DSPIC33AK256MC506-E/M7 - 200MHz DSC FPU | Microchip
부품 번호: DSPIC33AK256MC506-E/M7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $1 | $10.00 |
| 100 | $1 | $100.00 |
| 500 | $1 | $500.00 |
| 1,000 | $1 | $1,000.00 |
DSPIC33AK256MC506-E/M7 개요
A Digital Signal Controller (DSC) combines the processing power of a digital signal processor (DSP) with the versatility of a microcontroller (MCU). DSCs are embedded processors positioned between general-purpose MCUs and high-end DSPs, designed for real-time control applications requiring intensive mathematical computation such as motor control, digital power conversion, and advanced sensing.
Key features include high-speed 40 MSPS 12-bit ADCs, high-bandwidth 100 MHz op amps with low input voltage offset, high-speed PWMs, CAN-FD connectivity, and capacitive touch sensing. The device is functional safety (FuSa) compliant, supporting safety-oriented designs. The FPU accelerates single- and double-precision floating-point arithmetic, which is critical for control loop algorithms executing at high sample rates.
Architecturally, the dsPIC33A core is a single-core 32-bit design with a DSP engine supporting MAC operations, delivering deterministic real-time performance. The rich peripheral set includes multiple UART, SPI, I2C, CAN-FD modules, analog comparators, and a 12-bit DAC. The high-speed ADC and PWM peripherals form an ideal pair for tightly coupled real-time control loops in digital power and motor drive systems.
Typical applications include motor control (PMSM, BLDC, stepper), digital power conversion (SMPS, PFC, inverters), battery management systems, industrial automation, and advanced current, voltage, and temperature sensing. The 40 MSPS ADC and 100 MHz op amps enable precise signal acquisition without external analog front-end components.
Design tip: properly decouple all VDD pins and use the internal regulator for the core voltage. Use the multiple PGECx/PGEDx pin pairs for in-circuit serial programming (ICSP), and leverage the built-in self-test and ECC features for functional safety compliance. Pricing as of 2026-08-29.
드롭인 대체품: DSPIC33AK256MC506-E/M7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33AK256MC506-I/M7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33AK512MC506
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33AK256MPS506
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33AK64MC105-E/M7
⚡ 동일 패키지 ⚠️ 사양 미검증✓ 재고 있음
$3.95 / 개
데이터시트 보기 →DSPIC33AK256MC506-E/M7 최대 정격 & 전기적 특성
| Core | 32-bit dsPIC33A single-core |
| Core Speed | 200 MHz |
| Flash Memory | 256 KB |
| SRAM | 64 KB |
| FPU | 32/64-bit Floating-Point Unit |
| ADC Resolution | 12-bit |
| ADC Sampling Rate | 40 MSPS |
| Integrated Op Amps | 100 MHz bandwidth, low input voltage offset |
| CAN Interface | CAN-FD |
| Touch Sensing | Yes |
| Functional Safety | FuSa-compliant |
| PWM | High-speed PWMs |
| 동작 온도 | -40C to +125C |
| 패키지 | 64-VQFN (9x9 mm) |
| 실장 유형 | Surface Mount |
| Programming | ICSP via PGECx/PGEDx pairs |
DSPIC33AK256MC506-E/M7 64-vqfn (9x9 mm) 핀 구성 가이드
DSPIC33AK256MC506-E/M7(64-vqfn (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33AK256MC506-E/M7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33AK256MC506-E/M7 적합 용도: 6 애플리케이션s: PMSM/BLDC Motor Control, Digital Power Conversion (SMPS/PFC/Inverters), Battery Management Systems, Advanced Sensing and Signal Conditioning, Industrial Automation and HMI, Automotive Body Control and Auxiliary Systems.
PMSM/BLDC Motor Control
The DSPIC33AK256MC506-E/M7 fits motor control because its 40 MSPS 12-bit ADCs sample phase currents with sub-microsecond latency while the 200 MHz core and double-precision FPU execute field-oriented control (FOC) loops deterministically. High-speed PWMs provide fine duty resolution for inverter switching. Place the DSC between current-sense amplifiers and gate drivers, running the current loop at 20-50 kHz; the integrated 100 MHz op amps can condition shunt signals, reducing BOM cost versus an external analog front end.
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Digital Power Conversion (SMPS/PFC/Inverters)
Digital power designs benefit from the DSC's tightly coupled ADC-PWM architecture: the 40 MSPS ADC captures input/output voltage and current instantly, and high-speed PWMs adjust duty cycles within one control cycle. The 200 MHz core with FPU handles nonlinear control laws and double-precision compensation math. FuSa compliance supports safety-relevant power stages. Typical usage: PFC or LLC control loops at 100-500 kHz switching frequency, with CAN-FD available for digital telemetry to system hosts.
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Battery Management Systems
The 12-bit 40 MSPS ADCs and precision 100 MHz op amps enable accurate cell voltage and pack current measurement, while the FuSa-compliant architecture with ECC and self-test supports safety-critical BMS firmware. The 256KB Flash stores state-of-charge estimation algorithms, and CAN-FD connects to vehicle or inverter controllers. Operating from -40C to +125C covers battery pack environments. Trade-off: for high cell-count packs, pair with a dedicated battery monitor AFE for per-cell measurement.
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Advanced Sensing and Signal Conditioning
Integrated 100 MHz bandwidth op amps with low input voltage offset condition sensor signals directly on-chip, and the 40 MSPS 12-bit ADCs digitize them without external amplifiers - a significant BOM and board-area saving. The double-precision FPU executes FFT and filtering algorithms for spectral analysis. Suitable for current, voltage, and temperature sensing nodes requiring fast, synchronized sampling; the touch-sensing module adds capacitive UI without extra ICs.
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Industrial Automation and HMI
The combination of CAN-FD, multiple UART/SPI/I2C ports, and capacitive touch sensing makes this DSC a single-chip solution for industrial nodes that need both control and user interface. The 200 MHz core with FPU runs PID loops and communication stacks concurrently. Extended -40C to +125C temperature range suits factory floor environments. The FuSa compliance assists machine-safety subsystem designs requiring documented functional safety workflows.
추천
Automotive Body Control and Auxiliary Systems
For automotive-adjacent subsystems, the DSC offers CAN-FD networking, touch sensing for capacitive buttons, and high-speed PWM for LED drivers and small motor loads, all in one 64-VQFN device. The -40C to +125C extended grade matches underhood-adjacent zones. While this standard part is not AEC-Q100 listed in provided data, its FuSa features and analog integration reduce system component count. Verify qualification status for your specific automotive program before release.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33AK256MC506-E/M7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33AK256MC506-I/M7 | DSPIC33AK512MC506 | TMS320F280041C-Q1 |
|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | HTQFP-64 - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Texas Instruments |
| Core Speed | 200 MHz | 200 MHz | 200 MHz | 100 MHz |
| Flash Memory | 256 KB | 256 KB | 512 KB | 128 KB |
| FPU | 32/64-bit double precision | 32/64-bit | 32/64-bit | TMU + FPU32 |
주요 차별점
- 40 MSPS 12-bit ADCs with on-chip 100 MHz op amps (vs TMS320F280041C-Q1)
- Double-precision (64-bit) FPU (vs TMS320F280041C-Q1)
- Extended temperature option with same die (vs DSPIC33AK256MC506-I/M7)
설계 노트
Decouple all VDD pins with 0.1uF ceramic capacitors placed within 2mm of each pin, plus bulk capacitance at the board level. Use the internal regulator for core voltage - do not drive the core rail externally. Follow the Microchip power distribution guidelines in the dsPIC33A datasheet power section for capacitor values and layout.
For ICSP programming/debugging, use PGECx/PGEDx pins as matched pairs: if PGEC2 carries ICSPCLK, ICEDAT must be on PGED2. Route these traces away from PWM switching nodes to prevent corruption of in-circuit debug sessions. Connect all VSS and VDD pins during programming per NorthernSoftware dsPIC33AK support notes.
The 64-VQFN (9x9 mm) exposed pad should be soldered to a grounded copper pour for thermal dissipation - a 125C max junction with high switching PWM activity demands good thermal design. For functional safety use, enable the built-in self-test and ECC features in firmware initialization; they are not active by default in all configurations.
규정 준수 정보
Compliance data not present in provided verified web data. FuSa (functional safety) compliant per Mouser listing. Verify RoHS/REACH status on Microchip product page.
