ATSAMHA1E14A-MBT-B510 - LIN SiP MCU+TRX+VREG 32-VQFN | Microchip
부품 번호: ATSAMHA1E14A-MBT-B510 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.36 | $336.00 |
| 500 | $2.95 | $1,475.00 |
| 1,000 | $2.65 | $2,650.00 |
ATSAMHA1E14A-MBT-B510 개요
A LIN System-in-Package (SiP) is an integrated module that combines a microcontroller, a LIN (Local Interconnect Network) physical-layer transceiver compliant with ISO 17987, and an on-chip voltage regulator into one package. The SiP approach eliminates the need for designers to source and qualify separate MCU and LIN transceiver ICs, reduces BOM count, simplifies PCB layout, and shortens the time to achieve LIN conformance certification. LIN is a low-cost, single-wire, master-slave serial protocol used widely in automotive body domains where CAN bandwidth is unnecessary.
Key differentiating features of the ATSAMHA1E14A-MBT-B510 include AEC-Q100 Grade 1 qualification for -40C to +125C operation, an integrated LIN 2.x/SAE J2602 transceiver, on-chip LDO for direct 12V automotive bus operation, 16 KB self-programmable Flash, four KB SRAM, and 32-VQFN packaging with wettable flanks for automated optical inspection. The Cortex-M0+ core consumes as little as 50 uA/MHz active, supporting always-on body modules that must wake on LIN bus activity.
Architecturally, the device pairs the Cortex-M0+ core with Microchip's peripheral touch (PTC), SERCOM, and Event System IP blocks. The integrated LIN transceiver handles bus dominant/recessive arbitration, slew-rate control, and thermal shutdown independently of the MCU, allowing the LIN interface to remain active even when the core is in deep sleep. Functional Safety (FuSa) support assists developers building ISO 26262 ASIL-A-capable systems.
Typical applications include automotive window lifters, seat controllers, mirror adjusters, sunroof modules, HVAC damper actuators, ambient lighting, rain/light sensors, and other body-electronics nodes that communicate via LIN bus to a central body control module. The 32-VQFN package with wettable flanks supports high-yield automotive PCB assembly lines.
When designing with this SiP, route the LIN bus pin directly to the bus with proper ESD and reverse-battery protection, and follow Microchip's LIN PCB layout guidelines for EMC compliance. Always validate the full node against the target LIN conformance specification (ISO 17987, SAE J2602, or LIN 2.2a) before production release.
드롭인 대체품: ATSAMHA1E14A-MBT-B510 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMHA1E14A-MBT-B510 (동일 폼 팩터 및 풋프린트) — 차이점: Package, SERCOM Modules, ADC, Operating Temperature, Program Flash.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMHA1E14A-MBT-BVAO
✅ 드롭인✓ 재고 있음
$2.98 / 개
데이터시트 보기 →ATSAMHA1E14A-MBT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAMDA1E14B-MBT
✅ 드롭인✓ 재고 있음
$1.38 / 개
데이터시트 보기 →ATSAMDA1G14B-MBT
✅ 드롭인✓ 재고 있음
$1.78 / 개
데이터시트 보기 →ATSAMDA1G15B-MBT
✅ 드롭인✓ 재고 있음
$1.1 / 개
데이터시트 보기 →ATSAMDA1J14B-ABT
✅ 드롭인✓ 재고 있음
$2.45 / 개
데이터시트 보기 →ATSAMDA1J16B-MBT
✅ 드롭인✓ 재고 있음
$2.21 / 개
데이터시트 보기 →ATSAMHA1E14A-MBT-B510 최대 정격 & 전기적 특성
| Product Type | LIN System-in-Package (SiP): MCU + LIN Transceiver + VREG |
| Core Architecture | 32-bit Arm Cortex-M0+ |
| Series | SAM HA1 (Automotive AEC-Q100) |
| Maximum CPU Frequency | 48 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Flash (Read-While-Write) | 0.5 KB |
| SRAM | 4 KB |
| LIN Transceiver Compliance | LIN 2.x / SAE J2602 / ISO 17987 |
| 패키지 | 32-VQFN (5x5 mm) with wettable flanks |
| 핀 수 | 32 |
| Automotive Qualification | AEC-Q100 (Functional Safety / FuSa) |
| 동작 온도 범위 | -40C to +125C (AEC-Q100 Grade 1) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Functional Safety (FuSa) | Yes |
ATSAMHA1E14A-MBT-B510 핀 구성
| 핀 1 | VBAT — Battery supply input for integrated LIN VREG (12 V automotive bus) |
| 핀 2 | LIN — LIN bus pin (single-wire, integrated transceiver) |
| 핀 3 | GND — Ground reference |
| 핀 4 | VDD — Internal regulated core supply output / decoupling |
| 핀 5 | NRST — Reset input, active-low |
| 핀 6 | SWDIO — Serial Wire Debug I/O |
| 핀 7 | SWCLK — Serial Wire Debug clock |
| 핀 8 | PA00 — GPIO / peripheral function (SERCOM, PTC) |
| 핀 9 | PA01 — GPIO / peripheral function (SERCOM, PTC) |
| 핀 10 | PA02 — GPIO / peripheral function |
| 핀 11 | PA03 — GPIO / peripheral function |
| 핀 12 | PA04 — GPIO / peripheral function |
| 핀 13 | PA05 — GPIO / peripheral function |
| 핀 14 | PA06 — GPIO / peripheral function |
| 핀 15 | PA07 — GPIO / peripheral function |
| 핀 16 | PA08 — GPIO / peripheral function |
| 핀 17 | PA09 — GPIO / peripheral function |
| 핀 18 | PA10 — GPIO / peripheral function |
| 핀 19 | PA11 — GPIO / peripheral function |
| 핀 20 | PA14 — GPIO / peripheral function |
| 핀 21 | PA15 — GPIO / peripheral function |
| 핀 22 | PA16 — GPIO / peripheral function |
| 핀 23 | PA17 — GPIO / peripheral function |
| 핀 24 | PA18 — GPIO / peripheral function (XIN) |
| 핀 25 | PA19 — GPIO / peripheral function (XOUT) |
| 핀 26 | PA22 — GPIO / peripheral function |
| 핀 27 | PA23 — GPIO / peripheral function |
| 핀 28 | PA27 — GPIO / peripheral function |
| 핀 29 | PA28 — GPIO / peripheral function |
| 핀 30 | PA30 — GPIO / peripheral function (SWD alternate) |
| 핀 31 | PA31 — GPIO / peripheral function (SWD alternate) |
| 핀 32 | EP — Exposed thermal pad, must be soldered to ground |
일반적인 애플리케이션
ATSAMHA1E14A-MBT-B510 적합 용도: 7 애플리케이션s: Automotive Window Lifter LIN Slave Node, Seat Control Module with LIN Bus, Power Mirror Adjuster LIN Node, Sunroof and Convertible Roof LIN Controller, HVAC Damper and Blower LIN Actuator, Ambient Lighting and RGB LED LIN Module, Rain and Light Sensor LIN Slave.
Automotive Window Lifter LIN Slave Node
The ATSAMHA1E14A-MBT-B510 is purpose-built for automotive window lifter LIN slave nodes where a single-wire LIN bus connects each door module to the central body control module (BCM). The integrated LIN 2.x/SAE J2602 transceiver eliminates the external PHY, while the on-chip VREG accepts the 12 V automotive bus directly, reducing the BOM to a single IC plus the half-bridge driver. The Cortex-M0+ core running at 48 MHz executes the LIN stack plus anti-pinch algorithm with comfortable headroom in the 4 KB SRAM. AEC-Q100 Grade 1 qualification (-40C to +125C) and the 32-VQFN wettable-flank package meet automotive PCB assembly and reliability requirements.
추천
Seat Control Module with LIN Bus
Power seat adjusters, memory seat modules, and seat heaters often communicate with the BCM over a LIN bus; the ATSAMHA1E14A-MBT-B510 integrates the MCU, LIN PHY, and voltage regulator in one 32-VQFN SiP, simplifying the seat module PCB and shortening LIN conformance certification cycles. The 16 KB Flash stores the seat-position memory table and switch-debounce logic, while the Cortex-M0+ Event System handles low-latency wake-up from LIN bus activity. Functional Safety (FuSa) support helps designers building ASIL-A-capable seat-control systems under ISO 26262.
추천
Power Mirror Adjuster LIN Node
Power mirrors with heating, folding, and turn-signal indicators typically use a single LIN slave node per mirror. The ATSAMHA1E14A-MBT-B510 fits this role because its integrated LIN transceiver and on-chip LDO remove the external 12 V regulator and PHY IC, shrinking the mirror PCB to a tight footprint. The 32-VQFN package with wettable flanks survives automotive wave-solder and AOI processes, and the AEC-Q100 Grade 1 thermal range handles under-mirror temperatures that can exceed 100 C in summer.
추천
Sunroof and Convertible Roof LIN Controller
Sunroof and convertible roof actuators use a LIN slave to drive the motor and report position to the BCM. The ATSAMHA1E14A-MBT-B510 handles the LIN stack, anti-pinch pulse counting, and end-stop detection in a single 32-VQFN SiP, reducing wiring harness weight and ECU cost. The integrated VREG accepts the 12 V battery directly, allowing the SiP to share the same harness as the motor without an external supply IC. AEC-Q100 Grade 1 cold-start at -40C is essential for sunroof modules in unheated cabins.
추천
HVAC Damper and Blower LIN Actuator
HVAC damper actuators and blower speed controllers often hang off a LIN bus inside the climate-control network. The ATSAMHA1E14A-MBT-B510 SiP drives the LIN communication, runs the PID loop for damper position, and regulates local supply rails from a single 5x5 mm package. Its low active current of approximately 50 uA/MHz on the Cortex-M0+ keeps module quiescent draw low, which is important for vehicles that allow HVAC control to remain live after ignition-off.
추천
Ambient Lighting and RGB LED LIN Module
In-cabin ambient lighting strips communicate color and brightness commands over LIN to per-zone LED driver modules. The ATSAMHA1E14A-MBT-B510 SiP combines the MCU and LIN PHY needed to receive these commands, freeing PCB area for the LED driver chain and current-sense resistors. The 16 KB Flash stores fade curves and color-mixing tables, and the Cortex-M0+ Event System can wake the SiP from sleep on the first LIN break-symbol without polling the bus.
추천
Rain and Light Sensor LIN Slave
Windshield-mounted rain/light/temperature sensors use LIN to forward measurements to the BCM. The ATSAMHA1E14A-MBT-B510 SiP accepts the 12 V supply directly via its internal VREG and forwards sensor data over LIN with no external PHY, which is critical because the sensor housing has very limited PCB area. AEC-Q100 Grade 1 qualification and the small 32-VQFN footprint allow the SiP to fit behind the rearview mirror without thermal issues.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMHA1E14A-MBT-B510 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMHA1E14A-MBT-BVAO | ATSAMDA1E14B-MBT | ATSAMDA1G14B-MBT | ATSAMDA1G15B-MBT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 32-VQFN (5x5 mm) | 32-VQFN (5x5 mm) - same | 32-VQFN (5x5 mm) - same | 32-VQFN (5x5 mm) - same | 32-VQFN (5x5 mm) - same |
| Core | Arm Cortex-M0+ | Arm Cortex-M0+ | Arm Cortex-M0+ | Arm Cortex-M0+ | Arm Cortex-M0+ |
| Maximum CPU Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash Memory | 16 KB | 16 KB | 16 KB | 14 KB (-12.5%) | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Integrated LIN Transceiver | Yes (LIN 2.x / SAE J2602) | Yes (LIN 2.x / SAE J2602) | No - external PHY required | No - external PHY required | No - external PHY required |
| Integrated Voltage Regulator | Yes (12 V bus VREG) | Yes (12 V bus VREG) | No - external LDO required | No - external LDO required | No - external LDO required |
| AEC-Q100 Qualification | Yes (Grade 1, -40C to +125C) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Integrated LIN 2.x/SAE J2602 transceiver and 12 V VREG in one 32-VQFN SiP (vs ATSAMDA1E14B-MBT)
- AEC-Q100 Grade 1 (-40C to +125C) qualification plus Functional Safety (FuSa) support (vs ATSAMD21G17D-MUT)
- Pin-compatible variant for tape-and-reel orientation flexibility (vs ATSAMHA1E14A-MBT-BVAO)
설계 노트
Route the LIN bus pin directly to the bus connector through a series protection network: an external reverse-battery diode (or P-MOSFET), an ESD protection array rated to >= +/-8 kV HBM (e.g. PESD1LIN), and a common-mode choke. Keep the LIN trace short and away from noisy switching nodes to meet ISO 17987 / SAE J2602 RF-emission limits. The 32-VQFN exposed thermal pad MUST be soldered to a continuous ground pour for thermal dissipation and mechanical reliability.
The integrated VREG accepts the 12 V automotive bus directly and generates the internal core supply; however, during load-dump transients (ISO 7637-2 pulse 5a up to 35 V for 400 ms) the VBAT pin MUST be protected by an external TVS clamp such as SMAJ24A or equivalent, plus a series resistor or inductor to limit inrush. Bulk-decouple VBAT with at least 10 uF of X7R ceramic plus 47 uF of aluminum-polymer, and place a 100 nF X7R directly at the VBAT pin to suppress high-frequency ringing.
Do not assume the LIN bus pin can be left floating during module sleep - the internal transceiver requires the LIN bus pull-up to be present (typically supplied by the master node). Configure the LIN wake source in the SAM HA1 device firmware before entering deep-sleep, otherwise the SiP will not wake on LIN bus traffic. Also note that the integrated VREG output is intended for internal SiP use only; do not draw external load current from the VDD pin beyond the SiP's own requirements.
Place decoupling capacitors as close as possible to each supply pin: 100 nF X7R on every VDD/VDDIO pin and 10 uF X7R on the main VDD rail. Keep the SWD clock and data traces short (<50 mm) and route them over a continuous ground plane to avoid debug-interference from the LIN bus transitions. Use wettable-flank PCB land patterns per IPC-7351 to ensure reliable solder joint inspection on the 32-VQFN.
규정 준수 정보
AEC-Q100 Grade 1 qualified per Microchip's SAM HA1 family documentation. RoHS and REACH compliance confirmed via DigiKey and Mouser product listings. Halogen-free status not explicitly stated in provided data and marked unknown.
