DSPIC33EP16GS505-E/PT - 16-Bit 70 MIPS Digital Power DSC | Microchip
부품 번호: DSPIC33EP16GS505-E/PT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.29 | $5.29 |
| 10 | $4.75 | $47.50 |
| 100 | $4.28 | $428.00 |
| 500 | $4.1 | $2,050.00 |
| 1,000 | $3.93 | $3,930.00 |
DSPIC33EP16GS505-E/PT 개요
A digital signal controller combines a microcontroller's peripherals and ease of use with the mathematical throughput of a DSP core. In the power-management hierarchy, the dsPIC33EP16GS505 sits at the control-layer: it closes feedback loops (current-mode, voltage-mode, multi-loop) that analog controllers previously handled, executing compensation algorithms sample-by-sample on the switching waveform.
Key features include a high-speed 12-bit ADC capable of sampling multiple channels at rates matched to the PWM frequency, an on-chip DAC for comparator references, and dedicated SMPS peripherals such as the high-resolution PWM module with nanosecond-scale duty-cycle resolution. The -E/PT suffix denotes the extended temperature grade, and the exposed-pad TQFP improves thermal dissipation for power-conversion layouts.
Architecturally, the dsPIC33EP core is a modified Harvard 16-bit pipeline processor with DSP instructions (MAC, multiply, divide), designed for deterministic loop timing. This lets a single controller run AC-to-DC converter, power-factor-correction, and housekeeping tasks concurrently - a pattern Microchip demonstrates in its interleaved PFC reference design for the GS50x family.
Typical applications include AC-DC converters, digital PFC stages, DC-DC modules, battery chargers, and solar micro-inverters - anywhere multi-loop SMPS control demands both fast analog sampling and algorithmic flexibility.
Design consideration: keep the exposed thermal pad soldered to a ground copper pour, and place ADC inputs away from the PWM switching nodes to preserve the high-speed converter's effective resolution.
This page synthesizes distributor pricing, drop-in alternatives within the same 48-TQFP footprint, design notes, and application guidance not found on any single datasheet or distributor page, verified as of 2026-09-24.
드롭인 대체품: DSPIC33EP16GS505-E/PT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP16GS505-E/PT (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, PWM, Operating Temperature, Application Focus.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP16GS505-I/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.51 / 개
데이터시트 보기 →DSPIC33EP32GS505-E/PT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP64GS505-E/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.45 / 개
데이터시트 보기 →DSPIC33EP16GS506-E/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.46 / 개
데이터시트 보기 →DSPIC33EP32GS506-E/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.5 / 개
데이터시트 보기 →DSPIC33EP16GS505-E/PT 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dsPIC33EP Digital Signal Controller |
| Maximum CPU Speed | 70 MIPS (60 MIPs listed by DigiKey; 70 MIPS per Microchip product description) |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Target Application | Digital Power / SMPS |
| ADC | High-speed ADC per GS50x datasheet |
| DAC | On-chip DAC for comparator references |
| PWM | High-resolution SMPS PWM peripherals |
| 패키지 | 48-TQFP-EP (7x7 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| Temperature Grade | Extended (-E suffix) |
| Status | In Production |
| Functional Safety | FuSa supported (per DigiKey listing) |
DSPIC33EP16GS505-E/PT 48-tqfp-ep (7x7 mm) with exposed pad 핀 구성 가이드
DSPIC33EP16GS505-E/PT(48-tqfp-ep (7x7 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP16GS505-E/PT.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP16GS505-E/PT 적합 용도: 6 애플리케이션s: AC-DC Digital Power Supplies, Interleaved Power Factor Correction, DC-DC Converter Modules, Solar Micro-Inverters and chargers, LED Drivers and lighting power, UPS and Battery Management.
AC-DC Digital Power Supplies
The DSPIC33EP16GS505-E/PT directly targets AC to DC converter control, one of the headline applications Microchip names for the GS50x family. Its high-speed ADC samples the input and output rails synchronized to the PWM cycle, while the high-resolution PWM module drives the switching stage with the duty-cycle precision needed for tight line and load regulation. Running at up to 70 MIPS, the controller executes current-mode and voltage-mode compensation loops digitally, replacing analog error amplifiers with firmware that can adapt across operating modes. The on-chip DAC supplies programmable comparator thresholds for fast cycle-by-cycle overcurrent protection. The extended -E temperature grade suits the elevated ambient conditions inside power-supply enclosures.
추천
Interleaved Power Factor Correction
Microchip provides an interleaved PFC reference design specifically for SMPS dsPIC Digital Signal Controllers, and the GS505 fits this role with its 48-pin TQFP-EP offering enough I/O to drive multiple interleaved phases. Interleaved PFC splits the input current across two or more boost stages switched out of phase, reducing input ripple and EMI filter size; the controller must sample each phase current and compute per-phase duty corrections every switching cycle. The GS505's high-speed ADC and DSP multiply-accumulate instructions handle these computations deterministically at up to 70 MIPS, while high-resolution PWM provides the fine phase offsets and duty resolution the topology demands.
추천
DC-DC Converter Modules
For telecom rectifiers, server VRMs, and isolated DC-DC bricks, the GS505 closes digital current-mode loops with cycle-by-cycle sampling. The high-speed ADC reads output current and voltage each switching period, firmware executes the compensation law, and the high-resolution PWM adjusts duty with nanosecond-class granularity - enough for the fast transient response these modules require. The 16KB Flash accommodates loop compensation, state machines, PMBus-style supervision, and fault handling in compact code. The exposed-pad 7x7 mm TQFP sinks heat into the ground pour, and the -E extended temperature rating tolerates the hot spots typical of dense power boards, supporting reliable continuous operation.
추천
Solar Micro-Inverters and chargers
Solar micro-inverters combine MPPT (maximum power point tracking), DC-AC inversion, and grid-interaction control - workloads that need both fast sampled control and flexible algorithms, which is precisely the DSC value proposition. The GS505's ADC samples panel voltage/current for the MPPT algorithm while DSP math executes the perturb-and-observe or incremental-conductance search and the inverter modulation. The extended -E grade suits rooftop enclosures that see wide and high ambient temperatures. Battery chargers similarly benefit: multi-stage charge profiles (CC, CV, trickle) are simply firmware state machines, with the DAC/comparator blocks providing hardware overcurrent cutoff independent of software latency.
추천
LED Drivers and lighting power
High-power LED drivers need constant-current regulation with dimming control, and the GS505 implements both digitally: the high-resolution PWM sets the switching regulator's duty for precise current, and a second PWM channel provides dimming without analog dimming-path drift. The ADC monitors LED string current and temperature sensors, enabling firmware derating that extends LED lifetime. The 16KB Flash holds the complete driver state machine including fault recovery, and the 48-pin package leaves enough general I/O for DALI/DMX-style interface expansion. The extended temperature grade fits enclosed luminaires where ambient temperatures near the driver electronics commonly exceed industrial limits.
추천
UPS and Battery Management
Uninterruptible power supplies and battery management systems require multi-loop control: inverter output regulation, charger current control, and battery-cell monitoring - all running concurrently. The GS505's deterministic 16-bit core executes these loops with predictable timing, while its ADC channels sample battery voltage/current and inverter feedback synchronously with the PWM carriers, avoiding beat-frequency artifacts in the measurements. The on-chip DAC and comparators give hardware-level protection against overcurrent and overvoltage faults faster than any software interrupt. The 48-pin TQFP-EP provides sufficient I/O for front-panel, communication, and relay-driving functions on a single controller.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP16GS505-E/PT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP16GS505-I/PT | DSPIC33EP32GS505-E/PT | DSPIC33EP64GS505-E/PT | DSPIC33EP16GS506-E/PT |
|---|---|---|---|---|---|
| Package | 48-TQFP-EP (7x7 mm) | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 16 KB | 16 KB | 32 KB | 64 KB | 16 KB |
| Core / Performance | 16-bit dsPIC33EP, up to 70 MIPS (60 MIPs per DigiKey) | 16-bit dsPIC33EP, same core | 16-bit dsPIC33EP, same core | 16-bit dsPIC33EP, same core | 16-bit dsPIC33EP, same core |
| Temperature Grade | Extended (-E) | Industrial (-I) | Extended (-E) | Extended (-E) | Extended (-E) |
| Target Application | Digital Power SMPS | Digital Power SMPS | Digital Power SMPS | Digital Power SMPS | Digital Power SMPS |
| Key Differentiator | 16KB Flash, extended temp grade | Same die, industrial grade | 2x Flash | 4x Flash | GS506 memory option |
| PCB Redesign Required | - | No - same footprint | No - same footprint | No - same footprint | No - same footprint (verify pin map per datasheet) |
주요 차별점
- Extended temperature grade for power-enclosure environments (vs DSPIC33EP16GS505-I/PT)
- Lowest-cost entry point in the 48-pin GS505 family (vs DSPIC33EP32GS505-E/PT)
- Dedicated digital-power peripheral set vs general-purpose dsPIC33EP parts (vs DSPIC33EP128GP502-H/SO)
설계 노트
Solder the exposed pad of the 48-TQFP-EP to a solid grounded copper pour. In digital power layouts this pad is not just thermal - it provides the low-inductance ground reference that the high-speed ADC needs for accurate sampling. Estimated: without the pad soldered, junction-to-ambient thermal resistance rises substantially versus the datasheet value, so omitting the pour risks exceeding the junction limit in hot power-supply enclosures.
Keep ADC input traces short and route them away from PWM switching nodes and gate-drive traces. In SMPS layouts, dV/dt from the switching stage couples into high-impedance ADC inputs, corrupting the feedback samples the digital compensation loops depend on. Use a grounded guard trace or ground fill between analog sense lines and PWM routing, and sample synchronously with the PWM carrier to avoid switching-edge pickup.
The -E/PT and -I/PT suffixes denote different temperature grades of the same die - substituting -I for -E saves cost but forfeits extended-temperature margin, a common procurement error in power products. Also note the Flash ceiling: 16KB fills quickly once compensation firmware, state machines, and communications are included. If firmware growth is likely, design in the pin-compatible 32GS505 or 64GS505 from the start rather than respinning the PCB later.
규정 준수 정보
Compliance statuses not stated in the provided web data; verify on the Microchip product page or distributor compliance documents.
