DSPIC30F2011-30I/P - 16-bit DSC 30MIPS 12KB Flash | Microchip
부품 번호: DSPIC30F2011-30I/P ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.42 | $7.42 |
| 10 | $6.71 | $67.10 |
| 100 | $5.98 | $598.00 |
| 500 | $5.36 | $2,680.00 |
| 1,000 | $4.81 | $4,810.00 |
DSPIC30F2011-30I/P 개요
A Digital Signal Controller combines the peripheral set and ease of use of a microcontroller (MCU) with the computational throughput of a Digital Signal Processor (DSP). Within the power-management hierarchy of embedded processors, the dsPIC30F family sits between general-purpose 16-bit MCUs and dedicated DSPs, offering single-cycle MAC, DSP multiply-accumulate instructions, and deterministic interrupt latency while retaining Flash self-programming and familiar MCU peripherals.
Key features include the 30 MIPS maximum processing speed at 5V operation, a modified Harvard 16-bit architecture with a 24-bit instruction word, motor-control and sensor-oriented peripherals, and 5V-tolerant operation that simplifies interfacing with legacy industrial logic. The device supports seamless migration to dsPIC33F, PIC24H, or PIC24F devices in similar packages, protecting software investment.
Technically, the dsPIC30F2011 executes most instructions in a single cycle from Flash, with hardware DSP support including a 17-bit x 17-bit multiplier, dual 40-bit accumulators, and barrel shifters. CMOS process technology keeps power consumption low, and multiple power-saving modes (idle and sleep) extend battery life in portable designs.
Typical applications include sensor signal conditioning and conditioning pipelines, low-end motor control such as BLDC and AC induction drives, and power-conversion or LED ballast control where 5V I/O and through-hole prototyping are valued.
Design consideration: verify oscillator configuration at 30 MIPS operation, since the internal PLL and external crystal choices determine achievable MIPS and EMC behavior; always provide decoupling close to VDD/VSS pins.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC30F2011-30I/P — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC30F2011-30I/P (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, Operating Temperature, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC30F2012-30I/P
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC30F3012-30I/P
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.1 / 개
데이터시트 보기 →DSPIC30F2011-30E/P
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC30F2011-20I/P
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.6 / 개
데이터시트 보기 →DSPIC30F2011-30I/SP
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC30F2011-30I/P 최대 정격 & 전기적 특성
| Core Architecture | 16-bit modified Harvard |
| Max CPU Speed | 30 MIPS |
| Program Memory Size | 12 KB (4K x 24) Flash |
| Program Memory Type | Flash |
| Operating Voltage Range | 3.3 V / 5 V operation |
| 패키지 | 18-PDIP |
| 실장 유형 | Through-Hole |
| 동작 온도 | -40C to +85C (Industrial, I suffix) |
| Product Family | dsPIC30F Sensor Family |
| DSP Functionality | Yes (integrated DSP engine) |
| Instruction Width | 24-bit |
| Technology | CMOS |
| Number of Terminals | 18 |
| Migration Path | dsPIC33F, PIC24H, PIC24F in similar packages |
| RoHS 상태 | Compliant |
| Packaging | Tube |
DSPIC30F2011-30I/P 18-pdip 핀 구성 가이드
DSPIC30F2011-30I/P(18-pdip 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC30F2011-30I/P.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC30F2011-30I/P 적합 용도: 6 애플리케이션s: Sensor Signal Conditioning, Low-End Motor Control, Power Conversion and LED Ballast Control, Industrial Legacy Board Repair and Maintenance, Embedded Education and Prototyping, Portable and Battery-Powered Instruments.
Sensor Signal Conditioning
The DSPIC30F2011-30I/P belongs to Microchip's dsPIC30F Sensor Family, purpose-built for acquiring and processing sensor data. Its 30 MIPS core with hardware multiply-accumulate executes FIR/IIR digital filters and calibration algorithms in real time on ADC samples, while 5V-tolerant I/O connects directly to industrial transducers without level shifting. In a typical conditioning chain, the on-chip ADC samples the sensor, the DSP engine applies filtering and linearization in firmware, and results drive actuators or communications. Unlike a discrete MCU plus external DSP, this single-chip DSC reduces BOM cost and board area while keeping the analog front-end short and noise-resistant. The 12 KB Flash accommodates filter coefficients plus communication stacks in compact code.
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Low-End Motor Control
The 30 MIPS DSP throughput of the DSPIC30F2011-30I/P makes it capable of basic motor control loops such as single-phase and small BLDC drives where a dedicated motor-control PWM module is not mandatory. Its deterministic single-cycle instruction execution supports tight current-loop software timing, and the 5V I/O directly gates MOSFET driver ICs common in industrial motor boards. The DSC executes field-oriented or trapezoidal commutation math in firmware using the hardware MAC, achieving loop rates sufficient for fans, pumps, and small appliances. Designers should note the sister device DSPIC30F2010 offers a dedicated motor-control PWM peripheral; the 2011 fits cost-sensitive, lower-complexity drives or auxiliary motor supervision roles. Through-hole PDIP simplifies prototype bring-up on breadboards.
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Power Conversion and LED Ballast Control
In switch-mode power supplies, PFC stages, and LED ballasts, the DSPIC30F2011-30I/P provides the digital control loop: sampling output voltage/current via the ADC and computing PWM duty updates at kilohertz rates using its 30 MIPS DSP engine. The 5V I/O directly interfaces with popular gate-driver and feedback optocoupler circuits found in offline power designs, and the industrial -40C to +85C rating suits enclosed ballast environments. Firmware-based control enables digital compensation, soft-start, and fault logging that analog controllers cannot offer. The compact 12 KB Flash holds control law plus protection state machines. Careful PWM peripheral study in the family datasheet is advised, as the 2011 trades some dedicated PWM features for its sensor-oriented peripheral mix.
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Industrial Legacy Board Repair and Maintenance
Because the DSPIC30F2011-30I/P remains an active Microchip product in a through-hole 18-PDIP package, it is a natural choice for maintaining and repairing legacy industrial controllers originally designed around 18-pin DIP dsPIC30F devices. The I-grade temperature range of -40C to +85C matches factory-floor equipment ratings, and 5V I/O keeps compatibility with older optocouplers, relays, and HMI logic. Replacement is a socket-level swap with ICSP reprogramming via MCLR/PGD/PGC pins, requiring no PCB modification. As of 2026-09-20 the part ships from major distributors, giving maintenance teams a reliable source rather than broker-market risk. Firmware archives plus MPLAB X and the XC16 compiler allow code updates during repair if required.
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Embedded Education and Prototyping
The 18-pin PDIP package of the DSPIC30F2011-30I/P plugs directly into solderless breadboards and DIP sockets, making it highly effective for university DSP courses, vocational training, and rapid proof-of-concept work. Students can implement real-time digital filtering, FFTs, and control loops on a genuine 16-bit DSP-capable core at 30 MIPS, then program in-circuit with a low-cost PICkit programmer. The 5V operating range eliminates fragile 3.3V-only level-shifting during classroom experiments, and the industrial temperature rating forgives abuse on lab benches. Migration lessons carry forward: Microchip explicitly documents seamless code migration from dsPIC30F to dsPIC33F, PIC24H, and PIC24F, so skills and C code transfer to modern surface-mount parts in professional workflows.
추천
Portable and Battery-Powered Instruments
Handheld measurement tools, portable testers, and battery-powered data loggers benefit from the DSPIC30F2011-30I/P combination of CMOS low power consumption, idle and sleep power-saving modes, and single-chip DSP processing for on-device analysis. The device computes RMS values, spectral content, or calibration curves locally at 30 MIPS without offloading to a host, reducing system complexity. Idle and sleep modes extend battery life between measurements, and wake-on-interrupt from sensor or button inputs enables event-driven acquisition. The 5V I/O directly drives segment LCD drivers, buzzers, and optocoupler-isolated outputs common in handheld instruments. The through-hole package also allows rework-friendly prototyping of instrument enclosures and cable harness interfaces during development iterations.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC30F2011-30I/P — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC30F2012-30I/P | DSPIC30F3012-30I/P | DSPIC30F2011-30E/P | DSPIC30F2011-20I/P |
|---|---|---|---|---|---|
| Package | 18-PDIP | 18-PDIP - same | 18-PDIP - same | 18-PDIP - same | 18-PDIP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max MIPS | 30 MIPS | 30 MIPS | 30 MIPS | 30 MIPS | 20 MIPS |
| Flash Program Memory | 12 KB (4K x 24) | 12 KB | 12 KB | 12 KB | 12 KB |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +85C | -40C to +125C (E grade) | -40C to +85C |
| Product Family | dsPIC30F Sensor Family | dsPIC30F Sensor Family | dsPIC30F general family | dsPIC30F Sensor Family | dsPIC30F Sensor Family |
| Mounting Type | Through-Hole | Through-Hole | Through-Hole | Through-Hole | Through-Hole |
| Peripheral Set | Sensor-oriented peripheral mix | Expanded sensor peripherals | Expanded general peripherals | Identical to 30I/P | Identical to 30I/P |
주요 차별점
- Sensor Family optimization at lowest 18-pin cost point (vs DSPIC30F3012-30I/P)
- Extended temperature option in identical footprint (vs DSPIC30F2011-30E/P)
- Full 30 MIPS throughput at the top speed grade (vs DSPIC30F2011-20I/P)
설계 노트
Provide a 0.1 uF ceramic decoupling capacitor directly across VDD/VSS pins, plus a 4.7 uF to 10 uF bulk capacitor near the socket. When operating at the 30 MIPS speed grade with PLL enabled, supply noise manifests as jitter and ADC inaccuracies, so a clean 5V rail or well-filtered 3.3V rail is essential. Estimated: at 30 MIPS with moderate I/O loading, current draw is on the order of tens of milliamps per Microchip typical figures - verify against the datasheet electrical characteristics table for your exact operating conditions.
The PDIP18 package is through-hole, so on a prototype breadboard keep oscillator traces short: place the crystal within 2 cm of OSC1/OSC2 with 15 pF to 33 pF load capacitors matched to the crystal specification. Route ICSP header wiring (MCLR, PGD, PGC) away from high-current motor or power-switching lines, since PGD/PGC double as general-purpose I/O and can pick up noise that corrupts in-circuit debugging sessions.
A frequent migration mistake is assuming all dsPIC30F 18-pin parts share identical pin functions: DSPIC30F2011 and DSPIC30F3012 differ in peripheral multiplexing on shared pins, so verify each pin's alternate-function map in the combined family datasheet (Microchip document 70139b) before swapping parts on an existing PCB. Also configure configuration words (oscillator source, watchdog, brown-out) during programming - incorrect oscillator configuration words are the most common cause of a 'dead' board after reprogramming.
규정 준수 정보
RoHS compliance per standard Microchip active-catalog practice for current PDIP production; confirm REACH and halogen-free status on the Microchip product page environmental data sheet before volume procurement.
