ATSAME70Q20B-CN - 300MHz Cortex-M7 MCU, 1MB Flash | Microchip
부품 번호: ATSAME70Q20B-CN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.83 | $28.83 |
| 10 | $25.1 | $251.00 |
| 100 | $22.05 | $2,205.00 |
| 500 | $19.95 | $9,975.00 |
| 1,000 | $18.2 | $18,200.00 |
ATSAME70Q20B-CN 개요
What is a Cortex-M7 microcontroller? A Cortex-M7 microcontroller is a high-end 32-bit MCU based on the ARM Cortex-M7 processor core, designed for applications requiring high computational throughput, floating-point arithmetic, and DSP performance. Within the broader taxonomy it sits at the top of the Cortex-M family, above Cortex-M4/M3, and belongs to the general category of embedded microcontrollers (MCUs) used in industrial control, motor drives, audio processing, and graphical HMI.
Key features include 1 MB embedded Flash, 384 KB multi-port SRAM with 32 KB tightly-coupled memory (TCM), a 16-bit external bus interface (EBI) for SDRAM/NAND/NOR expansion, and a rich connectivity suite: Ethernet MAC (10/100 Mbps), USB 2.0 High-Speed PHY, CAN-FD, HS-SPI, TWI (I2C), and USART. Integrated peripherals include an advanced 12-bit ADC up to 2 Msps, 12-bit DAC, motor-control PWMs (PWMH/PWML), camera interface, and an on-chip cryptographic accelerator suite supporting AES, TDES, SHA, and True Random Number Generator (TRNG).
Technically, the device is built on a low-power 65 nm process and supports an operating voltage range of 1.62-3.6 V. It includes a sophisticated Event System for hardware-triggered inter-peripheral signaling without CPU intervention, a 32-bit Real-Time Clock with calendar, and a Parallel Capture Controller. The dual 16-channel 12-bit ADC with up to 24 analog inputs and oversampling enables precision sensor acquisition. A 32-bit Sigma-Delta audio interface is integrated for high-fidelity digital audio.
Typical applications include industrial motor control (FOC/PMSM drives), PLC and factory automation controllers, building automation gateways, automotive body and ADAS sensor fusion, audio DSP processors, smart energy meters, and graphical HMI panels. The combination of 300 MHz core speed, 1 MB Flash, and 384 KB SRAM makes it well-suited for protocol stacks running concurrently (e.g., EtherCAT + CAN-FD + USB).
When designing with this device, pay attention to BGA fan-out, signal integrity on high-speed EBI/HS-USB traces, and thermal management at sustained 300 MHz operation. Decoupling must include 100 nF X7R per power pin and 4.7 µF bulk near the LDO inputs. Programming is supported by Atmel Studio 7, MPLAB X IDE, and Microchip's Harmony framework.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives within the SAME70 family, and practical design notes that complement the manufacturer datasheet for engineers evaluating ATSAME70Q20B-CN for new designs.
드롭인 대체품: ATSAME70Q20B-CN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME70Q20B-CN (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Mounting Type, SRAM, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAME70Q20B-ANT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$16.75 / 개
데이터시트 보기 →ATSAME70Q21A-CN
✅ 드롭인✓ 재고 있음
$17.55 / 개
데이터시트 보기 →ATSAME70Q19A-CN
✅ 드롭인✓ 재고 있음
$6.68 / 개
데이터시트 보기 →ATSAME70Q20B-AN
✅ 드롭인✓ 재고 있음
$10.85 / 개
데이터시트 보기 →ATSAME70Q20B-CN 최대 정격 & 전기적 특성
| Core | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Frequency | 300 MHz |
| Performance | 300 DMIPS / 1500 CoreMark |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 384 KB multi-port (with 32 KB TCM) |
| Supply Voltage (VDDIO/VDDCORE) | 1.62 V to 3.6 V |
| 패키지 | 144-pin LFBGA (10x10 mm) |
| 동작 온도 | -40 C to +105 C (industrial) |
| ADC | 2x 12-bit, up to 2 Msps, 24 channels |
| DAC | 2x 12-bit, 1 Msps |
| Ethernet MAC | 10/100 Mbps with 1588 PTP support |
| USB | USB 2.0 High-Speed (480 Mbps) PHY embedded |
| CAN | 2x CAN-FD controllers |
| External Bus Interface (EBI) | 16-bit, supports SDRAM/NAND/NOR/SRAM |
| Cryptography | AES, TDES, SHA, TRNG, secure boot |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 |
ATSAME70Q20B-CN 144-pin lfbga (10x10 mm) 핀 구성 가이드
ATSAME70Q20B-CN(144-pin lfbga (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAME70Q20B-CN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAME70Q20B-CN 적합 용도: 7 애플리케이션s: Industrial Motor Control (PMSM/FOC), PLC and Industrial Automation Controller, Building Automation and IoT Gateways, Automotive Body Electronics and Sensor Fusion, Audio DSP Processors and Amplifiers, Graphical HMI Panels and Touch Interfaces, Smart Energy and Grid Meters.
Industrial Motor Control (PMSM/FOC)
ATSAME70Q20B-CN fits PMSM/BLDC field-oriented control drives because its 300 MHz Cortex-M7 with single-precision FPU completes the FOC math loop in under 5 microseconds at 20 kHz PWM. The two dedicated PWM channels (PWMH + PWML) provide complementary center-aligned outputs with hardware dead-time insertion and 1.5 ns resolution, while the two 12-bit 2 Msps ADCs enable simultaneous current sampling on three shunt resistors. The 384 KB SRAM holds the entire speed/torque PI loop state and a sensorless observer without TCM thrashing.
추천
PLC and Industrial Automation Controller
ATSAME70Q20B-CN is well-suited as a PLC CPU because the 16-bit External Bus Interface (EBI) can address up to 16 MB of external SDRAM for IEC 61131-3 program and data memory. The on-chip 10/100 Ethernet MAC with IEEE 1588 PTP supports PROFINET IRT or EtherCAT slave implementations. Dual CAN-FD ports handle CANopen or DeviceNet master communication simultaneously, while the cryptographic engine secures firmware updates per IEC 62443. The 1 MB Flash holds the runtime, web server, and fieldbus stack concurrently.
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Building Automation and IoT Gateways
ATSAME70Q20B-CN works as a building-automation gateway because it can simultaneously run a TCP/IP stack over Ethernet, a Zigbee/Thread radio via SPI, and BACnet/Modbus over UART, all on a single 300 MHz core. The 384 KB SRAM holds TLS 1.3 session buffers, and the on-chip AES-256/SHA engine accelerates encrypted cloud connections. USB High-Speed enables local configuration via a flash drive, while the 12-bit DAC and PWM provide analog output channels for HVAC damper and lighting control.
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Automotive Body Electronics and Sensor Fusion
ATSAME70Q20B-CN fits automotive body and sensor-fusion nodes because the dual CAN-FD controllers run at 5 Mbps while the Cortex-M7 fuses data from six-axis IMUs, wheel-speed sensors, and pressure transducers. Hardware floating-point accelerates Kalman filter math at 1 kHz update rate with deterministic latency. The integrated TRNG and secure boot support ISO 21434 cybersecurity requirements, and the AEC-Q100 grade qualification (note: this specific -CN suffix is industrial, not AEC-Q100) demonstrates the family roadmap.
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Audio DSP Processors and Amplifiers
ATSAME70Q20B-CN integrates the I2S/SSC audio interface plus Sigma-Delta audio interface that handle 24-bit 192 kHz multi-channel streams, making it well-suited for networked audio amplifiers, prosumer speakers, and hearing aids. The Cortex-M7 DSP extensions (SIMD, MAC) run biquad filter cascades and dynamic-range compressors in real time, while 384 KB SRAM holds a 50-tap FIR buffer plus lookahead limiter state. The cryptographic engine protects HDMI-ARC and Bluetooth audio bridges from cloning attacks.
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Graphical HMI Panels and Touch Interfaces
ATSAME70Q20B-CN drives medium-size HMI panels (3.5" to 7") because the EBI interfaces to a 16-bit parallel TFT LCD at WSVGA resolution, while the integrated PTC (Peripheral Touch Controller) handles up to 12 mutual-capacitance touch channels without an external touch IC. The Cortex-M7 at 300 MHz renders emWin/STemWin GUIs at 60 fps. 384 KB SRAM holds frame buffers and glyph caches, and 1 MB Flash stores fonts, languages, and bitmap resources - enough for full multilingual HMI without external serial flash.
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Smart Energy and Grid Meters
ATSAME70Q20B-CN operates as a polyphase smart-meter CPU because it integrates four 12-bit ADC channels sampling at 2 Msps for simultaneous voltage and current acquisition across three phases plus neutral. The Cortex-M7 FPU computes FFT-based harmonic analysis at 4 kHz sample rate, and the 384 KB SRAM holds one-second of raw waveform plus algorithm state. The Ethernet MAC supports DLMS/COSEM communication, while the AES-256 engine secures smart-meter credential exchange per IEC 62056.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME70Q20B-CN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAME70Q21A-CN | ATSAME70Q19A-CN | ATSAME70Q20B-AN | ATSAME70Q20B-ANT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LFBGA (10x10 mm) | 144-LFBGA (10x10 mm) - same | 144-LFBGA (10x10 mm) - same | 144-LQFP (22x22 mm) - different | 144-LFBGA (10x10 mm) - same |
| Core | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz |
| Flash | 1 MB | 2 MB (+100%) | 512 KB (-50%) | 1 MB (same) | 1 MB (same) |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Ethernet MAC | 10/100 with PTP | 10/100 with PTP | 10/100 with PTP | 10/100 with PTP | 10/100 with PTP |
| USB | USB HS PHY embedded | USB HS PHY embedded | USB HS PHY embedded | USB HS PHY embedded | USB HS PHY embedded |
| CAN-FD | 2 ports | 2 ports | 2 ports | 2 ports | 2 ports |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
주요 차별점
- Integrated USB HS PHY (no external PHY chip needed) (vs ATSAM3X8E)
- Single + double precision FPU on Cortex-M7 (vs ATSAME54P20A-AFT)
- Up to 384 KB multi-port SRAM with TCM (vs ATSAME53N20A-AU)
설계 노트
The 144-LFBGA 0.8 mm pitch package requires microvia (laser-drilled) PCB technology on at least 4-layer stack-ups (1 oz copper, FR-4 with Tg >= 150 C). Place 100 nF X7R 0402 decoupling capacitors on each VDDIO/VDDIN/VDDPLL ball pair; add a 4.7 µF X5R 0805 bulk near the LDO input pins (ball cluster around J1-K5). Inner balls escaping to inner layers must use dog-bone fan-out; via-in-pad is preferred for 6+ layer stack-ups to improve BGA thermal pad connection.
High-speed EBI signals (16-bit data bus + address) require 50 ohm controlled-impedance routing with maximum length matching of 100 mils across the byte lanes. USB HS differential pair (DP/DM) needs 90 ohm differential impedance with no more than 2 vias and trace length under 25 mm. Ethernet MII/RMII signals to the external LAN8742A PHY should be length-matched within 50 mils. Place a 1 nF to 4.7 nF series ferrite bead on each analog supply (VDDA, VDDANA) to isolate digital switching noise from ADC references.
Estimated: at maximum 300 MHz with peripherals active, the core draws up to 250 mA from VDDIN at 3.3 V, dissipating ~830 mW. The LFBGA-144 has theta-JA around 28 C/W on a 4-layer JEDEC EIA/JESD51 test board; without thermal vias under the central ground balls, junction temperature can rise 23 C above ambient at full load. Recommend a thermal via array (12+ 0.3 mm vias) under the central ball cluster to the inner ground plane, or add a copper heat-spreader layer.
Do not leave the NRST pin floating - it requires a 10 kohm pull-up to VDDIO plus a 100 nF cap to ground for stable reset during power-up. The TCK/TMS/SWDIO/SWCLK JTAG pins must each have a 100 kohm pull-up to VDDIO; otherwise debug-port acquisition fails intermittently. The XIN32/XOUT32 32.768 kHz crystal load capacitance must be matched to 12 pF total (including pin capacitance) for accurate RTC operation.
Brown-out detection is integrated on VDDIO and VDDIN - configure the threshold via SUPC_CR.BODRSTEN to 1.62 V (level 0) for 3.3 V systems. The on-chip 1.2 V core LDO requires a minimum 1 µF X7R bypass on VDDOUT; use 2.2 µF if VDDOUT also drives external circuits. For battery-backed RTC, VDDANA must be supplied continuously even in backup mode; switch to a coin-cell via an external Schottky diode.
규정 준수 정보
Industrial temperature grade (-40 to +105 C), not AEC-Q100 qualified - choose ATSAME70N20A-A-CFN (automotive grade) for vehicle applications. RoHS and REACH compliant per Microchip product declaration.
