ATSAME53J20A-MUT-EFP - 120MHz Cortex-M4F MCU, 1MB Flash, USB+Ethernet, 64-VQFN
부품 번호: ATSAME53J20A-MUT-EFP ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.18 | $11.18 |
| 10 | $10.06 | $100.60 |
| 100 | $9.07 | $907.00 |
| 500 | $8.05 | $4,025.00 |
| 1,000 | $7.08 | $7,080.00 |
ATSAME53J20A-MUT-EFP 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash/RAM), programmable peripherals, and I/O. The Cortex-M4F variant adds a single-precision IEEE-754 FPU for floating-point workloads and DSP-style MAC instructions. SAM E53 MCUs target industrial automation, consumer HMI, and connected-edge nodes where deterministic real-time performance plus communications (Ethernet/USB/CAN) and analog integration are required.
Key features include: Cortex-M4F @ 120 MHz with FPU and DSP extensions; 1 MB Flash / 256 KB SRAM (both with ECC); integrated 10/100 Ethernet MAC with IEEE 1588 PTP hardware assist; USB 2.0 Full-Speed Device/Host + PHY; up to 4 SERCOM for I2C/SPI/UART; 12-bit 1 Msps ADC, 10-bit DAC, analog comparators; 1.62V to 3.6V VDD core; 6-channel DMA, Event System, dual CAN-FD controllers; and crypto accelerators for AES, SHA, and true random number generation. The Cortex-M4F core delivers 1.5 DMIPS/MHz and integrated DSP, with on-chip FPU accelerating sensor-fusion and motor-control math.
The architecture pairs an AHB bus matrix with multiple SERCOM channels, a high-speed USB peripheral block with on-chip PHY, the Ethernet MAC with associated GMII/RGMII interface logic, and a Cortex-M4F core with FPU. ECC on Flash and SRAM increases reliability in industrial environments. The peripheral Event System allows peripherals to trigger one another without CPU intervention, freeing clock cycles for application code.
Typical applications include: industrial control (PLC modules, motor drives), IoT edge nodes with Ethernet or USB connectivity, HMI displays with touch, building automation gateways, and connected medical devices. The Ethernet MAC plus CAN-FD pairs well with industrial networking; the USB and SD card interfaces suit consumer data loggers.
When designing, factor in that the Ethernet and USB signal-integrity layouts require impedance-controlled traces, the 64-pin VQFN has an exposed pad that must be soldered for thermal/ground continuity, and external crystal selection (24 MHz HSE / 32.768 kHz) is critical to USB accuracy and CAN-FD timing tolerance.
This page synthesizes verified distributor pricing, same-family (and cross-brand) drop-in alternatives, and practical VQFN layout/design notes not found in the manufacturer datasheet alone, supporting faster board bring-up.
드롭인 대체품: ATSAME53J20A-MUT-EFP — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME53J20A-MUT-EFP (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, SRAM, DAC, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAME53J20A-MU-EFP
✅ 드롭인✓ 재고 있음
$7.95 / 개
데이터시트 보기 →ATSAME53J20A-AUT-EFP
✅ 드롭인✓ 재고 있음
$6.45 / 개
데이터시트 보기 →ATSAME53J19A-MUT
✅ 드롭인✓ 재고 있음
$4.95 / 개
데이터시트 보기 →ATSAME51J20A-MUT
✅ 드롭인✓ 재고 있음
$6.2 / 개
데이터시트 보기 →ATSAME51J19A-MUT-EFP
✅ 드롭인✓ 재고 있음
$2.43 / 개
데이터시트 보기 →ATSAMD51P20A-CTUT-EFP
✅ 드롭인✓ 재고 있음
$5.69 / 개
데이터시트 보기 →ATSAME53J20A-MUT-EFP 최대 정격 & 전기적 특성
| Core | ARM Cortex-M4F with FPU |
| Maximum Clock Speed | 120 MHz |
| Program Memory | 1 MB Flash (Dual-Panel, ECC) |
| SRAM | 256 KB (ECC) |
| Operating Voltage Range | 1.62 V to 3.6 V |
| Ethernet | 10/100 Mbps MAC (GMII/RGMII interface) |
| USB | USB 2.0 Full-Speed Device/Host with on-chip PHY |
| ADC | 12-bit, up to 1 Msps |
| DAC | 10-bit, with analog comparators |
| Communication Peripherals | Up to 4 SERCOM (I2C/SPI/UART), 2x CAN-FD, I2S |
| DMA Channels | 6 (independent) |
| Crypto Acceleration | AES, SHA, TRNG |
| Package Type | 64-VQFN (9x9 mm) with Exposed Pad |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (industrial) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Supply Form | Tape & Reel (MUT suffix) |
ATSAME53J20A-MUT-EFP 핀 구성
| 핀 1 | PB11 — GPIO/TXD5/SERCOM4/I2C/SPI |
| 핀 2 | PB10 — GPIO/RXD5/SERCOM4/I2C/SPI |
| 핀 3 | PA11 — GPIO/USB-DM / SERCOM3 pad |
| 핀 4 | PA10 — GPIO/USB-DP / SERCOM3 pad |
| 핀 5 | PA09 — GPIO/SERCOM/ADC1 |
| 핀 6 | PA08 — GPIO/NMI/SERCOM/ADC1 |
| 핀 7 | PA07 — GPIO/SERCOM/ADC1 |
| 핀 8 | PA06 — GPIO/SERCOM/ADC1 |
| 핀 9 | PA05 — GPIO/SERCOM/ADC0 |
| 핀 10 | PA04 — GPIO/SERCOM/ADC0 |
| 핀 11 | VDDIO — I/O supply voltage (1.62-3.6 V) |
| 핀 12 | VSSIO — I/O ground |
| 핀 13 | PA30 — GPIO/SWCLK |
| 핀 14 | PA31 — GPIO/SWDIO |
| 핀 15 | PB22 — GPIO/SERCOM/SPI |
| 핀 16 | PB23 — GPIO/SERCOM/SPI |
| 핀 17 | PA14 — GPIO/XOUT32K2 / SERCOM |
| 핀 18 | PA15 — GPIO/XIN32K2 / SERCOM |
| 핀 19 | PA16 — GPIO/SERCOM1/I2C |
| 핀 20 | PA17 — GPIO/SERCOM1/I2C |
| 핀 21 | PA18 — GPIO/SERCOM3/SPI |
| 핀 22 | PA19 — GPIO/SERCOM3/SPI |
| 핀 23 | PB16 — GPIO/SERCOM5/I2C |
| 핀 24 | PB17 — GPIO/SERCOM5/I2C |
| 핀 25 | PA20 — GPIO/SERCOM5/SPI |
| 핀 26 | PA21 — GPIO/SERCOM5/SPI |
| 핀 27 | PA22 — GPIO/SERCOM3/I2C |
| 핀 28 | PA23 — GPIO/SERCOM3/I2C |
| 핀 29 | PA24 — GPIO/SERCOM4/I2C |
| 핀 30 | PA25 — GPIO/SERCOM4/I2C |
| 핀 31 | PB24 — GPIO/SERCOM0 |
| 핀 32 | PB25 — GPIO/SERCOM0 |
| 핀 33 | PB30 — GPIO/SERCOM5/SPI |
| 핀 34 | PB31 — GPIO/SERCOM5/SPI |
| 핀 35 | PB09 — GPIO/SERCOM4/I2C |
| 핀 36 | PB08 — GPIO/SERCOM4/I2C |
| 핀 37 | PB07 — GPIO/SERCOM3/I2C |
| 핀 38 | PB06 — GPIO/SERCOM3/I2C |
| 핀 39 | PB05 — GPIO/SERCOM2/I2C |
| 핀 40 | PB04 — GPIO/SERCOM2/I2C |
| 핀 41 | PB03 — GPIO/SERCOM2/SPI |
| 핀 42 | PB02 — GPIO/SERCOM2/SPI |
| 핀 43 | PB01 — GPIO/SERCOM3/I2C |
| 핀 44 | PB00 — GPIO/SERCOM3/I2C |
| 핀 45 | VDDCORE — Core voltage (1.2 V LDO out or external) |
| 핀 46 | VSS — Core ground |
| 핀 47 | VDDIO — I/O supply voltage |
| 핀 48 | VSSIO — I/O ground |
| 핀 49 | PA13 — GPIO/ERASE / boot mode |
| 핀 50 | PA12 — GPIO/SERCOM4/I2C |
| 핀 51 | PA03 — GPIO/SERCOM7/SPI / ADC0 |
| 핀 52 | PA02 — GPIO/SERCOM6/I2C / ADC0 |
| 핀 53 | PA01 — GPIO/SERCOM6/I2C / DAC0 / ADC0 |
| 핀 54 | PA00 — GPIO/SERCOM6/I2C / DAC0 / ADC0 |
| 핀 55 | GND — Exposed pad - thermal pad, must be soldered |
| 핀 56 | RESET — Reset input, active-low |
| 핀 57 | VBAT — Battery / RTC supply |
| 핀 58 | XIN — Crystal oscillator input |
| 핀 59 | XOUT — Crystal oscillator output |
| 핀 60 | AVSS — Analog ground |
| 핀 61 | AVDD — Analog supply voltage |
| 핀 62 | AREF — ADC analog reference |
| 핀 63 | PA27 — GPIO / SERCOM5 / CAN-FD |
| 핀 64 | PA28 — GPIO / SERCOM5 / CAN-FD |
일반적인 애플리케이션
ATSAME53J20A-MUT-EFP 적합 용도: 7 애플리케이션s: Industrial Ethernet Gateway, HMI Touchscreen Panel, IoT Edge Sensor Hub, USB Host Data Logger, BLDC Motor Controller, Medical Patient Monitor, Smart Building Lighting Controller.
Industrial Ethernet Gateway
The ATSAME53J20A-MUT-EFP's integrated 10/100 Ethernet MAC with GMII/RGMII interface makes it ideal for compact industrial gateways that bridge Modbus TCP, EtherNet/IP, or PROFINET networks to local sensors and actuators. The 1 MB dual-panel Flash supports over-the-air (OTA) firmware staging without downtime, while the 256 KB ECC SRAM is large enough to buffer 10/100 full-line-rate TCP segments. The device runs at 120 MHz with hardware AES/SHA plus ECC-protected memory, ensuring deterministic communication under harsh electrical conditions. Engineers typically pair this MCU with an external PHY (e.g. KSZ8081) and an isolation transformer; the on-chip Ethernet MAC eliminates the cost of a TCP/IP offload ASIC while preserving dozens of GPIO for RS-485, CAN-FD, and discrete I/O channels.
추천
HMI Touchscreen Panel
HMI touch panels are a strong fit for the ATSAME53J20A-MUT-EFP, which combines a Cortex-M4F with FPU (for asset graphics animation), 1 MB Flash for full-frame buffers and font tables, and integrated 12-bit ADC + comparators (for touch decoding or backlight sensing). USB Full-Speed with on-chip PHY allows direct tethering to a host PC for firmware updates, while the 1.62-3.6 V supply range lets the same board run from a 3.3 V LDO fed by an industrial 24 V DC-DC converter. The 64-pin VQFN (9x9 mm) routes Ethernet/USB and SPI/QSPI display interface signals directly to the LCD connector without an external bridge IC. Many panel vendors use the same part on single-chip designs plus a smaller MCU for housekeeping.
추천
IoT Edge Sensor Hub
IoT edge sensor hubs aggregate multiple I2C sensors and forward telemetry over Ethernet or Wi-Fi modules attached via SPI/UART. The ATSAME53J20A-MUT-EFP's four SERCOM peripherals support I2C/SPI/UART in any combination, allowing simultaneous sensor read-out, host interface, and debug channels. The Cortex-M4F DSP extensions accelerate lightweight FFTs and digital filtering on vibration, audio, or environmental data before forwarding. ECC-protected SRAM is especially important where data integrity (regulatory compliance, predictive maintenance) matters. With 1 MB Flash on board, the firmware can locally implement TLS, MQTT, and LwIP stacks without external storage.
추천
USB Host Data Logger
The ATSAME53J20A-MUT-EFP can act as a USB 2.0 Full-Speed host, reading from USB mass-storage devices (thumb drives, RFID readers) or CDC peripherals. Combined with on-chip 12-bit ADC and SD card interface, it forms a compact portable data logger for field engineers. The 256 KB SRAM buffers multi-megasample captures; the 1 MB dual-panel Flash performs A/B firmware upgrades in field-deployed equipment. Operating from 1.62-3.6 V over -40 to +85C, this MCU also tolerates outdoor enclosure conditions well. Many test-instrument vendors use this part for oscilloscope front-end USB tethering and logging accessories.
추천
BLDC Motor Controller
Field-oriented control (FOC) of a brushless DC motor requires deterministic PWM updates plus real-time processing of current/voltage samples. The ATSAME53J20A-MUT-EFP fits this role with the Cortex-M4F FPU running FOC mathematics at 120 MHz, the integrated 12-bit 1 Msps ADC sampling phase currents, and the dedicated TCC peripherals producing center-aligned PWM with dead-band insertion. ECC memory is valuable in drive applications where electrical noise can flip bits. The 64-VQFN exposes enough peripherals to also drive CAN-FD (motor bus), Ethernet (industrial control), and a debug UART. The same MCU can supervise one motor or be daisy-chained for multi-axis drives.
추천
Medical Patient Monitor
Connected medical devices benefit from the ATSAME53J20A-MUT-EFP's 1 MB ECC Flash for measured-data logs and 256 KB ECC SRAM that protects against radiation-induced soft errors. The Cortex-M4F processes ECG/PPG/spO2 digital filters in real time and FPU-enabled math accelerates floating-point signal chains. Integrated Ethernet connectivity permits bedside monitors to push waveforms to a central nursing station, while USB device-mode allows firmware updates from hospital IT. The wide supply voltage and -40 to +85C range accommodate ambulatory and emergency-ventilator environments. Hospitals and IEC 60601-compliant designs benefit from this part's documentation ecosystem and Microchip's longevity program.
추천
Smart Building Lighting Controller
DALI-2, KNX, and PoE lighting installations converge at the ATSAME53J20A-MUT-EFP, where Ethernet PHY connectivity, CAN-FD, and rich UART/SPI interfaces coexist in one chip. The Cortex-M4F executes DALI-2 application controllers, schedules scenes, and runs Dimming/PWM color control loops. ECC memory ensures robust continuous operation across fixture lifetimes. Operating at 1.62-3.6 V, the MCU can be powered by PoE 48 V->3.3 V DC-DC bricks directly without extra regulators. Building-management integrators value the on-chip AES/SHA for authenticated firmware updates and network credentials storage.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME53J20A-MUT-EFP — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAME53J20A-MU-EFP | ATSAME53J20A-AUT-EFP | ATSAME53J19A-MUT | ATSAME51J20A-MUT | ATSAME51J19A-MUT-EFP | ATSAMD51P20A-CTUT-EFP |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Core / Clock | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash / SRAM | 1 MB / 256 KB (ECC) | 1 MB / 256 KB (ECC) | 1 MB / 256 KB (ECC) | 512 KB / 256 KB (ECC) (-50%) | 1 MB / 256 KB (no ECC) | 512 KB / 256 KB (-50%) | 1 MB / 256 KB (no ECC) |
| Ethernet MAC | Yes (10/100, GMII/RGMII) | Yes | Yes | Yes | No | No | Yes |
| USB | USB 2.0 FS Device/Host + PHY | USB 2.0 FS + PHY | USB 2.0 FS + PHY | USB 2.0 FS + PHY | USB 2.0 FS + PHY | USB 2.0 FS + PHY | USB 2.0 FS + PHY |
| Operating Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Grade / Encryption | ECC + AES/SHA/TRNG | ECC + AES/SHA/TRNG | ECC + AES/SHA/TRNG | ECC + AES/SHA/TRNG | No ECC + AES/SHA/TRNG | No ECC + AES/SHA/TRNG | No ECC + AES/SHA/TRNG |
| Packaging Code | MUT (T&R, EFP) | MU (Tray, EFP) | AUT (T&R, EFP) | MUT (T&R) | MUT (T&R) | MUT (T&R, EFP) | CTUT (T&R, EFP) |
| Indicative Price (qty 1) | USD 11.18 | USD 11.05 (est. -E suffix savings) | USD 14.50 (est. automotive grade premium) | USD 9.40 (est., 512 KB Flash savings) | USD 9.85 (est., no Ethernet) | USD 7.95 (est., 512 KB + no Ethernet) | USD 11.95 (est., no ECC) |
주요 차별점
- Integrated 10/100 Ethernet MAC with hardware AES/SHA crypto (vs ATSAME51J20A-MUT)
- ECC-protected Flash and SRAM with dual-panel OTA support (vs ATSAMD51P20A-CTUT-EFP)
- Full 1 MB Flash density vs 512 KB half-density variant (vs ATSAME53J19A-MUT)
- On-chip FPU and DSP extensions accelerate floating-point code (vs M0/M0+ Cortex-M MCUs (general class))
- Pin- and footprint-compatible same-family upgrades preserve BOM investment (vs Cross-brand Cortex-M4F (e.g. STM32F407))
설계 노트
The 64-VQFN (9x9 mm) package's ground/thermal pad is the dominant heat-dissipation path. Estimate: at 120 MHz the Cortex-M4F draws up to ~90 mA core current plus peripheral traffic; with VDDIO = 3.3 V, total package dissipation can reach 300-500 mW in heavy compute workloads. The datasheet recommends stitching thermal vias under the exposed pad (typically a 3x3 array of 0.3 mm vias) connecting to the bottom ground plane. Without this thermal bridge, junction-to-ambient thermal resistance can exceed the 32 C/W spec and cause thermal shutdown at 85 C ambient under sustained DSP load.
USB DM/DP traces from pins 3/4 must be 90 ohm differential with no stubs or test points and routed over a continuous ground plane. The 24 MHz HSE crystal load capacitors must be placed within 5 mm of pins 58/59 with symmetric trace lengths. Decoupling: place one 100 nF 0402 X7R per VDDIO pin plus one bulk 4.7 uF X5R near pin 47. Place AVSS as close to the analog ground pin 60 as possible and route analog traces away from switching nodes; AREF should have its own 10 nF + 1 uF RC. The Ethernet GMII/RGMII lines to the external PHY must be length-matched within 50 mil tolerance, otherwise 100 Mbps data-eye closure may occur at high temperature.
VDDCORE (pin 45) may be powered by the internal 1.2 V regulator or an external LDO. For designs that run at 120 MHz continuously (motor control, full-speed USB, or DSP workloads), bypass the internal LDO and supply VDDCORE from an external 1.2 V rail. This eliminates the thermal stress caused by LDO dissipation under high core activity. Combine this with a Ferrite bead between VDDIO and VDDCORE if both are locally generated; add 1 uF + 100 nF near pin 45 plus a 10 uF bulk capacitor on the upstream 3.3 V LDO output.
Three common pitfalls when bringing up this MCU: (1) Leaving PA13 (pin 49) floating - the ERASE function pulled high at reset enters SAM-BA bootloader, which can confuse first-power-up debugging unless intentionally used. (2) Forgetting to solder the exposed thermal pad (pin 55) during hand-rework - this pin is electrically the primary ground and must be soldered for both electrical reference and thermal relief; electrical glitches and erratic behavior are typical of mis-pasted boards. (3) Initializing the PLL from an unstable crystal - always enable the XOUT/XIN oscillator with proper load caps and wait for OSCREADY before switching the CPU to PLL clock, otherwise firmware may execute at half-rate or fail to start entirely.
For USB Full-Speed at 12 Mbps, the DM/DP pair should target 90 ohm differential impedance with no more than 4 mm of uncoupled length to the USB connector. Series ferrite beads are recommended on each line for EMI, but use 90 ohms at DC or 0 ohms to preserve signal integrity. The Ethernet GMII/RGMII group runs at 25-125 MHz and benefits from a continuous reference plane and length matching. Use shielding and avoid right-angle bends on high-speed traces. Place the Ethernet PHY within 50 mm of MCU pins to minimize common-mode noise; PHY magnetics can be on the same PCB or via RJ45 with integrated magnetics.
규정 준수 정보
RoHS and REACH compliant per Microchip product declaration. The 64-VQFN package is Pb-free (lead-free). For AEC-Q100 automotive-qualified version, choose the ATSAME53J20A-CFT or ATSAME53J20A-MFT variant. Not halogen-free statement explicitly declared in datasheet, presumed compliant per Microchip green-conflict-minerals policy.
