BSC9132NSN7MNMB - QorIQ Qonverge SoC 2x1.2GHz StarCore/e500 | NXP
부품 번호: BSC9132NSN7MNMB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $195 | $195.00 |
| 10 | $175.5 | $1,755.00 |
| 100 | $156 | $15,600.00 |
| 500 | $140 | $70,000.00 |
| 1,000 | $124.5 | $124,500.00 |
BSC9132NSN7MNMB 개요
What is a SoC? A System-on-Chip (SoC) is a single integrated circuit that consolidates one or more processor cores, memory controllers, interconnect fabric, and I/O peripherals into a single silicon die. Heterogeneous SoCs like the BSC9132 combine general-purpose CPU cores (e500, ARM, or x86) with specialized DSP engines and hardware accelerators, allowing different workloads - control-plane signaling and real-time baseband - to be assigned to the most appropriate execution unit. QorIQ Qonverge is NXP's product family for wireless infrastructure SoCs.
Key features include dual Power Architecture e500 cores with 36-bit physical addressing, dual StarCore SC3850 DSP cores operating at 1.2 GHz, an integrated MAPLE-B2P baseband accelerator for LTE Layer-1 processing, a DDR3/DDR3L memory controller supporting high-bandwidth off-chip memory, and SerDes-based interconnect including RapidIO and PCI Express. Multiple Ethernet MACs support networking backhaul, and a 0-105 °C industrial temperature range targets telecom and ruggedized environments.
Architecturally, the BSC9132 partitions traffic between the e500 cores (control plane, OS, management) and StarCore DSPs (baseband PHY, FFT, channel estimation), while MAPLE-B2P offloads turbo-decoding and peak-rate computation tasks. This deterministic compute allocation suits real-time LTE/LTE-Advanced small-cell designs.
Typical applications include LTE small-cell femtocell and picocell base stations, enterprise Voice-over-IP (VoIP) gateways, smart-grid energy-management controllers, industrial control processors, and defense/aerospace compute nodes. The combination of general-purpose processing, DSP performance, and dedicated baseband acceleration simplifies PCB design versus discrete CPU+DSP+FPGA solutions.
When designing with this device, allocate PCB power-delivery decoupling to the FCBGA's multiple voltage rails and plan signal-integrity simulation for high-speed DDR3 and SerDes lanes. Thermal management is required since the 780-pin FCBGA dissipates significant power under simultaneous dual-cluster operation.
This page synthesizes distributor availability, lifecycle data, datasheet access points, and practical design context into a single source, complementing the manufacturer datasheet and distributor product listings with selection and cross-reference guidance.
드롭인 대체품: BSC9132NSN7MNMB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: BSC9132NSN7MNMB (동일 폼 팩터 및 풋프린트) — 차이점: Architecture, CPU Cores, DSP Cores, Operating Temperature, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
BSC9132CSE1HHHB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
BSC9132RM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
BSC9132NSN7MNKL
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
BSC9132NSN7MNMB 최대 정격 & 전기적 특성
| Architecture | QorIQ Qonverge SoC |
| CPU Cores | 2 x Power Architecture e500 (32-bit) up to 1.333 GHz |
| DSP Cores | 2 x StarCore SC3850 up to 1.2 GHz |
| Hardware Accelerator | MAPLE-B2P (LTE baseband) |
| Physical Addressing | 36-bit |
| Memory Controller | DDR3 / DDR3L with ECC support |
| Ethernet | Multiple 10/100/1000 MAC interfaces |
| High-Speed Serial | PCI Express, RapidIO, SerDes |
| 동작 온도 | 0 °C to +105 °C |
| 패키지 | 780-FCBGA (23 mm x 23 mm) |
| 실장 유형 | Surface Mount (BGA) |
BSC9132NSN7MNMB 780-fcbga (23 mm x 23 mm) 핀 구성 가이드
BSC9132NSN7MNMB(780-fcbga (23 mm x 23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: BSC9132NSN7MNMB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
BSC9132NSN7MNMB 적합 용도: 6 애플리케이션s: LTE Small-Cell Base Station, Enterprise VoIP Gateway Platform, Smart-Grid Energy Management Controller, Military/Defense Secure Compute Node, Industrial Control / Motor Drive Processor, Multi-Protocol Industrial Ethernet Switch.
LTE Small-Cell Base Station
Why the BSC9132NSN7MNMB fits LTE small-cell base stations: the dual 1.333 GHz Power Architecture e500 cores handle L2/L3 control-plane signaling and the small-cell SON (Self-Organizing Network) stack, while the dual 1.2 GHz StarCore SC3850 DSPs execute real-time uplink/downlink PHY chains (FFT/iFFT, channel estimation, MIMO decoding). MAPLE-B2P offloads turbo-decoding, peak-rate computation, and bit-level interleaving from the DSPs, cutting latency for FDD and TDD LTE at the 5-20 MHz channel bandwidths typical of enterprise and residential pico/femtocells. Usage and performance consideration: the SoC is placed between the RF front-end (via SerDes) and the Ethernet/SGMII backhaul, with DDR3L-1600 providing high-bandwidth on-chip memory for HARQ buffers and symbol processing. The integrated accelerator chain reduces BOM cost versus a CPU + DSP + FPGA tri-chip solution, but effective layer-1 throughput must be sized per cell density and MIMO configuration during link-budget planning.
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Enterprise VoIP Gateway Platform
Why the BSC9132NSN7MNMB fits enterprise VoIP gateways: the dual e500 cores run a hardened Linux BSP handling SIP/TLS signaling, encryption, and management interfaces, while the StarCore DSP cores execute narrow-band/wide-band voice codecs (G.711, G.722, Opus, AMR-WB) and acoustic-echo-cancellation in real time. The 36-bit physical addressing supports large routing tables for unified communications across thousands of simultaneous SIP sessions. Usage and performance consideration: voice streams enter via TDM/Ethernet interfaces, are decoded by the DSP cluster, and routed through the e cores' SIP stack. DDR3L memory bandwidth is critical for transcoding density, and the 0-105 °C thermal envelope enables deployment in non-temperature-controlled telecom closets. Power-delivery decoupling must account for sustained DSP load during peak conference-call density.
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Smart-Grid Energy Management Controller
Why the BSC9132NSN7MNMB fits smart-grid energy management: the e500 cores run real-time IEC 61850 / DNP3 / Modbus TCP stacks for substation automation and SCADA integration, while the StarCore DSP cores execute high-speed digital-protection relays and power-quality analytics (THD, FFT on current/voltage waveforms at 4-32 kHz sample rates). MAPLE-B2P helps accelerate DSP-intensive computations, freeing e500 cycles for the management and protocol stacks. Usage and performance consideration: the SoC ingests analog/AC waveforms via companion ADCs (such as MAX125/MAX1322) and outputs protection-trip decisions. Its 0-105 °C industrial temperature range tolerates outdoor substation cabinets and switchgear environments. IEC 61850-3 EMC compatibility must be validated by the integrator per substation environment, and proper isolation barriers are mandatory at the analog interface.
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Military/Defense Secure Compute Node
Why the BSC9132NSN7MNMB fits military and defense compute nodes: the heterogeneous e500 + StarCore + MAPLE architecture enables software-defined-radio (SDR) baseband processing for tactical waveforms, plus control-plane execution of crypto/authentication stacks on the e cores. Industrial 0-105 °C thermal tolerance supports ground-vehicle, shipboard, and aircraft-shelter deployments where commercial-grade parts are insufficient. Usage and performance consideration: SDR streams enter via high-speed SerDes (PCIe/RapidIO) or dedicated JESD204B interfaces; DSP cores run waveform-specific libraries while MAPLE-B2P accelerates forward-error-correction decoding. Defense programs must perform Trusted-Supply-Chain (TSC) validation against NXP's manufacturer part-history and validate against specific MIL-STD-810 and MIL-STD-461 environmental/EMI requirements during platform qualification.
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Industrial Control / Motor Drive Processor
Why the BSC9132NSN7MNMB fits industrial motor and process control: the dual e500 cores execute deterministic real-time control loops (PID, field-oriented control) with sub-millisecond cycle times, while the StarCore DSP cores perform high-speed torque, vibration, and current-spectrum analysis. The high-throughput DDR3L interface is essential for state-space observers and FFT-based diagnostics on multi-axis servo systems. Usage and performance consideration: control signals are output via PWM timers and quadrature-encoder interfaces to companion gate drivers (e.g., Eiceiver MCUs or dedicated FET drivers). The e cores also run EtherCAT / PROFINET / EtherNet/IP stacks for plant-floor connectivity. Isolation barriers (digital isolators and isolated gate drivers) between the SoC and high-voltage power stage are mandatory to meet IEC 61800-5-1 creepage/clearance.
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Multi-Protocol Industrial Ethernet Switch
Why the BSC9132NSN7MNMB fits multi-protocol industrial Ethernet switches: the dual e500 cores run stack-managed switching firmware (EtherCAT master, PROFINET IRT, EtherNet/IP scanner, Modbus TCP, IEEE 1588 PTP) with the integrated multiple Ethernet MACs wired directly to PHY interfaces. The StarCore DSP cores can offload time-critical protocol-state processing and Quality-of-Service classification, freeing the e cores for L3 routing and security-stack operations. Usage and performance consideration: the BSC9132's 36-bit physical addressing supports large subnet tables needed in flat industrial plants, and MAPLE-B2P can accelerate CRC/payload checksumming at line-rate. Stack-enabled firmware libraries (NXP SDK) shorten time-to-market for managed-switch platforms. Conformance certification for each protocol (e.g., PI conformance for PROFINET, ETG for EtherCAT) is the integrator's responsibility and may require additional verification cycles.
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추천 제품 요약
엔지니어링 참조 데이터: BSC9132NSN7MNMB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | BSC9132CSE1HHHB | BSC9132RM | BSC9132NSN7MNKL | P2020NSN2MFC |
|---|---|---|---|---|---|
| Package | 780-FCBGA (23x23 mm) | 780-FCBGA (23x23 mm) - same footprint | 780-FCBGA (23x23 mm) - same footprint | 780-FCBGA (23x23 mm) - same footprint | TePBGA-689 (31x31 mm) - different footprint, REQUIRES PCB REWORK |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Cores | 2 x e500 @ 1.333 GHz | 2 x e500 @ 1.333 GHz | 2 x e500 @ 1.333 GHz | 2 x e500 @ 1.333 GHz | 2 x e500 (no DSP, no MAPLE) |
| DSP Cores | 2 x StarCore SC3850 @ 1.2 GHz | 2 x StarCore SC3850 @ 1.2 GHz | 2 x StarCore SC3850 @ 1.2 GHz | 2 x StarCore SC3850 @ 1.2 GHz | None |
| Baseband Accelerator | MAPLE-B2P (LTE) | MAPLE-B2P | MAPLE-B2P | MAPLE-B2P | None |
| Memory Controller | DDR3 / DDR3L with ECC | DDR3 / DDR3L with ECC | DDR3 / DDR3L with ECC | DDR3 / DDR3L with ECC | DDR3 / DDR3L with ECC |
주요 차별점
- Integrated MAPLE-B2P LTE baseband accelerator (vs P2020NSN2MFC)
- Heterogeneous CPU+DSP on a single die (vs Discrete CPU + DSP+FPGA solutions)
- Industrial 0-105 °C operating range (vs Commercial-tier SoCs)
설계 노트
Estimated: a fully populated BSC9132NSN7MNMB at 1.333 GHz / 1.2 GHz dissipates between 5 W and 12 W under typical LTE baseband load, depending on MAPLE-B2P utilization, DSP duty cycle, and SerDes lane count. The 780-FCBGA (23 mm x 23 mm) offers a moderate junction-to-ambient thermal resistance; design the PCB with a continuous ground plane beneath the package, thermal vias directly under the BGA pattern, and a forced-air or heatsink-attached enclosure for thermally enclosed cabinets. Junction-temperature monitoring via the integrated thermal sensor is recommended for production firmware to throttle or shut down the device when Tj approaches the rating.
The 780-FCBGA's 1.0 mm ball pitch demands 4 mil (100 µm) trace-and-space on inner and outer signal layers, microvia-in-pad or via-on-pad stackups, and a tightly controlled PCB lamination sequence. Maintain single-ended impedance of 50 Ω and differential 100 Ω on SerDes lanes; use length-matching within the same byte lane to within 5 mil. Allocate breakout fanout layers with ground-pour shielding, and verify DDR3L fly-by topology per the BSC9132RM reference manual. Use ENIG or OSP surface finish compatible with lead-free BGA assembly per IPC-7093.
Plan for sequenced bring-up of the multiple BSC9132 voltage rails (core, DSP core, MAPLE, DDR3L I/O, Ethernet I/O, SerDes, analog); use a multi-channel PMIC with PG (Power Good) and EN daisy-chaining so the OS boots only after all rails settle. Decouple each rail adjacent to its BGA pin with 0.1 µF X7R plus bulk-polymer tantalum, with reverse-tie-down to the nearest ground via using a Starrfresh/Star-of-David keepout. Verify inrush behavior against the PMIC soft-start when both e500 and StarCore cores initialize simultaneously; bypass sizing reduces impedance above 1 MHz.
Do NOT assume a generic 780-ball BGA footprint can be reused without verifying the BSC9132 pin-map revision against the BSC9132RM reference manual revision - signal assignments are unique to this SoC. Treat the DDR3/3L controller as requiring matched-length address/command traces with proper termination; shorten the SerDes reference-clock routing and keep it guarded from switching-power layouts. When migrating firmware from the BSC9132 to Layerscape (e.g., LS1024A), verify that the DDR controller timing, SEC engine, and boot ROM behavior match across releases before re-using U-Boot and Linux BSP code paths verbatim.
규정 준수 정보
Compliance information was not present in the verified distributor data. AEC-Q100 is not applicable to a CPU/DSP SoC; confirm RoHS/REACH/lead-free status directly with NXP material declaration if required by your quality system.
