DSPIC33EP128GM306T-I/MR - 70 MIPS DSC, 128KB Flash | Microchip
부품 번호: DSPIC33EP128GM306T-I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.98 | $5.98 |
| 10 | $5.38 | $53.80 |
| 100 | $4.72 | $472.00 |
| 500 | $4.18 | $2,090.00 |
| 1,000 | $3.72 | $3,720.00 |
DSPIC33EP128GM306T-I/MR 개요
A digital signal controller combines the compute architecture of a microcontroller with DSP-engine features such as a hardware multiply-accumulate unit and barrel shifter. Within the power-management hierarchy of embedded processors, the DSC sits between general-purpose MCUs and dedicated DSPs, making it the preferred choice when deterministic control loops and signal processing must run on a single chip.
Key features include the 12-channel motor-control PWM (MCPWM) module, 8 input capture and 8 output compare channels, 2 quadrature encoder interfaces (QEI), 4 integrated operational amplifiers, a charge time measurement unit (CTMU), and the peripheral trigger generator (PTG). Peripheral Pin Select (PPS) allows flexible remapping of digital peripherals onto I/O pins, simplifying PCB routing.
Architecturally, the dsPIC33EP core runs at up to 70 MIPS from a 3.3V supply with DSP instructions, two 40-bit accumulators, and DMA-supported data movement, offloading deterministic real-time tasks such as field-oriented motor control and digital power conversion from software.
Typical applications include precision motor control (BLDC, PMSM, stepper), digital power supplies and solar inverters, and industrial sensing front-ends where the four on-chip op-amps condition signals before the ADC, reducing external component count.
Design consideration: the VQFN exposed pad must be soldered to a grounded copper pour for thermal dissipation and signal integrity; plan your footprint for the 9x9 mm body plus the thermal pad.
This page synthesizes verified distributor data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33EP128GM306T-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP128GM306T-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Packaging, Program Memory (Flash), Core Architecture, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP128GM306-I/MR
✅ 드롭인✓ 재고 있음
$4.1 / 개
데이터시트 보기 →DSPIC33EP128GM306T-E/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP256GM306T-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33EP128GM304T-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP128GM706T-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.9 / 개
데이터시트 보기 →DSPIC33EP128GM306T-I/MR 최대 정격 & 전기적 특성
| Core Processor | dsPIC33E (16-bit DSC) |
| Core Size | 16-bit |
| Maximum Speed | 70 MIPS |
| Flash Program Memory | 128KB (43K x 24) |
| RAM | 16KB |
| 공급 전압 | 3.3 V |
| Motor Control PWM (MCPWM) | 12 channels |
| Input Capture / Output Compare | 8 / 8 |
| Quadrature Encoder Interfaces | 2 |
| On-chip Operational Amplifiers | 4 |
| CTMU (Charge Time Measurement Unit) | Yes |
| PTG (Peripheral Trigger Generator) | Yes |
| 패키지 | 64-VQFN (9x9 mm) Exposed Pad, code MR |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (Industrial, I grade) |
| Packaging | Tape & Reel (T suffix) |
DSPIC33EP128GM306T-I/MR 64-vqfn (9x9 mm) exposed pad, code mr 핀 구성 가이드
DSPIC33EP128GM306T-I/MR(64-vqfn (9x9 mm) exposed pad, code mr 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP128GM306T-I/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP128GM306T-I/MR 적합 용도: 6 애플리케이션s: Precision BLDC/PMSM Motor Control, Digital Power Supplies and Inverters, Industrial Sensing and Measurement Front-Ends, Automotive and Industrial HMI / Sub-system Control, Embedded Signal Processing and Data Acquisition, Networked Industrial IoT Nodes.
Precision BLDC/PMSM Motor Control
The DSPIC33EP128GM306T-I/MR fits motor control because its 70 MIPS core executes field-oriented control loops far faster than PWM carrier periods, while the 12-channel MCPWM module generates complementary or independent drive signals with hardware dead-time insertion. The 2 quadrature encoder interfaces decode position feedback directly in hardware, and the 4 on-chip op-amps amplify current-shunt signals before conversion. In a typical topology, the MCPWM drives a three-phase inverter gate-driver stage, ADC results trigger control interrupts, and the QEI closes the speed loop. Running the current loop at 70 MIPS yields PWM update jitter below one instruction cycle, improving torque ripple compared to 40 MIPS-class dsPIC33F parts, at the cost of careful thermal design under the VQFN exposed pad.
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Digital Power Supplies and Inverters
For digitally controlled AC-DC, DC-DC, and inverter stages, the DSPIC33EP128GM306T-I/MR provides the deterministic timing a switching converter needs: the 12-channel MCPWM supports phase-shifted and interleaved topologies with sub-nanosecond-class duty updates, and the PTG (Peripheral Trigger Generator) automates ADC sampling synchronized to PWM events without CPU intervention. The 70 MIPS headroom executes proportional-integral voltage and current loops at carrier frequency, while DMA moves conversion results off the bus. Using the internal 4 op-amps as error or gain stages reduces external analog parts. Compared to an analog-controller solution, this DSC enables adaptive nonlinear control and telemetry; the trade-off is firmware validation effort and the need for robust fault-protection software against PWM glitch events.
추천
Industrial Sensing and Measurement Front-Ends
The CTMU (Charge Time Measurement Unit) plus 4 operational amplifiers make the DSPIC33EP128GM306T-I/MR a strong fit for capacitive touch sensing, time-of-flight measurement, and buffered analog front-ends in industrial instruments. The CTMU measures charge time for precise capacitance and time-interval measurements, while the op-amps condition sensor signals such as shunt currents, bridge outputs, or microphone levels ahead of the ADC. Peripheral Pin Select lets I2C, IrDA, and other digital interfaces route to convenient pins when integrating with displays or field buses. A typical design uses the op-amps in unity-gain buffering mode, achieving signal conditioning without external op-amp ICs, which cuts BOM cost and board area, at the price of analog performance limits defined by the integrated amplifier bandwidth.
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Automotive and Industrial HMI / Sub-system Control
Although this -I grade part is not AEC-Q100 qualified itself, the dsPIC33EP family is used in adjacent automotive-adjacent industrial controls such as pump controllers, HVAC actuators, and lighting ballasts. The 70 MIPS core, 128KB Flash, and 16KB RAM host communication stacks alongside the control loop, and Peripheral Pin Select simplifies adapting one firmware base to different board revisions. The extended-temperature DSPIC33EP128GM306T-E/MR variant covers harsh -40C to +125C environments in the identical footprint, allowing a single PCB design across cabin and under-hood-adjacent zones. Designers should budget for watchdog supervision and proper ESD protection on remappable pins because PPS increases the chance of misrouted signals during firmware updates.
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Embedded Signal Processing and Data Acquisition
The DSP engine of the DSPIC33EP128GM306T-I/MR - single-cycle MAC, dual 40-bit accumulators, and barrel shifter - suits embedded filtering, FFT-based analysis, and adaptive control in compact data-acquisition nodes. The 128KB (43K x 24) Flash stores filter coefficient tables and algorithm libraries, while 16KB RAM buffers sampled streams moved by DMA. The 8 input capture channels timestamp external events with high resolution, useful for ultrasonic flow or frequency measurement. Compared to a separate MCU-plus-DSP two-chip solution, the single-chip DSC removes inter-processor latency and halves BOM complexity; the trade-off is that heavy floating-point workloads should use fixed-point libraries to preserve the 70 MIPS real-time budget.
추천
Networked Industrial IoT Nodes
In connected industrial nodes, the DSPIC33EP128GM306T-I/MR combines local control (MCPWM, captures) with communication via I2C and IrDA-capable UART interfaces, and its Peripheral Pin Select allows flexible interface placement on crowded boards. The 70 MIPS core runs protocol stacks and sensor-fusion routines concurrently with control loops, while CTMU supports low-cost capacitive buttons for local user interaction. A typical node samples sensors through the internal op-amp conditioned inputs, processes them at 70 MIPS, and reports over a transceiver connected through remapped UART pins. Versus a generic MCU, the integrated motor-control and analog peripherals remove companion ICs; versus a bigger SoC, it offers deterministic real-time response and lower power at 3.3V operation.
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추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP128GM306T-I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP128GM306-I/MR | DSPIC33EP128GM306T-E/MR | DSPIC33EP256GM306T-I/MR | DSPIC33EP128GM304T-I/MR | DSPIC33EP128GM706T-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm, MR) exposed pad | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Program Memory | 128KB (43K x 24) | 128KB | 128KB | 256KB | 128KB | 128KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging | Tape & Reel (T) | Tube | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
주요 차별점
- 70 MIPS core performance (vs DSPIC33FJ64MC706A-I/MR)
- Extended temperature drop-in option (vs DSPIC33EP128GM306T-E/MR)
- Doubled Flash without redesign (vs DSPIC33EP256GM306T-I/MR)
- Trade-off: fewer analog enhancements than GM7 family (vs DSPIC33EP128GM706T-I/MR)
설계 노트
The 64-pin VQFN exposed pad must be connected to a solid ground pour. Use an array of thermal vias (typically 5x5, 0.3 mm drill filled or plugged) under the pad to the internal ground plane. The no-lead package also requires correct stencil design - segmented aperture at 50-70% coverage - to avoid excessive solder paste causing voids or tombstoning. Follow Microchip's QFN surface-mount guidelines in the family datasheet (document 70000689) for land-pattern dimensions of the 9x9 mm MR package.
The dsPIC33EP core operates from a 3.3V supply with internal regulators; place a low-ESR ceramic bypass capacitor (typically 0.1 uF) at each VDD pin pair and a bulk 10 uF near the device. Consult the datasheet for any required VDDCORE/VDDCAP capacitor values - these regulator capacitors must not be omitted or the core may brown out at 70 MIPS operation. Decouple VDD and AVDD separately, and connect AVSS to a quiet analog ground to preserve the accuracy of the integrated op-amps and ADC front-end.
Peripheral Pin Select (PPS) is powerful but error-prone: incorrectly locked PPS mappings can silently disconnect UART or PWM outputs after a firmware update. Lock PPS registers (via the control bit documented in Section 11.4 of the datasheet) once initialization completes. Also note this -I grade part is rated -40C to +85C; do not use it in ambient above 85C - select DSPIC33EP128GM306T-E/MR (up to +125C) instead, which is footprint-identical and requires no PCB change.
When driving external MOSFET gate drivers from the 12 MCPWM outputs, keep PWM trace lengths short and matched per phase to minimize skew-induced shoot-through. The 70 MIPS core can toggle pins fast enough to create meaningful edge rates; add small series resistors (typically 22-33 ohm, estimated typical value) on remappable RPn outputs routed off-board to control ringing. Route the CTMU/op-amp analog inputs away from PWM switching nodes on inner layers with ground shielding.
규정 준수 정보
Compliance details were not present in the verified web data snippets. This industrial-grade (I suffix) part is not AEC-Q100 qualified based on the -I temperature grade; verify RoHS/REACH status on the official Microchip product page before procurement.
