DSPIC33CK256MC502-I/M6 - 100MHz 16-bit DSC CAN FD | Microchip
부품 번호: DSPIC33CK256MC502-I/M6 ✓ 활성DSPIC33CK256MC502-I/M6 개요
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and deterministic interrupt structure of a microcontroller, occupying the middle tier of the embedded control hierarchy between general-purpose MCUs and standalone DSPs. The dsPIC33CK family extends this concept with a pipelined, DSP-enhanced core targeting real-time closed-loop control loops running at hundreds of kilohertz.
Key features include the 100 MIPS single core with DSP multiply-accumulate instructions, dual on-chip op-amps that offload analog front-end signal conditioning, a 12-bit high-speed ADC for simultaneous multi-channel sampling, and the high-resolution PWM module essential for digital power conversion. CAN FD (Flexible Data-Rate) support enables modern in-vehicle and industrial networking at up to 8 Mbps data phase, per the Microchip dsPIC33CK256MC502 product family description.
Architecturally, the device belongs to Microchip's dsPIC33CK256MC50X family, which shares one silicon design across memory and pin-count variants, so code written for the 128 KB sibling runs unchanged on this 256 KB part. Mouser lists the part as a 16-bit DSC with OpAmps, 12-bit ADC, PWM, and CAN FD.
Typical applications include brushless DC (BLDC) and PMSM motor control, digitally controlled switch-mode power supplies and power factor correction stages, and automotive or industrial CAN FD nodes.
Design consideration: the 28-pin UQFN 4x4 mm package requires careful exposed-pad grounding and 0.1 uF decoupling at every VDD pin to preserve ADC accuracy at 100 MIPS.
This page adds value beyond the manufacturer datasheet by synthesizing distributor listing data, drop-in family alternatives, temperature-grade substitution guidance, and application-level design notes in one place.
드롭인 대체품: DSPIC33CK256MC502-I/M6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
DSPIC33CK128MC502-I/M6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK64MC502-I/M6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK256MC502-E/M6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK256MC502-H/M6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK256MC503-I/M6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK256MC502-I/M6 최대 정격 & 전기적 특성
| Core | dsPIC33CK 16-bit DSC |
| Core Speed | 100 MHz (100 MIPS) |
| Flash Program Memory | 256 KB |
| RAM | 32 KB |
| ADC Resolution | 12-bit |
| On-chip Op-Amps | Yes (integrated op-amps) |
| PWM | High-Speed PWM |
| CAN Interface | CAN FD (Flexible Data-Rate) |
| 동작 온도 | -40C to +125C (I grade) |
| 패키지 | 28-pin UQFN (M6), 4x4 mm |
| 실장 유형 | Surface Mount |
| Programming Interface | ICSP (In-Circuit Serial Programming), PGECx/PGEDx pairs |
| Debug Support | In-circuit debugging via MPLAB (e.g., MPLAB SNAP) |
| RoHS 상태 | ROHS3 Compliant |
| Core Type (per family) | Single dsPIC DSC core with integrated DSP |
DSPIC33CK256MC502-I/M6 핀 구성
| 핀 1 | VDD — Power supply |
| 핀 2 | AN0/RA0 — Analog input 0 / digital I/O |
| 핀 3 | AN1/RA1 — Analog input 1 / digital I/O |
| 핀 4 | PGED3/AN2/RB0 — Programming data 3 / analog input 2 / digital I/O |
| 핀 5 | PGEC3/AN3/RB1 — Programming clock 3 / analog input 3 / digital I/O |
| 핀 6 | PGED1/AN4/RB2 — Programming data 1 / analog input 4 / digital I/O |
| 핀 7 | PGEC1/AN5/RB3 — Programming clock 1 / analog input 5 / digital I/O |
| 핀 8 | AN6/RB4 — Analog input 6 / digital I/O |
| 핀 9 | AN7/RB5 — Analog input 7 / digital I/O |
| 핀 10 | OPA1OUT/AN8/RB6 — Op-amp 1 output / analog input 8 / digital I/O |
| 핀 11 | OPA1INP/AN9/RB7 — Op-amp 1 non-inverting input / analog input 9 |
| 핀 12 | OPA2OUT/AN10/RB8 — Op-amp 2 output / analog input 10 / digital I/O |
| 핀 13 | OPA2INP/AN11/RB9 — Op-amp 2 non-inverting input / analog input 11 |
| 핀 14 | VSS — Ground |
| 핀 15 | AN12/RB10 — Analog input 12 / digital I/O |
| 핀 16 | AN13/RB11 — Analog input 13 / digital I/O |
| 핀 17 | PGED2/AN14/RB12 — Programming data 2 / analog input 14 / digital I/O |
| 핀 18 | PGEC2/AN15/RB13 — Programming clock 2 / analog input 15 / digital I/O |
| 핀 19 | RB14 — Digital I/O |
| 핀 20 | RB15 — Digital I/O |
| 핀 21 | PWM1H/RD0 — High-speed PWM output / digital I/O |
| 핀 22 | PWM1L/RD1 — High-speed PWM output / digital I/O |
| 핀 23 | PWM2H/RD2 — High-speed PWM output / digital I/O |
| 핀 24 | PWM2L/RD3 — High-speed PWM output / digital I/O |
| 핀 25 | C1TX/RG0 — CAN FD transmit / digital I/O |
| 핀 26 | C1RX/RG1 — CAN FD receive / digital I/O |
| 핀 27 | MCLR — Master clear reset / programming voltage input |
| 핀 28 | VSS/EP — Ground / exposed thermal pad |
일반적인 애플리케이션
DSPIC33CK256MC502-I/M6 적합 용도: 6 애플리케이션s: BLDC / PMSM Motor Control, Digital Power Conversion (PFC / LLC), Automotive CAN FD Network Nodes, Industrial Automation and Control Panels, LED Lighting and Electronic Ballasts, Portable and Battery-Powered Instruments.
BLDC / PMSM Motor Control
The DSPIC33CK256MC502-I/M6 fits sensored and sensorless field-oriented-control (FOC) motor drives because its 100 MIPS DSP core executes Clarke/Park transforms and PI current loops with cycles to spare at switching frequencies in the tens of kilohertz. The high-speed PWM module provides complementary outputs with dead-time insertion for three-phase inverters, while the integrated op-amps condition low-side shunt currents before the 12-bit ADC samples them. In a typical FOC loop the controller reads phase currents, computes the dq-axis correction, and updates PWM duty in a single interrupt period; the 256 KB Flash holds the control firmware plus parameter tables, startup routines, and fault logs. Design consideration: route shunt sensing close to the op-amp inputs and decouple the analog supply to protect ADC accuracy from PWM switching noise.
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Digital Power Conversion (PFC / LLC)
Switch-mode power supplies such as boost power-factor-correction stages and LLC resonant converters benefit directly from this DSC's architecture. The high-speed PWM supports frequency, phase-shift, and burst-mode modulation with fine resolution, and the 100 MHz core closes voltage and current loops at bandwidths that analog-only controllers reach only with external compensation networks. The 12-bit ADC can sample input/output voltage and inductor current with programmable triggers synchronized to PWM events, minimizing switching-noise correlation in readings. Because the control law lives in firmware, a single DSPIC33CK256MC502-I/M6 can be re-tuned for different output voltages or topologies without hardware revision - a major advantage over fixed-function controllers. The CAN FD interface additionally enables digital telemetry and fault reporting to a system supervisor in telecom rectifiers or server power shelves.
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Automotive CAN FD Network Nodes
Body-control sub-nodes, sensor hubs, and actuator controllers in vehicles increasingly require CAN FD's larger payloads and faster data phase, and this device provides the CAN FD peripheral natively. The -I grade covers -40C to +125C; designers needing 150C ambient capability can drop in the pin-compatible DSPIC33CK256MC502-H/M6 without PCB changes. The 256 KB Flash supports bootloader plus application images for field firmware updates over CAN (UDS-style workflows), while the 32 KB RAM buffers network stacks and message queues. The 12-bit ADC and op-amps allow local analog sensing (currents, positions, temperatures) on the same chip, reducing BOM count in distributed modules. Design note: always pair the CAN FD pin with an appropriate external CAN FD transceiver and follow the transceiver manufacturer's termination and layout guidance for 8 Mbps data-phase operation.
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Industrial Automation and Control Panels
In PLC-style I/O modules, small drives, and smart sensors, the DSPIC33CK256MC502-I/M6 delivers deterministic control with DSP math capability that conventional 16-bit MCUs lack. The industrial -40C to +125C rating suits cabinet-mounted electronics, and ROHS3 compliance simplifies CE-market deployment. The integrated op-amps amplify RTD, shunt, or strain-gauge signals on-chip, feeding the 12-bit ADC for closed-loop control without an external analog front end. The 256 KB Flash accommodates Modbus or CANopen stacks alongside the application, and ICSP via any PGECx/PGEDx pair supports in-panel firmware servicing. Designers should implement watchdog supervision and brown-out protection as recommended in the datasheet to meet industrial reliability expectations, and should dedicate matched PGEC/PGED pin pairs to a service header for field programming access.
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LED Lighting and Electronic Ballasts
High-power LED drivers and dimmable luminaires use this DSC's high-speed PWM for constant-current regulation, phase-cut dimming decode, and multi-channel color mixing. Running the control loop at 100 MIPS allows the firmware to enforce per-cycle current limiting while simultaneously executing communication stacks (DALI over UART or DMX over UART), something fixed-function LED controllers cannot do. The 12-bit ADC with op-amp front end reads LED current from a shunt and the thermistor for thermal derating, protecting the luminaire from overstress. The 256 KB Flash supports color-calibration tables and multiple preset profiles. Because the PWM module is synchronized to the ADC, dimming at high resolution does not inject sampling artifacts, keeping visible flicker low - a key requirement in camera-exposed environments such as broadcast studios.
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Portable and Battery-Powered Instruments
Handheld measurement tools, gas detectors, and portable diagnostic devices benefit from the DSP math core for sensor signal processing (FFT-based analysis, digital filtering) while retaining microcontroller-class peripherals for user interface and connectivity. The 28-pin UQFN 4x4 mm package minimizes PCB area for compact enclosures, and the integrated op-amps reduce external analog component count - important where board space and BOM cost dominate. Designers should profile sleep and idle modes from the datasheet to build the low-power duty cycle, since the verified data for this page did not include quiescent-current figures; treat battery-life estimates as pending measurement. CAN FD or UART links allow docking-station communication, and ICSP headers enable in-field firmware updates without opening sealed enclosures, provided the PGEC/PGED pair is brought to a test pad.
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추천 제품 요약
엔지니어링 참조 데이터: DSPIC33CK256MC502-I/M6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33CK128MC502-I/M6 | DSPIC33CK64MC502-I/M6 | DSPIC33CK256MC502-E/M6 | DSPIC33CK256MC502-H/M6 | DSPIC33CK256MC503-I/M6 |
|---|---|---|---|---|---|---|
| Package | 28-pin UQFN (M6), 4x4 mm | 28-pin UQFN (M6) - same | 28-pin UQFN (M6) - same | 28-pin UQFN (M6) - same | 28-pin UQFN (M6) - same | 28-pin UQFN (M6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | Up to 150C grade per Microchip USA listing | 100 MHz (100 MIPS) |
| Flash Program Memory | 256 KB | 128 KB | 64 KB | 256 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | Extended (E grade) | -40C to +150C | -40C to +125C |
| CAN FD | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Largest Flash in the 28-pin M6 family members (vs DSPIC33CK128MC502-I/M6)
- Standard 125C industrial rating at lowest cost (vs DSPIC33CK256MC502-H/M6)
- Integrated analog front end (vs Generic 16-bit MCUs)
설계 노트
In the 28-pin UQFN (M6) 4x4 mm package, connect the exposed thermal pad to a solid VSS copper pour with an array of via stitches; this pad is both the primary ground return and the thermal path for a 100 MHz core. Decouple every VDD pin with 0.1 uF ceramic placed within 2 mm of the pin, plus one bulk 4.7-10 uF capacitor near the supply entry. Per programming-tool documentation (northernsoftware.com), all VDD and VSS pins must be connected during ICSP operation, so do not leave supply pins unbroken to headers.
The dsPIC33CK256MC502 provides multiple PGECx/PGEDx pairs, and ICSP requires a matched pair: if ICSPCLK uses PGEC2, then ICSPDAT must use PGED2. Bring your chosen pair (plus MCLR) to a 5- or 6-pin programming header or edge test pads, keeping the traces short and away from the high-speed PWM nets to avoid capacitively coupled glitches during programming. Dedicated pairs such as PGED1/PGEC1 on pins 6-7 are commonly chosen because they avoid multiplexed analog pins used by the op-amp front end.
Temperature-grade suffixes matter for sourcing: -I/M6 (125C), -E/M6 (extended), and -H/M6 (150C per Microchip USA) share the same footprint, so a purchasing substitution of an E or H part is electrically safe, but substituting a 128 or 64 KB sibling silently halves or quarters Flash - verify the memory code in your BOM check. Also note the -H grade is listed at a 64 MHz CMOS core rating by Microchip USA while the standard part runs at 100 MHz; confirm the target frequency against the grade-specific datasheet before switching grades in speed-critical control loops.
규정 준수 정보
Distributor listing (full-electronic.com) states ROHS3 Compliant for the DSPIC33CK256MC502-I/M6. REACH, halogen-free and conflict-minerals status were not stated in the provided data.