BD9F500QUZ-E2 - 36V, 5A Synchronous Buck DC/DC Converter | ROHM
부품 번호: BD9F500QUZ-E2 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.82 | $1.82 |
| 10 | $1.64 | $16.40 |
| 100 | $1.45 | $145.00 |
| 500 | $1.28 | $640.00 |
| 1,000 | $1.12 | $1,120.00 |
| 3,000 | $0.95 | $2,850.00 |
BD9F500QUZ-E2 개요
A buck (step-down) DC/DC converter is a switched-mode power supply topology that uses an inductor, output capacitor, and a control loop to reduce a higher DC input voltage to a lower regulated DC output voltage. ROHM's buck converters sit within the broader switching regulator family alongside boost, buck-boost, and SEPIC converters, all of which are sub-categories of switched-mode power conversion inside the power management IC hierarchy. Synchronous designs replace the external Schottky rectifier with a low-RDS(on) MOSFET to improve efficiency, especially at high load currents.
The BD9F500QUZ-E2 features an adjustable output down to 0.6 V, integrated high-side and low-side MOSFETs, fast transient response from the COT control loop, Light Load Mode for light-load efficiency, and built-in protection functions such as over-current protection (OCP), under-voltage lockout (UVLO), thermal shutdown (TSD), and over-voltage protection (OVP). According to the manufacturer datasheet, the device operates from -40 °C to +85 °C (or +125 °C junction maximum) and is targeted at industrial, consumer, and 24 V bus distributed-power applications.
The constant-on-time architecture delivers fast load-step response and a small external component count compared to traditional voltage-mode or current-mode PWM controllers. Combined with the 36 V maximum input rating, the BD9F500QUZ-E2 is positioned for industrial 24 V rails, factory automation, and distributed-power architectures where a compact, high-efficiency, 5 A point-of-load converter is required.
Typical applications include 24 V industrial PLC power rails, SSD/NAS auxiliary supplies, FPGA core and I/O voltage rails, USB-PD source converters, and step-down conversion for 12 V automotive accessory subsystems. In multi-rail designs it can be paired with a higher-current master converter (e.g., a 8 A or 10 A ROHM BD9F800MUX-class part) plus an LDO for low-noise analog rails.
When designing with this part, place the input ceramic bypass capacitor as close as possible to VIN and PGND, and use a low-impedance ground pour with sufficient thermal vias under the exposed pad to dissipate up to ~3 W of losses at full 5 A load. Ensure the inductor ripple current is within the data sheet's recommendation to avoid tripping OCP at the current-sense threshold during transient load steps.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives (same-brand first, then cross-brand), and practical PCB/thermal design notes that go beyond the manufacturer datasheet.
드롭인 대체품: BD9F500QUZ-E2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
BD9F500QUZ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
BD9F500QUZ-E2 최대 정격 & 전기적 특성
| 토폴로지 | Synchronous Buck (Step-Down) |
| 입력 전압 범위 | 4.5 V to 36 V |
| 출력 전압 범위 | 0.6 V to ~VIN (adjustable) |
| Continuous Output Current | 5 A |
| Control Method | Nano Pulse Control™ (Constant On-Time) |
| Light Load Mode | Yes (improves light-load efficiency) |
| Integrated MOSFETs | Yes (high-side and low-side, low RDS(on)) |
| 동작 온도 범위 | -40 °C to +85 °C (ambient) |
| 패키지 | 16-XFQFN Exposed Pad (UMPN) |
| 실장 유형 | Surface Mount |
| Protections | OCP, UVLO, TSD, OVP |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
BD9F500QUZ-E2 핀 구성
| 핀 1 | PGND — Power ground (low-side MOSFET source) |
| 핀 2 | SW — Switch node (to external inductor) |
| 핀 3 | SW — Switch node (to external inductor) |
| 핀 4 | VIN — Main input supply (4.5 V to 36 V) |
| 핀 5 | VIN — Main input supply (4.5 V to 36 V) |
| 핀 6 | BST — Bootstrap supply for high-side gate driver |
| 핀 7 | [DATA_NEEDED: pin 7] — [DATA_NEEDED: pin 7 function per datasheet] |
| 핀 8 | [DATA_NEEDED: pin 8] — [DATA_NEEDED: pin 8 function per datasheet] |
| 핀 9 | AGND — Analog ground |
| 핀 10 | FB — Feedback (output voltage sense, internal 0.6 V reference) |
| 핀 11 | EN — Enable input (active high) |
| 핀 12 | [DATA_NEEDED: pin 12] — [DATA_NEEDED: pin 12 function per datasheet] |
| 핀 13 | PGOOD — Power-good output (open drain) |
| 핀 14 | VREG — Internal LDO output for gate-drive supply |
| 핀 15 | NC — Not connected (per datasheet) |
| 핀 16 | NC — Not connected (per datasheet) |
| 핀 EP | EPAD — Exposed thermal pad (connect to PGND plane) |
일반적인 애플리케이션
BD9F500QUZ-E2 적합 용도: 7 애플리케이션s: 24 V Industrial PLC Power Rails, FPGA Core and I/O Voltage Rails, USB-PD Source / 12 V Accessory Conversion, Distributed-Point-of-Load (POL) Power, SSD and Storage Subsystem Power, IoT and Smart Home Gateways, Test & Measurement and Lab Equipment.
24 V Industrial PLC Power Rails
The BD9F500QUZ-E2's 4.5-36 V input range makes it ideal for industrial PLC and factory-automation power rails. With 5 A continuous output and adjustable output down to 0.6 V, it can step a 24 V bus down to 5 V, 3.3 V, or 1.8 V logic rails directly. The Nano Pulse Control COT architecture delivers fast transient response for digital loads like microcontrollers and FPGAs, and the integrated MOSFETs minimize PCB area compared to discrete buck designs.
추천
FPGA Core and I/O Voltage Rails
The BD9F500QUZ-E2 supplies up to 5 A to FPGA core, I/O, and auxiliary rails in compact designs. Its 0.6 V minimum output suits modern low-voltage FPGA cores, while the 5 A ceiling is enough to power mid-range FPGA banks plus associated DDR memory termination. COT control responds within microseconds to FPGA load steps, helping avoid VOUT droop that could otherwise cause logic errors during power-up or sleep transitions.
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USB-PD Source / 12 V Accessory Conversion
For 12 V automotive or industrial accessory buses stepping down to 5 V or 3.3 V at up to 5 A, the BD9F500QUZ-E2 is a strong fit. Its 36 V maximum input provides headroom for 12 V load-dump and 24 V transient surges. Synchronous rectification and Light Load Mode maintain high efficiency across load currents, extending battery runtime in portable or standby-powered designs. The exposed-pad package supports up to ~3 W dissipation without an external heatsink.
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Distributed-Point-of-Load (POL) Power
In multi-rail distributed-power systems, the BD9F500QUZ-E2 functions as a downstream POL stage from an intermediate 12 V or 24 V bus. Its integrated MOSFETs eliminate the need for an external half-bridge, simplifying PCB layout and shrinking the solution footprint. Designers commonly pair it with a higher-current master converter (such as a 10 A BD9F-class part) to share total system load across multiple compact POL stages.
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SSD and Storage Subsystem Power
The BD9F500QUZ-E2 delivers clean 5 V or 3.3 V at 5 A to SSD, NAS, and storage controller boards where high current pulses occur during write operations. COT control reacts within microseconds to load steps, preventing VOUT droop that could otherwise trigger SSD power-good faults. The exposed-pad 16-XFQFN package enables compact placement next to hot devices while the synchronous architecture reduces thermal stress in enclosed chassis.
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IoT and Smart Home Gateways
For IoT gateways, smart-home hubs, and edge-compute boards powered by 12 V or 24 V adapters, the BD9F500QUZ-E2 efficiently steps down to 5 V, 3.3 V, or 1.8 V rails at up to 5 A. Light Load Mode preserves efficiency in standby and low-traffic states, which is critical for always-on devices meeting energy-star or eco-design regulations. The 16-XFQFN exposed-pad package keeps the solution footprint under 100 mm² including the inductor.
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Test & Measurement and Lab Equipment
Bench-top and lab instruments benefit from the BD9F500QUZ-E2's wide 4.5-36 V input and fast transient response. Powering analog front-ends, ADCs, and microcontroller subsystems from a 24 V internal bus, the converter delivers tightly regulated rails with low ripple. Combined with a downstream LDO for ultra-low-noise analog rails, it forms a two-stage architecture balancing efficiency and signal purity for precision measurement.
추천
추천 제품 요약
엔지니어링 참조 데이터: BD9F500QUZ-E2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | BD9F500QUZ | BD9F800MUX | BD95602MUV |
|---|---|---|---|---|
| Brand | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor |
| Package | 16-XFQFN Exposed Pad | 16-XFQFN Exposed Pad (same) | VQFN-20 (MUX) - different | VQFN-20 (MUV) - different |
| Output Current | 5 A | 5 A (same) | 8 A (+60%) | ~2 A (-60%) |
| Input Voltage Range | 4.5 V to 36 V | 4.5 V to 36 V (same) | 4.5 V to 36 V (same) | 2.5 V to 5.5 V (different) |
| Output Voltage Range | 0.6 V to ~VIN (adj) | 0.6 V to ~VIN (same) | 0.6 V to ~VIN (same) | 0.8 V to 3.3 V (different) |
| Control Architecture | Nano Pulse Control™ (COT) | Nano Pulse Control™ (same) | Nano Pulse Control™ (same) | Voltage mode PWM (different) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Active (verify) | Active (verify) |
주요 차별점
- Wide 36 V maximum input supports 24 V industrial and 12 V automotive buses directly (vs BD95602MUV)
- Higher 5 A output current for higher-power POL stages (vs BD95602MUV)
- Integrated synchronous MOSFETs reduce BOM and PCB area (vs BD95602MUV)
- Nano Pulse Control COT delivers fast load-step transient response (vs BD95602MUV)
설계 노트
Estimated: at VIN=24 V, VOUT=5 V, IOUT=5 A, power dissipation is roughly (24-5)*5*(1/η - 1) ≈ 3.5 W assuming ~85% efficiency. With a 16-XFQFN exposed-pad thermal pad, lay out at least 1 square inch of copper on the top layer connected to PGND and stitch with 9-12 thermal vias to the inner/ground plane to keep junction temperature within the 125 °C limit. Keep the input ceramic bypass capacitor (≥10 µF X7R) within 2 mm of the VIN/PGND pins to minimize switching-node ringing.
Estimated: at VIN=24 V, VOUT=3.3 V, IOUT=5 A, dissipation approaches 4-5 W with synchronous rectification. The exposed thermal pad MUST be soldered to a sufficiently large PGND copper pour with thermal vias; otherwise the package will thermally saturate at the OCP/TSD thresholds well below rated current. Verify junction temperature in your specific layout using the theta-JA provided in the manufacturer datasheet.
Do not exceed the 36 V absolute maximum input voltage - even brief transients above this can damage the integrated MOSFETs. Always include input TVS protection when designing for 24 V industrial buses where load-dump or inductive kickback transients can spike above 36 V. Verify the bootstrap (BST) capacitor value matches the datasheet recommendation; insufficient BST capacitance causes high-side MOSFET drive undervoltage and efficiency loss.
Route the SW (switch-node) trace as short and wide as possible to minimize EMI radiation. Keep the FB trace away from SW and BST traces to avoid noise coupling that destabilizes the COT control loop. Place the output feedback divider resistors directly at the FB pin and AGND, with the upper resistor tied to the actual output capacitor - not the inductor side - for accurate load regulation.
Because COT converters exhibit variable switching frequency depending on load, conducted EMI can spread across a wide frequency band. Add a small LC pi-filter at the input and ensure the input capacitor's ESR/ESL is low at the fundamental switching frequency. Shield the SW node with a ground guard ring on the PCB to reduce radiated emissions into adjacent analog sections.
규정 준수 정보
RoHS and lead-free confirmed via ROHM product page and DigiKey listing. Other compliance attributes not specified in the provided web data and marked unknown. Not AEC-Q100 qualified - this is an industrial-grade part.
