DSPIC33CK256MC506-I/MR - 100 MIPS DSC 256KB Flash CAN FD | Microchip
부품 번호: DSPIC33CK256MC506-I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.62 | $5.62 |
| 10 | $5.05 | $50.50 |
| 25 | $4.82 | $120.50 |
| 100 | $4.44 | $444.00 |
| 1,000 | $3.92 | $3,920.00 |
DSPIC33CK256MC506-I/MR 개요
A Digital Signal Controller combines the computational throughput of a digital signal processor with the deterministic control architecture and peripheral set of a microcontroller. Within the embedded control hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, making the dsPIC33CK family a voltage-regulator-free single-chip solution for closed-loop power conversion and motor control, where sensing, computation, and PWM generation must complete within one switching cycle.
Key features of this device include the 100 MIPS 16-bit core with DSP multiply-accumulate instructions, 256 KB (256K x 8) of on-chip Flash and 32 KB (32K x 8) of RAM, and a supply range of 3V to 3.6V. The device provides 53 general-purpose I/O, on-chip op amps for current-sense amplification, a 12-bit ADC supporting simultaneous multi-channel sampling, high-resolution PWM peripherals for switching converter and inverter control, and a CAN Flexible Data-Rate (CAN FD) interface for industrial and automotive networking.
The dsPIC33CK core architecture decouples instruction fetch from execution with a pipelined design, allowing single-cycle MAC operations that are essential for field-oriented control (FOC) of PMSM/BLDC motors and for digital power loops running at hundreds of kilohertz. Peripherals such as the high-speed PWM with dead-time insertion and fault inputs offload timing-critical tasks from software, improving loop determinism and safety.
Typical applications include brushless DC and permanent-magnet motor drives for industrial automation, digitally controlled switched-mode power supplies and PFC stages, and CAN FD-connected sensing and control nodes in automotive and factory systems. The integrated op amps and 12-bit ADC reduce external component count in current-sense feedback paths.
When designing with this device, provide a stable 3.3V supply and adequate decoupling on all VDD pins, and account for the QFN exposed pad as the primary ground and thermal path. Flash programming is supported via ICSP and debug via the standard Microchip tool ecosystem.
This page synthesizes distributor pricing, drop-in family alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33CK256MC506-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33CK256MC506-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Core, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33CK256MC506-E/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK256MC506-H/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK128MC506-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK64MC506-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK256MC504-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK256MC506-I/MR 최대 정격 & 전기적 특성
| Core | 16-bit dsPIC DSC |
| Core Speed | 100 MHz (100 MIPS) |
| Flash Memory | 256 KB (256K x 8) |
| RAM | 32 KB (32K x 8) |
| 공급 전압 | 3 V to 3.6 V |
| GPIO Count | 53 I/O |
| ADC Resolution | 12-bit |
| CAN Interface | CAN FD |
| Op Amps | Integrated (on-chip) |
| PWM | High-Speed PWM |
| 동작 온도 | -40C to +85C (I grade) |
| 패키지 | 64-QFN (9x9 mm) |
| 실장 유형 | Surface Mount |
| Product Family | dsPIC33CK256MC506 |
| Functional Safety Support | FuSa capable (per distributor listing) |
| Typical Applications | Motor control, digital power, general embedded control |
DSPIC33CK256MC506-I/MR 64-qfn (9x9 mm) 핀 구성 가이드
DSPIC33CK256MC506-I/MR(64-qfn (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33CK256MC506-I/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33CK256MC506-I/MR 적합 용도: 6 애플리케이션s: BLDC/PMSM Motor Control, Digital Power Conversion (PFC, LLC, Totem-Pole), Industrial Automation and CAN FD Networks, Advanced Sensing and Signal Conditioning, Automotive-Adjacent Control Nodes, General-Purpose High-Performance Embedded Control.
BLDC/PMSM Motor Control
The DSPIC33CK256MC506-I/MR fits sensorless and sensored motor drives because its 100 MIPS core executes field-oriented control with single-cycle MAC instructions while the high-speed PWM generates complementary outputs with hardware dead-time insertion and cycle-synchronized ADC triggers. Integrated op amps amplify low-side shunt currents, feeding the 12-bit ADC without external amplifier ICs, reducing BOM cost and offset errors. In a typical 48V BLDC drive switching at 20-50 kHz, current-loop bandwidth of several kHz is achievable with deterministic single-cycle loop latency. The CAN FD interface links the drive to industrial networks, and 256 KB Flash holds FOC, protocol, and diagnostics firmware with margin. Microchip's EV19G29A motor control PIM demonstrates this exact configuration.
추천
Digital Power Conversion (PFC, LLC, Totem-Pole)
Digital power supplies benefit from this DSC's combination of high-resolution PWM and fast, deterministic control loops. The 100 MHz core closes voltage and current loops at switching frequencies well beyond 100 kHz for LLC and totem-pole PFC stages, while the 12-bit ADC samples output voltage and shunt currents synchronized to PWM edges to avoid switching-noise corruption. The dsPIC33CK family is explicitly positioned by Microchip for digital power applications. The 3V-3.6V supply and CAN FD enable rack-level telemetry in server and telecom rectifiers. Firmware-based control also enables soft-start profiles, burst mode, and adaptive dead-time tuning that analog controllers cannot match, improving light-load efficiency measurements by several percentage points in typical designs.
추천
Industrial Automation and CAN FD Networks
Factory automation nodes require deterministic control and robust networking, both native on this device. The CAN FD interface operates at higher data rates than classical CAN, fitting Industrial 4.0 gateways, sensor aggregates, and drive sub-networks. The 53 GPIO and multiple serial peripherals connect encoders, sensors, and HMI elements, while 256 KB Flash accommodates protocol stacks plus application logic. Operating from a single 3.3V rail with -40C to +85C rating suits cabinet-mounted electronics. The DSP engine performs inline vibration or current-signature analysis for predictive maintenance without a second processor. The FuSa-capable designation noted in distributor listings supports safety-relevant development flows common in machinery compliance programs.
추천
Advanced Sensing and Signal Conditioning
The integrated op amps plus 12-bit ADC make this DSC a compact analog front-end controller for multi-channel sensing systems such as battery pack monitors, pressure and flow instrumentation, and current-sensing nodes. The op amps buffer small sensor signals before ADC conversion, eliminating external amplifier ICs and their offset/tolerance stack-up. The 100 MIPS DSP core applies digital filtering (IIR/FIR) and spectral analysis on-chip, so raw measurements become conditioned engineering units in real time. The 64-QFN (9x9 mm) footprint keeps analog routing short, and the 3V-3.6V supply range matches standard industrial logic rails. CAN FD or UART links publish results to supervisory controllers in distributed measurement topologies.
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Automotive-Adjacent Control Nodes
While the -I temperature grade suits -40C to +85C environments, this DSC serves auxiliary automotive-adjacent systems such as e-bike controllers, warehouse AGV drives, and off-highway equipment sub-controllers where the extended-grade -E/MR variant (100% drop-in) can be specified for +125C zones. The CAN FD interface integrates with modern vehicle and machine bus architectures, and the high-speed PWM drives auxiliary motors, pumps, and actuators with field-oriented control quality. The DSP core handles torque ripple compensation and sensorless start algorithms. Choosing within the same package family lets a single PCB design span commercial and extended temperature builds by swapping only the controller MPN suffix.
추천
General-Purpose High-Performance Embedded Control
For embedded products needing more compute than a PIC16/PIC18-class MCU - appliances, HVAC compressors, pumps, lighting power stages - the DSPIC33CK256MC506-I/MR provides a 100 MIPS single-chip solution with rich peripherals and 256 KB Flash. The dsPIC DSC architecture retains deterministic interrupt behavior while adding DSP instructions for tasks like harmonic compensation, audio processing, or adaptive filtering. The 32 KB RAM supports state machines, communication buffers, and small data loggers without external memory. Development tooling (MPLAB X, XC16, ICD 4/PICkit 4) is shared across the Microchip 16-bit portfolio, reducing team learning curves, and the PIM ecosystem allows evaluation on existing explorer boards before committing PCB spins.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33CK256MC506-I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33CK256MC506-E/MR | DSPIC33CK256MC506-H/MR | DSPIC33CK128MC506-I/MR |
|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB |
| CAN FD | Yes | Yes | Yes | Yes |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
주요 차별점
- Integrated op amps reduce analog BOM (vs DSPIC33CK128MP506-E/MR)
- Extended temperature availability in the same footprint (vs DSPIC33CK256MC506-E/MR)
- 256 KB Flash provides firmware growth margin (vs DSPIC33CK128MC506-I/MR)
설계 노트
The 64-QFN (9x9 mm) exposed pad is the primary ground and thermal path. Design the land pattern with an array of thermal vias (typically 5x5, 0.3 mm drill, filled or tented) connecting to the internal ground plane, and ensure the stencil aperture covers at least 70% of the pad to avoid solder voiding. Per the dsPIC33CK256MC506 General Purpose PIM information sheet, Microchip reference designs use solid ground pours directly beneath the device. Inspect for QFN center-pad wetting during first-article X-ray, as voids degrade both ground integrity and thermal performance in motor-drive environments.
Supply the device from a clean 3.3V rail within the 3V to 3.6V datasheet range. Place 100 nF ceramic decoupling capacitors at every VDD pin within 2 mm of the package, with one bulk capacitor (4.7 uF to 10 uF) near the corner of the QFN. In digital power and motor-control applications, keep the controller ground referenced to a quiet analog star point - high dV/dt PWM switching couples into shared returns and shows up as ADC noise. Estimated: 100 MIPS operation with typical peripheral loading keeps core current well under 100 mA, but verify per DS70005473C electrical characteristics for your exact peripheral configuration.
Use the PWM-synchronized ADC trigger to sample phase currents during the PWM off-time window, avoiding switching-edge transients that corrupt 12-bit readings. Route op-amp input traces as short Kelvin connections directly to shunt resistors. Keep CAN FD stub lengths under 10 cm and terminate the bus at both ends (typically 120 ohm). For QFN breakout, avoid routing fast PWM outputs diagonally across the ADC input quadrant of the package; Microchip's motor control PIM schematics show grouped analog/digital floorplanning that serves as a proven reference layout.
규정 준수 정보
Compliance data not present in the provided verified web data; consult Microchip's product page or the distributor environmental data before specification. The device is marked FuSa-capable in distributor listings (functional safety support), which is not an AEC-Q100 qualification.
