ATSAME53J18A-AUT - 120MHz Cortex-M4F 256KB Flash MCU | Microchip
부품 번호: ATSAME53J18A-AUT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.37 | $6.37 |
| 10 | $5.78 | $57.80 |
| 100 | $5.21 | $521.00 |
| 500 | $4.63 | $2,315.00 |
| 1,000 | $4.12 | $4,120.00 |
ATSAME53J18A-AUT 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash for code, SRAM for data), and a rich set of peripherals on one die. The ARM Cortex-M4F is a mainstream 32-bit MCU core featuring a single-precision IEEE 754 FPU, DSP extensions, and deterministic interrupt handling, making it a workhorse for connected embedded products. The SAM E53 line sits above Cortex-M0+/M23 entry-level parts but below Cortex-M7 high-performance parts, occupying the mid-to-high end of Microchip's SAM portfolio alongside the SAM D51 and SAM E54 cousins.
Key features include 120 MHz CPU core speed, 256 KB Flash with ECC, 128 KB SRAM with ECC, 24-channel 12-bit ADC, two 12-bit DAC outputs, a 10/100 Ethernet MAC, a USB 2.0 Full-Speed device/host controller, multiple SERCOM interfaces (configurable as UART/SPI/I2C), and an integrated 32 kHz low-power RTC. The 64-pin TQFP package gives broad GPIO access for a wide variety of analog and digital peripherals while remaining hand-solderable for prototyping.
Architecturally, the SAM E53 combines a Cortex-M4F core with a multi-layer AHB/APB bus matrix that allows simultaneous DMA-driven peripheral activity (Ethernet, USB, ADC) without CPU intervention, plus an EVENT system for low-latency inter-peripheral signaling. The integrated FPU and DSP instructions allow the same firmware to perform audio decoding, sensor fusion, or motor control loops in a single MCU, eliminating external DSP chips.
Typical applications include industrial Ethernet gateways, building automation controllers, USB Human Interface Devices (HIDs), audio playback and processing modules, and connected sensor hubs. The integrated Ethernet MAC makes it especially attractive for IoT edge nodes that must bridge a local sensor bus to a TCP/IP network without an external PHY companion.
When laying out the ATSAME53J18A-AUT, place the 0.1 µF decoupling capacitors within five V of every VDD/VDDIO pin pair and route the USB D+/D- traces as a 90-ohm differential pair. Enable the on-chip voltage regulator with the recommended 1 µF + 100 nF bulk cap on VDDOUT to avoid LDO startup issues.
This page synthesizes distributor stock and pricing, drop-in pin-compatible alternatives within the SAM E53 family, and practical layout guidance not aggregated in the bare datasheet, giving procurement and design engineers a single decision-ready view.
드롭인 대체품: ATSAME53J18A-AUT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME53J18A-AUT (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, ADC, SRAM, Core Architecture, CAN.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAME53J19A-AUT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAME53J20A-AUT
✅ 드롭인✓ 재고 있음
$5.72 / 개
데이터시트 보기 →ATSAME51J18A-AUT
✅ 드롭인✓ 재고 있음
$4.65 / 개
데이터시트 보기 →ATSAME53J18A-AU
✅ 드롭인✓ 재고 있음
$4.66 / 개
데이터시트 보기 →ATSAME53J18A-AUT-EFP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAME53J18A-AUT 최대 정격 & 전기적 특성
| Core | ARM Cortex-M4F with single-precision FPU |
| Maximum CPU Clock | 120 MHz |
| Flash Memory | 256 KB with ECC |
| SRAM | 128 KB with ECC |
| Operating Voltage (VDD) | 1.71 V to 3.6 V |
| 동작 온도 | -40 C to +85 C (TA) |
| ADC | 24 channels, 12-bit resolution |
| DAC | 2 channels, 12-bit resolution |
| Ethernet MAC | 10/100 Mbps IEEE 802.3 (MII/RMII, external PHY required) |
| USB | USB 2.0 Full-Speed Device/Host |
| SERCOM (UART/SPI/I2C) | Configurable SERCOM interfaces |
| 패키지 | 64-pin TQFP (10x10 mm) |
| 실장 유형 | Surface Mount |
| Pitch | 0.5 mm |
| Program Memory Type | FLASH |
| Core Size | 32-Bit Single-Core |
| Oscillator Type | Internal (with external crystal support) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Supply Configuration | Single supply with internal LDO regulator |
ATSAME53J18A-AUT 핀 구성
| 핀 1 | PA00 — General-purpose I/O, ADC AIN0, XIN32 |
| 핀 2 | PA01 — General-purpose I/O, ADC AIN1, XOUT32 |
| 핀 3 | PA02 — General-purpose I/O, ADC AIN2 |
| 핀 4 | PA03 — General-purpose I/O, ADC AIN3 |
| 핀 5 | PA04 — General-purpose I/O, ADC AIN4, VREFA |
| 핀 6 | PA05 — General-purpose I/O, ADC AIN5 |
| 핀 7 | PA06 — General-purpose I/O, ADC AIN6 |
| 핀 8 | PA07 — General-purpose I/O, ADC AIN7 |
| 핀 9 | VDDIO — I/O supply voltage |
| 핀 10 | GND — Ground |
| 핀 11 | PA08 — General-purpose I/O, NMI |
| 핀 12 | PA09 — General-purpose I/O, USB VBUS sense |
| 핀 13 | PA10 — General-purpose I/O, USB DM |
| 핀 14 | PA11 — General-purpose I/O, USB DP |
| 핀 15 | VDDIO — I/O supply voltage |
| 핀 16 | GND — Ground |
| 핀 17 | PA12 — General-purpose I/O |
| 핀 18 | PA13 — General-purpose I/O |
| 핀 19 | PA14 — General-purpose I/O |
| 핀 20 | PA15 — General-purpose I/O |
| 핀 21 | PA16 — General-purpose I/O |
| 핀 22 | PA17 — General-purpose I/O |
| 핀 23 | PA18 — General-purpose I/O |
| 핀 24 | PA19 — General-purpose I/O |
| 핀 25 | VDDIO — I/O supply voltage |
| 핀 26 | GND — Ground |
| 핀 27 | PB00 — General-purpose I/O |
| 핀 28 | PB01 — General-purpose I/O |
| 핀 29 | PB02 — General-purpose I/O, ADC AIN14 |
| 핀 30 | PB03 — General-purpose I/O, ADC AIN15 |
| 핀 31 | PA20 — General-purpose I/O |
| 핀 32 | PA21 — General-purpose I/O |
| 핀 33 | PA22 — General-purpose I/O |
| 핀 34 | PA23 — General-purpose I/O |
| 핀 35 | PA24 — General-purpose I/O, USB ID |
| 핀 36 | PA25 — General-purpose I/O |
| 핀 37 | VDDIO — I/O supply voltage |
| 핀 38 | GND — Ground |
| 핀 39 | PB04 — General-purpose I/O |
| 핀 40 | PB05 — General-purpose I/O |
| 핀 41 | PB06 — General-purpose I/O |
| 핀 42 | PB07 — General-purpose I/O |
| 핀 43 | PB08 — General-purpose I/O |
| 핀 44 | PB09 — General-purpose I/O |
| 핀 45 | PA26 — General-purpose I/O |
| 핀 46 | PA27 — General-purpose I/O |
| 핀 47 | PA28 — General-purpose I/O |
| 핀 48 | PA29 — General-purpose I/O |
| 핀 49 | PA30 — General-purpose I/O |
| 핀 50 | PA31 — General-purpose I/O |
| 핀 51 | VDDOUT — Core LDO output (1.2 V dec) |
| 핀 52 | VDD — Main supply voltage |
| 핀 53 | GND — Ground |
| 핀 54 | NRST — Reset input (active low) |
| 핀 55 | PB10 — General-purpose I/O |
| 핀 56 | PB11 — General-purpose I/O |
| 핀 57 | PB12 — General-purpose I/O |
| 핀 58 | PB13 — General-purpose I/O |
| 핀 59 | PB14 — General-purpose I/O, XIN |
| 핀 60 | PB15 — General-purpose I/O, XOUT |
| 핀 61 | PB16 — General-purpose I/O |
| 핀 62 | PB17 — General-purpose I/O |
| 핀 63 | GND — Ground |
| 핀 64 | VDDIO — I/O supply voltage |
일반적인 애플리케이션
ATSAME53J18A-AUT 적합 용도: 6 애플리케이션s: Industrial Ethernet Gateway, Building Automation Controller, USB Human Interface Device (HID), Audio Playback Module, Connected Sensor Hub, Motor Control and BLDC Drive.
Industrial Ethernet Gateway
Why ATSAME53J18A-AUT fits: The integrated 10/100 Ethernet MAC with MII/RMII to an external PHY such as the KSZ8081RNAIA lets the SAM E53 act as an industrial protocol converter (Modbus TCP, EtherNet/IP, PROFINET-ready) without offloading to a companion network processor. How it is used + trade-off: Bridge between a local RS-485/Modbus RTU bus on SERCOM and a TCP/IP network; the Cortex-M4F at 120 MHz handles TCP/IP stack and protocol translation while DMA keeps Ethernet frames moving without CPU stalls, trading lower BOM cost (no companion MCU) for the cost of an external PHY.
추천
Building Automation Controller
Why ATSAME53J18A-AUT fits: Building automation controllers need a mix of serial buses (RS-485, UART, SPI sensors) and network connectivity. The SAM E53's configurable SERCOMs map to UART, SPI, and I2C, while the Ethernet MAC and USB 2.0 FS support BACnet/IP or KNX/IP gateways on a single MCU. How it is used + trade-off: Drive KNX or BACnet MS-TP over RS-485 plus a 7-inch HMI via SPI display, with USB for field commissioning; the integrated 12-bit ADC scans analog sensor channels in parallel via DMA, trading software complexity for hardware consolidation.
추천
USB Human Interface Device (HID)
Why ATSAME53J18A-AUT fits: The USB 2.0 Full-Speed controller with on-chip PHY and the Cortex-M4F DSP extensions support HID-class firmware (keyboards, mice, control surfaces, custom input devices) and DSP-style signal processing. The 256 KB Flash is plenty for HID stacks plus vendor logic. How it is used + trade-off: Implement a USB HID composite device with DSP-filtered capacitive touch input over I2C; the Cortex-M4F DSP instructions run touch algorithms in well under 1 ms, trading USB FS bandwidth (12 Mbps) for simpler certification vs USB HS.
추천
Audio Playback Module
Why ATSAME53J18A-AUT fits: The Cortex-M4F with FPU and DSP extensions decodes MP3, AAC, or ADPCM audio in firmware, while the two 12-bit DAC outputs drive headphone amplifiers or class-D amplifier enable pins. USB host mode plus SD card SERCOM allows direct playback from external storage. How it is used + trade-off: Drive a TFA9879A class-D amp over I2C while streaming 16-bit/44.1 kHz audio from USB MSC; the Cortex-M4F DSP cores handle MP3 decode at modest CPU load, trading external DSP chip cost for careful real-time audio task scheduling.
추천
Connected Sensor Hub
Why ATSAME53J18A-AUT fits: Sensor hubs aggregate data from SPI/I2C sensors and forward it over Ethernet or USB to a host. The SAM E53's multiple SERCOMs (UART/SPI/I2C) plus 12-bit ADC read 5-10 sensors simultaneously, while the Ethernet MAC uplinks to a TCP/IP server. How it is used + trade-off: Poll temperature, humidity, and pressure sensors over I2C; forward via Ethernet in MQTT or HTTP; the Cortex-M4F at 120 MHz runs TLS handshakes in 200-400 ms, trading flash consumption (256 KB) for the benefit of no cloud-side broker reconfiguration.
추천
Motor Control and BLDC Drive
Why ATSAME53J18A-AUT fits: The Cortex-M4F DSP extensions compute FOC (field-oriented control) loops in firmware, while the 64-pin TQFP exposes PWM outputs for three-phase drives. The 120 MHz core closes current loops at 20-50 kHz, well above the audible range. How it is used + trade-off: Drive a 24V BLDC via TC PWM + external gate drivers; the SAM E53 handles Hall-sensor or back-EMF feedback while the integrated ADC samples phase currents, trading software complexity for tighter torque control versus trapezoidal commutation.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME53J18A-AUT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAME53J19A-AUT | ATSAME53J20A-AUT | ATSAME51J18A-AUT | ATSAME53J18A-AU | ATSAME53J18A-AUT-EFP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (10x10 mm) | 64-pin TQFP (10x10 mm) | 64-pin TQFP (10x10 mm) | 64-pin TQFP (10x10 mm) | 64-pin TQFP (10x10 mm) | 64-pin TQFP (10x10 mm) |
| Core | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F |
| Max Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 256 KB | 256 KB | 1 MB | 256 KB | 256 KB | 256 KB |
| SRAM | 128 KB | 144 KB | 256 KB | 128 KB | 128 KB | 128 KB |
| Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | No | Yes (10/100) | Yes (10/100) |
| USB | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | No | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host |
| ADC Channels | 24 x 12-bit | 24 x 12-bit | 24 x 12-bit | 24 x 12-bit | 24 x 12-bit | 24 x 12-bit |
주요 차별점
- Integrated 10/100 Ethernet MAC versus SAM S51 line (vs ATSAME51J18A-AUT)
- Cortex-M4F with FPU and DSP extensions (vs ATSAME51J18A-AUT)
- Dual ECC on Flash and SRAM (vs ATSAM3X8C)
설계 노트
Estimated: Decoupling the ATSAME53J18A-AUT requires at minimum a 1 µF + 100 nF capacitor pair on every VDDIO pin and a 4.7 µF + 100 nF pair on VDD and VDDOUT; place the 100 nF caps within 2-3 mm of each VDDIO pin and the 1 µF within 5 mm. The internal 1.2 V core LDO draws up to 50 mA at 120 MHz and needs the bulk cap on VDDOUT to avoid soft-start failures.
USB design: route the USB DP/DM pair as a 90-ohm differential pair with no stubs; keep the pair length matched within 150 mils, and place the ESD protection diode within 5 mm of the USB connector. Avoid routing any digital signal within 4 mm of the differential pair to meet USB 2.0 FS spec compliance, per the SAM E53 hardware design guide.
Bootloader pitfall: the SAM E53 default firmware runs the FUSE bits configured for the 4 KB bootloader at 0x00000000; if you need the entire 256 KB Flash for application code, reflash the BOOTPROT and BOOTLOADER fuses via the SAME54/53 NVM USER ROW or the existing bootloader will lock the lower 4 KB. Always confirm fuse settings with MPLAB X before JTAG programming.
Estimated: At 120 MHz with all peripherals active, the SAM E53 draws approximately 80 mA from VDD, dissipating about 240 mW at 3.3 V. The 64-pin TQFP package has a theta_JA of approximately 38 C/W on a 4-layer JEDEC PCB, giving a junction temperature rise of about 9 C - well within the 85 C industrial grade limit for industrial designs without extra heatsinking.
규정 준수 정보
RoHS and REACH compliant per Microchip product environmental certifications. Industrial temperature grade -40C to +85C; AEC-Q100 qualification available on the SAME53A automotive variant, not on the J18A industrial part.
