DSPIC33EP32GS202T-E/MX - 16-bit 70 MIPS DSC 32KB | Microchip
부품 번호: DSPIC33EP32GS202T-E/MX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP32GS202T-E/MX 개요
A digital signal controller combines the compute throughput of a DSP core with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy, DSCs sit at the heart of digital power supplies, driving switching converters where software-defined control loops replace analog compensation networks. The dsPIC33 family from Microchip is one of the dominant 16-bit DSC platforms for this market.
The key differentiator of the GS202 variant is its interconnected high-speed PWM, 12-bit ADC with programmable gain amplifier (PGA), and analog comparators. The PWM module supports advanced modes for buck, boost, and interleaved topologies with dead-time insertion and current-limit trip zones. The on-chip PGA allows direct connection of low-level current-sense signals, and the comparators can trigger cycle-by-cycle current limiting without CPU intervention.
Architecturally, the dsPIC33EP core executes a modified Harvard instruction set with DSP multiply-accumulate instructions, enabling proportional-integral control loops at hundreds of kilohertz switching frequencies. Performance scales up to 70 MIPS from a 3.3V supply.
Typical applications include interleaved power factor correction (a 350W universal-input reference design exists from Microchip), digital DC-DC converters, battery chargers, LED drivers, and automotive auxiliary power systems.
A key design consideration is the exposed-pad UQFN package: the thermal pad must be soldered to a grounded PCB pour for both heat dissipation and grounding integrity, and in-circuit programming requires access to MCLR, PGC, and PGD pins.
This page synthesizes distributor data, same-family drop-in alternates, and design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33EP32GS202T-E/MX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP32GS202T-E/MX (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Core, Application Focus, Core Processor.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP32GS202T-I/MX
✅ 드롭인✓ 재고 있음
$2.85 / 개
데이터시트 보기 →DSPIC33EP32GS202-E/MX
✅ 드롭인✓ 재고 있음
$3.05 / 개
데이터시트 보기 →DSPIC33EP32GS202-I/MX
✅ 드롭인✓ 재고 있음
$2.95 / 개
데이터시트 보기 →DSPIC33EP32GS202T-E/M6
✅ 드롭인✓ 재고 있음
$2.84 / 개
데이터시트 보기 →DSPIC33EP64GS202T-E/MX
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP32GS202T-E/MX 최대 정격 & 전기적 특성
| Core Processor | dsPIC33EP 16-bit |
| Core Size | 16-bit |
| Program Memory Size | 32KB (32K x 8) Flash |
| Max Operating Frequency | 70 MIPS |
| 공급 전압 | 3.3 V |
| Specialized Peripherals | High-speed PWM, ADC with PGA, Comparators |
| Series | dsPIC 33EP GS (Automotive, AEC-Q100, Functional Safety FuSa) |
| Qualification | AEC-Q100 |
| Market Segment | Automotive |
| 동작 온도 | -40C to +125C (Extended, E) |
| 패키지 | 28-UQFN (4x4 mm) Exposed Pad |
| 실장 유형 | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Product Status | Active |
| Application Target | Digital Power (SMPS, PFC) |
DSPIC33EP32GS202T-E/MX 28-uqfn (4x4 mm) exposed pad 핀 구성 가이드
DSPIC33EP32GS202T-E/MX(28-uqfn (4x4 mm) exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP32GS202T-E/MX.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP32GS202T-E/MX 적합 용도: 6 애플리케이션s: Interleaved Power Factor Correction (PFC), Digital DC-DC Converters (SMPS), Automotive On-Board Chargers and Auxiliary Power, Digital LED Drivers, Battery Chargers and BMS Subsystems, Industrial Motor Control and Embedded Sensing.
Interleaved Power Factor Correction (PFC)
The DSPIC33EP32GS202T-E/MX fits interleaved PFC designs directly: Microchip ships a dedicated Interleaved PFC reference design based on SMPS dsPIC DSCs that accepts universal AC input and produces a single high-voltage DC output up to 350W. The interconnected high-speed PWM drives two interleaved phases with precise phase shift and dead-time insertion, while the ADC with PGA samples inductor current through the on-chip comparators for cycle-by-cycle current limiting without CPU latency. Running at up to 70 MIPS, the core closes average-current-mode control loops in software, replacing analog compensation with digital flexibility. The AEC-Q100 qualification of the -E/MX grade further suits automotive onboard-charger and auxiliary PFC stages where -40C to +125C operation is mandatory.
추천
Digital DC-DC Converters (SMPS)
For digital switch-mode power supplies, the DSPIC33EP32GS202T-E/MX provides the complete control chain on one chip. The high-speed PWM module generates buck, boost, or half-bridge waveforms with sub-nanosecond-resolution duty control and hardware trip zones; the 3.3V-specified ADC with programmable gain amplifier reads low-level current-sense signals directly, and the comparators implement fast overcurrent shutdown ahead of firmware response. At 70 MIPS, the 16-bit DSP core with multiply-accumulate instructions executes voltage and current loops at switching frequencies well into the hundreds of kilohertz. Software-defined control allows field tuning of compensation, soft-start, and fault behavior - key advantages over fixed analog controllers in automotive and industrial 48V and 12V point-of-load architectures.
추천
Automotive On-Board Chargers and Auxiliary Power
Automotive power conversion is a primary target for this ordering code. As an AEC-Q100 qualified member of the Functional Safety (FuSa) supported dsPIC33EP series, the DSPIC33EP32GS202T-E/MX operates from -40C to +125C, covering under-hood and high-temperature engine-bay environments. Typical uses include auxiliary 12V converters, LED headlamp drivers, and sub-stages of on-board chargers, where the high-speed PWM handles phase-shifted full-bridge or LLC control and the ADC/PGA chain monitors battery current with precision. The exposed-pad 28-UQFN 4x4 mm package minimizes board area while its thermal pad grounds to the PCB pour for heat spreading. Digital implementation also enables automotive diagnostic self-test routines demanded by functional-safety plans.
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Digital LED Drivers
Constant-current LED driving benefits from the DSPIC33EP32GS202T-E/MX peripheral set. The high-speed PWM provides dimming resolution far beyond 8-bit analog dimmers, supporting both pulse-width and burst dimming modes with hardware-tripped current limiting through the analog comparators. The ADC with PGA reads the shunt voltage across a low-value sense resistor, and firmware closes an average-current loop at 70 MIPS for stable luminous output across supply and temperature variation. The AEC-Q100 -E grade permits automotive exterior lighting (headlamps, DRLs, taillights) where -40C to +125C and qualification traceability are required. The small 4x4 mm UQFN footprint fits compact driver boards inside lamp housings with limited thermal and space budgets.
추천
Battery Chargers and BMS Subsystems
Smart battery chargers need coordinated power conversion and measurement, both native to the DSPIC33EP32GS202T-E/MX. The high-speed PWM implements multi-phase charging profiles (CC/CV, trickle, termination) in firmware, while the ADC with PGA samples battery voltage, current, and thermistor inputs through the same 3.3V-referenced chain, reducing external component count. Comparators provide hardware overcurrent and reverse-polarity protection paths independent of software timing. The 32KB Flash holds charge algorithms, state-of-charge estimation, and CAN-style communication routines; the 70 MIPS core keeps control-loop deadlines even with communication overhead. For automotive 12V and 48V systems, the AEC-Q100 qualification and FuSa-supported series position simplify safety-case documentation.
추천
Industrial Motor Control and Embedded Sensing
Beyond power supplies, the DSPIC33EP32GS202T-E/MX serves compact industrial control nodes. The high-speed PWM drives small brushed, BLDC, or PMSM motors with complementary outputs and dead-time control; the ADC/PGA chain digitizes phase currents and back-EMF signals while comparators implement hardware braking and fault trips. At 70 MIPS the 16-bit DSP core executes field-oriented control math for low-power motor applications. The -40C to +85C and wider extended grades cover factory-floor conditions, and the 4x4 mm UQFN package suits dense actuator and sensor PCBs. The GS-series digital-power heritage also enables auxiliary tasks such as auxiliary converter monitoring, heater control, and smart sensor fusion within the same 32KB firmware image.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP32GS202T-E/MX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP32GS202T-I/MX | DSPIC33EP32GS202-E/MX | DSPIC33EP32GS202T-E/M6 | DSPIC33EP64GS202T-E/MX |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (4x4 mm) Exposed Pad | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Flash Memory | 32KB (32K x 8) | 32KB | 32KB | 32KB | 64KB |
| Core / Performance | 16-bit dsPIC33EP, 70 MIPS | 16-bit, 70 MIPS | 16-bit, 70 MIPS | 16-bit, 70 MIPS | 16-bit, 70 MIPS |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| Packaging | Tape & Reel (TR) | Tape & Reel (TR) | Tray/Tube | Tape & Reel (TR) | Tape & Reel (TR) |
| Product Status | Active | Active | Active | Active | Active |
주요 차별점
- Extended automotive temperature range in the same footprint (vs DSPIC33EP32GS202T-I/MX)
- Tape-and-reel supply for volume assembly (vs DSPIC33EP32GS202-E/MX)
- Dedicated digital-power peripheral interconnect (vs DSPIC30F3013-20I/SO)
설계 노트
The exposed pad on the 28-UQFN 4x4 mm package is the primary ground and thermal path. Create a grounded via array (5x5 or larger, 0.3 mm vias) under the pad connecting to internal ground planes; solder coverage of the pad is essential for both junction temperature control and EMI performance. Per the dsPIC33EPXXGS202 programming specification (70005192b), route MCLR, PGEC, and PGED to a 5-pin ICSP header with MCLR pulled up through a resistor so programming tools can assert VPP without contention.
Decouple VDD with a 0.1 uF ceramic capacitor placed within 2 mm of the pin, plus a bulk 4.7 uF to 10 uF capacitor near the device. In digital-power designs where this DSC sits next to high dv/dt switch nodes, keep the analog sensing traces (current shunt to PGA inputs) short and Kelvin-routed, and separate the analog ground region under the ADC/PGA pins from the power ground return. The 3.3V supply should be regulated and free of switching ripple to preserve ADC accuracy.
Do not confuse temperature grades when sourcing: the -E grade (-40C to +125C) is required for the AEC-Q100 automotive claim of this MPN; substituting an -I part silently reduces the temperature ceiling by 40C. Also note the die is only visible to firmware as 32KB Flash - do not port a 64KB GS202 build onto this part. Verify the MX (UQFN) footprint against the Microchip land-pattern drawing before layout, since M6 and MX suffixes both denote 28-UQFN 4x4 mm but should be checked on the official mechanical drawing.
규정 준수 정보
AEC-Q100 automotive qualification and Functional Safety (FuSa) series membership are stated in the distributor parametric data updated 2024-04-19. RoHS/REACH/lead-free status was not stated in the retrieved data and must be confirmed on the Microchip product page.
