ample headroom for OTA update staging in the 512 KB Flash.
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Building Automation Gateways
Building automation gateways consolidate multiple fieldbus protocols (BACnet, Modbus, KNX) into a single supervisory node, and the ATSAME51J19A-MU-EFP's peripheral mix addresses this directly. Its multiple SERCOM (Serial Communication) interfaces can be configured as UART, SPI, or I2C to bridge Modbus RTU sensors, SPI-based display controllers, and I2C temperature/humidity sensors concurrently. The CAN-FD controller connects to HVAC and elevator subsystems, while the 12-bit ADC reads analog sensors such as 4-20 mA current loops. The industrial -EFP (Extended Flash Performance) variant tolerates 5V I/O signals common in legacy building automation wiring, simplifying PCB design.
추천
Smart Energy Metering
Smart electricity meters require deterministic sampling of voltage and current waveforms at 4 kHz or higher for accurate active/reactive power calculation. The ATSAME51J19A-MU-EFP's Cortex-M4F DSP extensions deliver single-cycle MAC operations ideal for FFT-based harmonic analysis, while its 12-bit ADC captures power-line waveforms with sufficient resolution for Class 0.5 metering accuracy. The hardware AES accelerator secures DLMS/COSEM communication with utility head-end systems. The 512 KB Flash stores calibration coefficients, tariff schedules, and rolling 90-day load profile data, while ECC-protected Flash ensures meter data integrity in electrically noisy distribution panel environments.
추천
Human-Machine Interface (HMI) Controllers
Industrial HMI panels require a responsive MCU to drive TFT LCDs, scan touch panels, and process user input events. The ATSAME51J19A-MU-EFP drives displays through its SPI/QSPI interfaces (up to 60 MHz) and parallel port, while its SERCOM controllers manage capacitive touch controllers over I2C. The Cortex-M4F at 120 MHz provides enough processing headroom to render LVGL or emWin graphics at 30+ FPS with partial screen updates. The integrated USB 2.0 Full-Speed supports firmware updates from USB flash drives, and the 512 KB Flash accommodates graphical assets plus Modbus/BACnet stack libraries for HMI-to-PLC communication.
추천
Automotive Body and Comfort ECUs
The ATSAME51J19A-MU-EFP suits non-safety-critical automotive body electronics such as HVAC control modules, seat controllers, mirror adjusters, and lighting controllers. Its CAN-FD controller connects to the vehicle body network at 2 Mbps, while LIN support (via SERCOM-configured UART) addresses simple actuator nodes. The Cortex-M4F with FPU handles multi-axis motor control for headlight leveling or seat positioning. For automotive applications, Microchip recommends the AEC-Q100 qualified ATSAME51J19A-AUT-EFP variant instead of the standard part. Both share the same 64-VQFN footprint, allowing PCB reuse between non-automotive and automotive SKUs.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME51J19A-MU-EFP — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMD51J19A-MU-EFP | ATSAME51J20A-MF | ATSAME51G19A-MU-EFP | ATSAME51J19A-MU | ATSAME51J18A-MFT | ATSAMD51J20A-MFT |
|---|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F |
| Maximum Clock Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 512 KB | 512 KB | 1024 KB | 512 KB | 512 KB | 256 KB | 1024 KB |
| USB Interface | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY |
| CAN Interface | CAN-FD | CAN-FD | CAN-FD | CAN-FD | CAN-FD | CAN-FD | CAN-FD |
| EFP Industrial I/O Variant | Yes (EFP suffix) | Yes (EFP suffix) | No | Yes (EFP suffix) | No | No | No |
| Packaging | Tray | Tray | Tray | Tray | Tray | Tape & Reel | Tape & Reel |
주요 차별점
- Extended Flash Performance (EFP) for industrial 5V-tolerant I/O (vs ATSAME51J19A-MU)
- Same-family Flash upgrade path within identical footprint (vs ATSAME51J18A-MFT)
- SAM E5x family with hardware cryptographic accelerators (vs ATSAMDA1J16B-MBT)
설계 노트
The ATSAME51J19A-MU-EFP integrates multiple power domains: VDDIN (3.3 V core), VDDIO (I/O), and VDDANA (analog). Decouple each VDDIO pin with a 100 nF X7R ceramic capacitor placed within 2 mm, and add a bulk 4.7 µF capacitor near the regulator output. The VDDANA rail should use a ferrite bead or separate LDO from VDDIN to isolate ADC sampling from digital switching noise. According to Microchip SAM E5x hardware design guidelines, the exposed pad (EP) must be soldered to a continuous ground plane to provide thermal dissipation and electrical reference.
Route the Cortex-M4F's 120 MHz system clock traces on an inner layer with controlled impedance (50 Ω single-ended) and keep crystal traces shorter than 5 mm with ground shielding on both sides. The USB DP/DM differential pair requires 90 Ω differential impedance with length matching within 2 mm, and route adjacent to a continuous ground plane for impedance reference. Place the 12-bit ADC analog traces away from digital switching signals; if crossing is unavoidable, route at 90 degrees to minimize capacitive coupling. The CAN-FD TX/RX lines need common-mode choke for automotive bus applications.
The -EFP (Extended Flash Performance) suffix denotes industrial 5V-tolerant I/O, but the absolute maximum VDDIO is 5.5 V; operation above 3.6 V requires the EFP variant and reduces Flash endurance to 25k cycles versus 100k for standard parts. The secure boot feature locks the device after provisioning - keep the public key backup accessible before locking, as locked devices cannot be re-provisioned without external NVM key storage. The dual-panel Flash enables OTA updates, but firmware must explicitly call the appropriate BOOTPROT and NVMCTRL auxiliary commands before reprogramming.
Estimated: At 120 MHz active operation with all peripherals enabled and 3.3 V supply, the ATSAME51J19A-MU-EFP core power dissipation is approximately 60-80 mW. The 64-VQFN package's θJA of approximately 28 C/W on a 4-layer JEDEC test board yields a junction temperature rise of 2-3 C above ambient - well within the industrial -40 to +85 C or extended -40 to +125 C operating range. For high-temperature enclosures (>60 C ambient), verify with a thermal probe rather than relying on package ratings alone.
규정 준수 정보
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose ATSAME51J19A-AUT-EFP for automotive. Conflict minerals compliant per Microchip CMRT filings.
