CY8C4247LQI-BL483 - 48MHz Cortex-M0 BLE MCU | Infineon
부품 번호: CY8C4247LQI-BL483 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
CY8C4247LQI-BL483 개요
A PSoC, or programmable system-on-chip, is a microcontroller architecture that combines a CPU core with configurable analog and digital peripherals connected through programmable routing. This hierarchy places the PSoC within embedded controllers and microcontrollers, while its analog blocks, SAR ADC, and BLE radio expand it into a mixed-signal wireless system-on-chip for compact embedded products.
Verified features include the Arm Cortex-M0 processor, 48 MHz operating speed, 128 KB flash, 16 KB SRAM, and a 12-bit SAR ADC. The BLE version supports low-power wireless designs, while the PSoC architecture allows functions to be implemented through programmable peripherals rather than relying only on fixed hardware blocks. Listed connectivity includes I2C, IrDA, and LIN, supporting common embedded control and sensor interfaces.
The 56-QFN surface-mount package is intended for compact PCB designs requiring substantial mixed-signal and wireless functionality. Compared with a general-purpose Cortex-M0 MCU, the CY8C4247LQI-BL483 integrates Bluetooth Low Energy and programmable resources, reducing the need for separate wireless and analog-support components. Firmware and peripheral configuration still require careful validation because changing device variants can affect CapSense characteristics, routing, and application behavior.
Typical applications include Bluetooth Low Energy sensor nodes, industrial automation equipment, consumer electronics, wearable accessories, connected controls, and low-power embedded products. The 48 MHz Cortex-M0 core and 128 KB flash provide resources for protocol handling, application logic, and peripheral configuration while retaining a compact 56-QFN footprint.
Designers should verify the exact pin assignments, exposed-pad connection, power requirements, clock configuration, antenna implementation, and peripheral routing in the manufacturer datasheet before layout. For PCB layout, follow the package land pattern and thermal-pad requirements exactly; for firmware, validate the BLE stack, memory map, interrupt configuration, and any CapSense-dependent behavior on the selected ordering variant.
드롭인 대체품: CY8C4247LQI-BL483 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
CY8C4248LQI-BL583
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
CY8C4247LQI-BL483 최대 정격 & 전기적 특성
| Product Type | PSoC 4 BLE microcontroller |
| CPU Core | Arm Cortex-M0, 32-bit |
| Operating Frequency | 48 MHz |
| Flash Memory | 128 KB |
| SRAM | 16 KB |
| ADC | 12-bit SAR ADC |
| Wireless Connectivity | Bluetooth Low Energy (BLE) |
| 패키지 | 56-QFN, 7 x 7 mm |
| 실장 유형 | Surface mount |
| Core Size | 32-bit |
| Connectivity | I2C, IrDA, LIN |
| Programmable Architecture | Configurable analog and digital blocks with automatic routing |
| Memory Organization | 128K x 8 flash |
| Series | PSoC 4 CY8C42xx |
| Family | PSoC 4200_BL |
| Supplier Packaging | Tray |
CY8C4247LQI-BL483 56-qfn, 7 x 7 mm 핀 구성 가이드
CY8C4247LQI-BL483(56-qfn, 7 x 7 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: CY8C4247LQI-BL483.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
CY8C4247LQI-BL483 적합 용도: 6 애플리케이션s: Bluetooth Low Energy Sensor Nodes, Industrial Automation Controls, Consumer Bluetooth Accessories, Wearable and Connected Controls, Low-Power IoT Devices, Connected Measurement Products.
Bluetooth Low Energy Sensor Nodes
The CY8C4247LQI-BL483 fits BLE sensor nodes because it combines a 48 MHz Arm Cortex-M0 processor with integrated Bluetooth Low Energy, 128 KB flash, 16 KB SRAM, and a 12-bit SAR ADC. Those resources can support local sampling, protocol handling, configuration, and application logic without requiring a separate general-purpose MCU. The 56-QFN 7 x 7 mm package also supports compact boards. Validate the RF layout, antenna matching, low-power current, and sensor interface requirements in the manufacturer documentation; the verified data does not provide a complete GPIO or power specification.
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Industrial Automation Controls
The CY8C4247LQI-BL483 is suitable for industrial automation controls that need deterministic embedded control plus flexible connectivity. Its 48 MHz Cortex-M0 core, 128 KB flash, and 16 KB SRAM provide resources for control logic, state machines, communications, and configuration, while listed I2C, IrDA, and LIN interfaces support common peripheral and sensor connections. Its programmable PSoC resources can reduce the need for discrete support logic in selected designs. Industrial qualification, supply voltage, operating temperature, and EMC requirements are not supplied here and must be verified before deployment.
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Consumer Bluetooth Accessories
The CY8C4247LQI-BL483 fits consumer Bluetooth accessories where a compact MCU must combine local control with wireless connectivity. The integrated BLE capability and 48 MHz Cortex-M0 processing can support button handling, status logic, sensor acquisition, and firmware updates in a small 56-QFN package. The 12-bit SAR ADC is useful when the accessory needs analog measurement, while programmable analog and digital blocks allow application-specific functions. Check RF layout, current consumption, battery behavior, and regulatory requirements in the final product design.
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Wearable and Connected Controls
The CY8C4247LQI-BL483 can serve connected controls and wearable-adjacent products that need BLE in a compact package. Its 48 MHz Arm Cortex-M0 core provides processing headroom, while 128 KB flash and 16 KB SRAM support embedded application code and state. PSoC programmability can help implement peripheral functions close to the application processor, potentially simplifying board-level designs. Mechanical footprint, RF performance, battery life, and production qualification still depend on the complete product architecture and are outside the verified data.
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Low-Power IoT Devices
The CY8C4247LQI-BL483 is a candidate for low-power IoT devices because it integrates BLE with an embedded Arm Cortex-M0 MCU and programmable mixed-signal resources. The 12-bit SAR ADC can support sensor acquisition, while I2C and listed communication interfaces can connect external components. The 56-QFN 7 x 7 mm package helps reduce board area in compact products. Low-power mode currents, supply voltage, RF output configuration, and battery-life estimates were not supplied, so they must be measured or obtained from the manufacturer before making a power-budget decision.
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Connected Measurement Products
The CY8C4247LQI-BL483 can support connected measurement products that combine sensor input, local computation, and wireless data transfer. Its 12-bit SAR ADC, 128 KB flash, 16 KB SRAM, and 48 MHz core are useful for acquisition control, calibration data handling, filtering, and communication software. Integrated BLE allows measurements to be transferred without a separate radio, while I2C and LIN can connect additional sensors or interface components. ADC performance conditions, accuracy, sampling rate, and analog routing details are not included in the supplied data and require datasheet review.
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추천 제품 요약
엔지니어링 참조 데이터: CY8C4247LQI-BL483 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | CY8C4248LQI-BL583 |
|---|---|---|
| Package | 56-QFN (7x7 mm) | 56-QFN (7x7 mm), same-package replacement candidate |
| Brand | Infineon Technologies | Infineon Technologies |
주요 차별점
- Integrated BLE in a PSoC 4 microcontroller (vs General-purpose Cortex-M0 MCU without verified BLE integration)
- Configurable mixed-signal architecture (vs Fixed-function microcontroller)
- Documented replacement candidate (vs CY8C4248LQI-BL583)
설계 노트
Use the exact 56-QFN 7 x 7 mm land pattern and pin numbering from the manufacturer package drawing. The verified data confirms the package but does not provide the complete pinout, exposed-pad details, or recommended PCB dimensions, so do not infer these values from generic QFN libraries. Confirm the assembly drawing, copper thermal pad, solder mask, and paste pattern before fabrication release.
Treat the BLE section as a constrained RF design and follow the manufacturer's antenna and keep-out guidance. Place decoupling and grounding according to the official reference layout, and preserve the intended antenna region without copper or components that alter RF behavior. RF certification, antenna matching, and conducted-emissions requirements remain product-specific and are not included in the supplied data.
Do not assume that every CY8C4247-family ordering code is interchangeable. The supplied alternatives discussion identifies possible CapSense differences among related variants, and the verified cross-reference evidence only explicitly supports CY8C4248LQI-BL583 as a candidate replacement. Review memory, peripheral routing, BLE firmware, package markings, qualification, and application behavior before substituting a part.
Build the power tree from the manufacturer recommended operating conditions rather than assumptions based only on the 48 MHz CPU rating. Verify supply voltage, decoupling, brownout behavior, sleep currents, and RF operating conditions in the datasheet. Because those values were not supplied here, they are marked as missing rather than estimated, and they must be resolved before a battery or industrial power-budget design is released.
Route sensitive analog and digital signals according to the selected PSoC device's peripheral-routing capabilities and the reference design. Keep external analog components close to their associated pins, maintain continuous ground references, and avoid routing high-current or switching signals beneath sensitive nodes. Confirm the actual pin assignment and analog specifications before finalizing the PCB.
규정 준수 정보
The supplied verified data does not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements for CY8C4247LQI-BL483. These fields remain unknown rather than inferred from the manufacturer or package.
