DSPIC33EP128GP504-I/MV - 16-bit DSC, 70 MIPS, 128KB Flash | Microchip
부품 번호: DSPIC33EP128GP504-I/MV ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.74 | $3.74 |
| 10 | $3.55 | $35.50 |
| 100 | $3.36 | $336.00 |
| 500 | $3.18 | $1,590.00 |
| 1,000 | $3.02 | $3,020.00 |
DSPIC33EP128GP504-I/MV 개요
A digital signal controller combines the computational architecture of a microcontroller with DSP-grade math capabilities. Within the power management and embedded control hierarchy, a DSC sits above a general-purpose MCU: it adds a DSP engine, single-cycle MAC and divide instructions, and high-speed peripherals such as advanced PWM and CAN, making it a bridge between MCU-class control and processor-class signal processing.
Key features of the dsPIC33EP128GP504 include the high-speed 70 MIPS dsPIC33E core, integrated CAN 2.0B communication, a Peripheral Trigger Generator (PTG) for autonomous peripheral coordination, on-chip operational amplifiers and comparators for analog signal conditioning, and high-speed PWM modules suited to digital power conversion and motor control. The 128KB Flash with ECC supports field firmware updates, while the 16KB RAM handles DSP buffers and protocol stacks.
Architecturally, the dsPIC33E family uses a modified Harvard 16-bit core with a 24-bit instruction word, zero-overhead looping and hardware division. The general purpose (GP) variant prioritizes broad peripheral coverage over the MC (motor control) family's dedicated PWM enhancements, giving engineers flexibility across mixed analog-digital designs.
Typical applications include industrial automation, CAN-networked sensor nodes, digital power supplies, motor control, and general embedded control where DSP functions are needed. The 44-pin UQFN saves board area versus a 44-TQFP while retaining full peripheral access.
Design consideration: the UQFN package exposes a thermal pad that must be soldered to a grounded copper pour for reliable heat dissipation and signal return.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: DSPIC33EP128GP504-I/MV — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP128GP504-I/MV (동일 폼 팩터 및 풋프린트) — 차이점: Core, Package, Program Memory Size, RAM Size, CAN.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP128GP504-E/MV
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.3 / 개
데이터시트 보기 →DSPIC33EP256GP504-I/MV
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP64GP504-I/MV
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.5 / 개
데이터시트 보기 →DSPIC33EP32GP504-I/MV
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP128MC504-I/MV
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP128GM304-I/MV
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP128GP504-I/MV 최대 정격 & 전기적 특성
| Core | dsPIC33E 16-bit |
| CPU Speed | 70 MIPS |
| Flash Program Memory | 128KB (43K x 24) |
| RAM | 16KB |
| 공급 전압 | 3.3 V |
| 패키지 | 44-pin UQFN (MV) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (I grade) |
| CAN | Yes (CAN 2.0B) |
| Peripheral Trigger Generator | Yes (PTG) |
| On-chip Op Amps | Yes |
| Comparators | Yes |
| High-Speed PWM | Yes |
| Product Status | In Production |
| Programming Interface | ICSP (multiple PGECx/PGEDx pairs) |
DSPIC33EP128GP504-I/MV 44-pin uqfn (mv) 핀 구성 가이드
DSPIC33EP128GP504-I/MV(44-pin uqfn (mv) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP128GP504-I/MV.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP128GP504-I/MV 적합 용도: 6 애플리케이션s: Industrial Automation, Digital Power Conversion, Motor Control, CAN-Networked Sensor Nodes, Audio Signal Processing, Portable and Battery-Powered Instruments.
Industrial Automation
The DSPIC33EP128GP504-I/MV fits industrial automation nodes that need deterministic control plus fieldbus connectivity. Its 70 MIPS core executes PID and DSP algorithms with headroom, while CAN 2.0B links PLCs, drives, and sensors on robust factory networks. The -40C to +85C industrial temperature grade survives cabinet and floor environments. On-chip op amps and comparators condition analog sensor signals without external amplifiers, and the 128KB Flash with multiple PGECx/PGEDx ICSP pairs enables in-field firmware updates on deployed equipment. A typical design uses the Peripheral Trigger Generator to chain ADC sampling to control updates, cutting loop latency versus software triggering and improving repeatability in positioning and process-control loops.
추천
Digital Power Conversion
Digital power supplies, PFC stages, and DC-DC converters benefit from this DSC's high-speed PWM modules and DSP engine. The 70 MIPS core closes voltage-mode or current-mode loops at switching frequencies well above audible range, and on-chip comparators provide hardware cycle-by-cycle current limiting independent of software. The Peripheral Trigger Generator autonomously sequences ADC samples to PWM duty updates, minimizing control latency - a quantified benefit in loop stability for designs switching at hundreds of kilohertz. The 3.3V I/O interfaces cleanly with gate drivers. Because loop compensation runs in software, gain scheduling and non-linear control become firmware updates rather than board revisions, cutting development iterations.
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Motor Control
BLDC, PMSM, and ACIM drives are well served by the GP504's high-speed PWM with complementary outputs and its 70 MIPS DSP core running FOC (field-oriented control) math. On-chip op amps amplify shunt current signals, and comparators support hardware overcurrent trips, reducing external component count. The 128KB Flash accommodates full FOC firmware with position estimation (sensorless algorithms) without external memory. Using the Peripheral Trigger Generator to synchronize current-sense ADC sampling to PWM centers avoids switching-noise contamination of measurements. For dedicated designs, the pin-compatible DSPIC33EP128MC504-I/MV offers motor-control-tuned PWM features in the identical 44-pin UQFN footprint.
추천
CAN-Networked Sensor Nodes
Distributed sensing in vehicles, agriculture, and building systems needs local signal processing plus a rugged bus. The CAN 2.0B controller (paired with an external transceiver such as the MCP2551) provides error-checked multi-drop communication, while the 70 MIPS core filters, averages, and FFTs sensor data locally, transmitting only processed results and reducing bus traffic. On-chip op amps buffer low-level sensor outputs, and 16KB RAM holds circular buffers for streaming analysis. The industrial -40C to +85C rating suits outdoor enclosures. Multiple ICSP pin pairs allow programming the node on the final assembled board through the harness connector, simplifying production test.
추천
Audio Signal Processing
Embedded audio applications - equalizers, mixers, active crossovers - exploit the DSP engine's single-cycle MAC for FIR/IIR filters. The 70 MIPS core supports sample rates well above CD quality for multichannel filtering, and 16KB RAM stores filter coefficient sets and delay lines for reverb or crossover implementations. On-chip op amps provide output buffering or anti-alias input conditioning without external ICs in cost-sensitive designs. The 3.3V supply matches common codec and DAC interfaces. Designers should note that this GP variant provides no dedicated audio CODEC, so an external codec over SPI/UART is typical; the trade-off is flexibility in choosing codec quality versus fixed-function audio DSPs.
추천
Portable and Battery-Powered Instruments
Handheld meters, loggers, and portable analyzers value the 44-pin UQFN package's small 8x8 mm-class footprint, which shrinks board area versus a 44-TQFP by roughly 60 percent. The 3.3V operation and dsPIC33EP power-management features (idle, doze, and sleep modes) extend battery life between charges, while the 70 MIPS performance keeps measurement throughput high when active. On-chip op amps and comparators reduce external analog count - important where every square millimeter and cent of BOM matters. Multiple PGECx/PGEDx programming pairs allow calibration firmware updates after final assembly. Designers must ensure the exposed UQFN thermal pad is soldered to a ground pour for heat and grounding integrity.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP128GP504-I/MV — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP128GP504-E/MV | DSPIC33EP256GP504-I/MV | DSPIC33EP128MC504-I/MV |
|---|---|---|---|---|
| Package | 44-pin UQFN (MV) | 44-pin UQFN (MV) - same | 44-pin UQFN (MV) - same | 44-pin UQFN (MV) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 128KB (43K x 24) | 128KB | 256KB | 128KB |
| RAM | 16KB | 16KB | 16KB | 16KB |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| CAN | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
| Special Peripherals | PTG, on-chip op amps, comparators, high-speed PWM | Identical to this product | Identical to this product | MC-tuned PWM, op amps, comparators |
주요 차별점
- General-purpose analog integration with on-chip op amps (vs DSPIC33EP128GM304-I/MV)
- Extended temperature variant available in identical footprint (vs DSPIC33EP128GP504-E/MV)
- Memory scaling without PCB respin (vs DSPIC33EP256GP504-I/MV)
설계 노트
The 44-pin UQFN (MV) package has an exposed thermal pad on the underside that must be soldered to a ground copper pour. This pad is not merely thermal - it is often the primary ground return for the die, so leaving it unsoldered causes erratic behavior, elevated ground bounce, and unreliable debugging. Use an array of small thermal vias (typically 4-6) connecting the pad to internal ground planes, and apply an aperture in the paste stencil (e.g., 50-70 percent coverage in multiple small openings) to prevent solder voids during reflow.
Provide clean 3.3V supply with a 0.1uF ceramic decoupling capacitor placed within 2 mm of every VDD pin, plus at least one bulk capacitor (4.7uF-10uF) near the device. All VDD and VSS pins must be physically connected - omitting one will prevent ICSP programming and can damage the die. Estimate: at 70 MIPS the core current is on the order of tens of milliamps, so IR drop on a 0.25 mm trace over 50 mm is negligible, but long thin traces add supply noise that degrades ADC accuracy on the analog pins.
The device provides multiple PGECx/PGEDx programming pin pairs. You may use any pair for ICSP, but PGEC and PGED must be used as a matched pair (e.g., PGEC2 with PGED2 for ICSPCLK/ICSPDAT) - mixing pairs from different sets will fail programming. Route your programming header to one pair and keep it free of other loads; series resistors on PGD/PGC lines can corrupt fast ICSP edges. Also verify code-protect configuration bit settings before production, since enabling protection is irreversible once programmed on many dsPIC33E parts.
규정 준수 정보
Compliance declarations were not explicitly stated in the verified web data retrieved on 2026-09-23. Confirm RoHS/REACH/lead-free status on the Microchip product page or request declarations from the distributor.
