DSPIC33CH64MP506-E/MR - Dual-Core 100MHz DSC 64KB Flash | Microchip
부품 번호: DSPIC33CH64MP506-E/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $5.15 | $515.00 |
| 500 | $4.68 | $2,340.00 |
| 1,000 | $4.25 | $4,250.00 |
DSPIC33CH64MP506-E/MR 개요
A digital signal controller combines the computational power of a digital signal processor (DSP) with the peripheral integration and control architecture of a microcontroller (MCU). Within the power-management IC hierarchy, the dsPIC33CH family sits at the top of Microchip's 16-bit DSC lineup, targeting closed-loop control systems that require sophisticated algorithms executed in parallel with housekeeping tasks.
Key features include the asymmetric dual-core architecture: the primary core runs user interface and communication stacks while the secondary core is dedicated to time-critical control loops with code-transparent message-based IPC. The high-resolution PWM module delivers sub-nanosecond duty-cycle resolution for precision power conversion, and the CAN Flexible Data (CAN FD) interface supports modern automotive and industrial networks. Eight DMA channels and multiple serial ports (UART, SPI, I2C) round out the peripheral set.
Architecturally, the 16-bit modified Harvard pipeline with DSP multiply-accumulate instructions enables efficient execution of compensator algorithms such as 3P3Z and PID loops at switching frequencies well above 100 kHz. Dual-core partitioning lets engineers update firmware on one core without disturbing the safety-critical control loop on the other.
Typical applications include digital power supplies (server PSU, telecom rectifiers, wireless charging), brushless DC and PMSM motor control (drones, industrial drives), automotive sensors, and power factor correction stages.
For design, allocate the secondary core to the switching control loop and reserve the primary core for CAN FD communication and supervisory logic; the E-grade temperature rating requires verifying junction temperature against the QFN thermal pad copper area.
This page synthesizes distributor inventory, drop-in alternatives, and practical dual-core partitioning design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33CH64MP506-E/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33CH64MP506-E/MR (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Operating Temperature, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33CH64MP506-I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CH64MP506-H/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CH512MP506-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.45 / 개
데이터시트 보기 →DSPIC33CH64MP506-E/MR 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dual-core (asymmetric) dsPIC33CH |
| Primary Core Speed | 100 MHz |
| Family Max Speed | 180 MHz, 200 MHz (per DigiKey listing) |
| Program Flash | 64 KB |
| SRAM | 20 KB (16K + 4K) |
| CAN Interface | CAN Flexible Data (CAN FD) |
| PWM Module | High-Resolution PWM |
| DMA Channels | 8 |
| 패키지 | 64-QFN (9x9 mm) |
| 핀 수 | 64 |
| 동작 온도 | -40C to +125C (E grade) |
| 실장 유형 | Surface Mount |
| Serial Interfaces | 3 serial I/O ports (per Microchip USA listing) |
| Safety Qualification | Functional Safety (FuSa) supported |
DSPIC33CH64MP506-E/MR 64-qfn (9x9 mm) 핀 구성 가이드
DSPIC33CH64MP506-E/MR(64-qfn (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33CH64MP506-E/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33CH64MP506-E/MR 적합 용도: 6 애플리케이션s: Server and Telecom Power Supplies, Wireless Power Transfer, Drone ESC and Motor Control, Automotive Sensor Modules, Industrial Motor Drives, Digital Lighting and PFC Stages.
Server and Telecom Power Supplies
The DSPIC33CH64MP506-E/MR fits digital power supply designs where a switching controller must execute high-frequency control loops while supporting digital telemetry. The secondary core runs the voltage-mode or current-mode compensator against the high-resolution PWM outputs, while the primary core services CAN FD or PMBus-style communication demanded in server racks. With 64 KB Flash and 20 KB SRAM, a full 3P3Z compensator plus protection state machines fit comfortably. The E-grade -40C to +125C rating tolerates hot airflow near rectifier stages. Placing the DSC between the sense dividers and the power stage replaces analog error amplifiers, enabling adaptive dead-time and mode switching that improves light-load efficiency.
추천
Wireless Power Transfer
Wireless charging transmitters require precise, phase-adjusted drive of resonant half-bridges with fast foreign-object detection and power-negotiation logic. The DSPIC33CH64MP506-E/MR's high-resolution PWM generates the fine phase offsets needed to regulate delivered power smoothly across the coupling range, while the asymmetric dual-core split keeps the resonant control loop on the dedicated secondary core, isolated from negotiation and fault-handling code on the primary core. The 100 MHz primary clock provides ample MIPS for frequency-tracking algorithms. Integrated comparators and the 8-channel DMA keep ADC sampling of coil current and voltage deterministic without CPU intervention, and CAN FD links the charger to vehicle or base-station controllers.
추천
Drone ESC and Motor Control
Drone electronic speed controllers (ESCs) demand field-oriented control executed at loop rates far above the visible mechanical dynamics, plus CAN or serial telemetry to the flight controller. The DSPIC33CH64MP506-E/MR dedicates its secondary core to FOC current loops using high-resolution PWM outputs, achieving low torque ripple for multirotor motors, while the primary core handles command decoding and safety supervision. The 20 KB SRAM accommodates per-phase current histories for fault diagnostics. Its E-grade temperature rating survives the thermally constrained airframes near power MOSFETs, and the 64-QFN 9x9 mm footprint fits dense ESC boards where board area and mass directly affect flight time.
추천
Automotive Sensor Modules
Automotive sensor nodes - position, pressure, and current sensing modules - require deterministic processing, robust networking, and extended temperature capability. The DSPIC33CH64MP506-E/MR provides the -40C to +125C E-grade range and CAN FD interface that modern in-vehicle networks demand, while its dual-core design segregates safety-relevant signal conditioning (secondary core) from diagnostic and bus-protocol handling (primary core). The Functional Safety (FuSa) support noted in distributor listings assists ISO 26262-oriented development flows. The 64-pin QFN's remappable peripheral pins let one PCB design serve multiple sensor variants by reassigning ADC, PWM, and communication pin functions in firmware rather than respinning hardware.
추천
Industrial Motor Drives
Industrial drives for conveyors, pumps, and robotics benefit from the DSPIC33CH64MP506-E/MR's combination of control performance and communication integration. The secondary core executes sensorless or encoder-based FOC with the high-resolution PWM stage, while the primary core runs industrial protocol stacks over CAN FD for factory automation networks. Eight DMA channels offload multi-channel ADC sampling of phase currents and the DC bus, keeping loop jitter minimal. The 64 KB Flash supports a complete drive firmware including ramp generators, protection ladders, and parameter storage. Extended -40C to +125C operation suits drives mounted inside sealed enclosures near switching power stages without forced-air cooling margins.
추천
Digital Lighting and PFC Stages
Power factor correction front-ends and high-power LED drivers use average-current-mode control that benefits from the DSPIC33CH64MP506-E/MR's high-resolution PWM and fast analog comparators. The secondary core closes the PFC current loop against the PWM peripherals while the primary core manages dimming interfaces, fault reporting, and housekeeping. In LED driver designs, the controller's ability to implement adaptive burst modes improves efficiency across dimming ranges. The CAN FD interface integrates luminaires into smart-building networks. With 64 KB Flash, both the control algorithm and DALI/DMX-style protocol layers coexist, and the E-grade rating covers enclosed driver housings where ambient temperatures regularly exceed 85C.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33CH64MP506-E/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33CH64MP506-I/MR | DSPIC33CH64MP506-H/MR | DSPIC33CH512MP506-I/MR |
|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64 KB | 64 KB | 64 KB | 512 KB |
| Core Configuration | Dual-core 16-bit dsPIC33CH | Dual-core 16-bit dsPIC33CH | Dual-core 16-bit dsPIC33CH | Dual-core 16-bit dsPIC33CH |
| CAN FD | Yes | Yes | Yes | Yes |
주요 차별점
- Extended temperature range for harsh environments (vs DSPIC33CH64MP506-I/MR)
- 8x more program memory available in same footprint (vs DSPIC33CH512MP506-I/MR)
- Cost-optimized entry into the dual-core dsPIC33CH family (vs DSPIC33CH128MP508-E/PT)
설계 노트
Decouple all VDD and AVDD pins with 0.1 uF ceramic capacitors placed within 2 mm of each pin, plus one bulk 10 uF capacitor per power domain. The dsPIC33CH requires the analog supply (AVDD) to be filtered separately from digital VDD - use an RC or ferrite filter to keep ADC noise low in digital power applications where phase-current sampling accuracy directly affects control loop stability. Follow Microchip's dsPIC33CH hardware design guidelines for the MCLR pull-up and ICSP programming header placement.
The 64-QFN (9x9 mm) package has a central exposed thermal pad that must be soldered to a grounded copper pour with an array of thermal vias. For high PWM-output designs driving power stages, keep the PWM routing away from the ADC input traces and CAN FD pairs; CAN FD routing should follow 120-ohm differential impedance rules on the bus side. Use the peripheral pin select (PPS) feature in firmware to assign high-d Edges away from noisy pins during layout review.
Dual-core development has a well-known pitfall: the secondary core must be programmed with its own project output, and a mismatch between primary-core boot code and the secondary-core image causes silent startup failure. Always flash both cores together using the combined build artifact in MPLAB X. Also, per Northern Software's dsPIC33CH64MP506 notes, secondary-core debug access via S1MCLRx pins may require a pull-up resistor to establish reliable debug sessions. Verify the E-grade part is actually ordered when 125C operation is required.
규정 준수 정보
Compliance certificates were not present in the retrieved web data. Confirm RoHS/REACH status via the Microchip compliance portal or distributor certificate download before procurement.
