Microchip Technology

DSPIC33EP64GP502-E/SP - 16-bit DSC 60 MIPS 64KB Flash | Microchip

부품 번호: DSPIC33EP64GP502-E/SP ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
3 V to 3.6 V Vdss 28-pin SPDIP Package 60 MIPS / 60 MHz Speed 64 KB (22K x 24) Memory
시작가 $3.51 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-25
볼륨 가격
수량 단가 합계
1 $5.62 $5.62
10 $5.06 $50.60
100 $4.36 $436.00
500 $3.89 $1,945.00
1,000 $3.51 $3,510.00
ℹ️ 모든 가격은 USD 기준입니다

DSPIC33EP64GP502-E/SP 개요

The Microchip Technology DSPIC33EP64GP502-E/SP is a 16-bit Digital Signal Controller (DSC) delivering 60 MIPS core performance with 64 KB Flash (22K x 24) and 8 KB SRAM, housed in a 28-pin SPDIP through-hole package rated for the extended -40C to +125C temperature range.

A Digital Signal Controller combines the deterministic architecture of a microcontroller with DSP-grade multiply-accumulate capability in a single core. In the power-management hierarchy of embedded systems, the DSC sits between general-purpose MCUs and dedicated DSPs, making it the preferred choice when an application needs both control-loop code and math-intensive signal processing without a two-chip solution.

Key features include the 60 MIPS dsPIC33E core, High-Speed PWM peripherals for digital power conversion, CAN 2.0B communication, three integrated op amps, four comparators, a Peripheral Trigger Generator (PTG) and a Charge Time Measurement Unit (CTMU). Integrating op amps and comparators on-chip reduces external analog component count in current-sense and protection circuits.

The dsPIC33EP series architecture pairs a 16-bit pipelined core with a single-cycle 16x16 MAC/DC DSP engine, supporting fractional and integer arithmetic. The 64 KB of self-programmable Flash supports field firmware updates, while 8 KB of SRAM handles control-loop state and communication buffers. Supply voltage is 3.0 V to 3.6 V.

Typical applications include digital power supplies, battery chargers, PFC stages, motor control (BLDC/PMSM/stepper), and industrial sensing systems that exploit the CTMU for capacitive or time-domain measurements.

Design consideration: the /SP SPDIP package is ideal for prototyping and low-volume through-hole assemblies; for mass-production SMT, pin-function-equivalent SOIC-28 (/SO) and QFN-U28 (/MM) siblings use the same die but different footprints.

This page synthesizes distributor availability, drop-in family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.

드롭인 대체품: DSPIC33EP64GP502-E/SP — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP64GP502-E/SP (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Communication Interfaces, Core Architecture, Program Memory (Flash).

Microchip Technology
Operating Temperature: -40C to +125C (extended, E grade)
Communication Interfaces: CAN, UART, SPI, I2C
Core Architecture: 16-bit dsPIC33E (DSC)
Microchip Technology
Operating Temperature: -40C to +85C (industrial)
Package: 28-pin SPDIP (SP)
Communication Interfaces: UART, SPI, I2C, CAN-ready family peripherals
Microchip Technology
Operating Temperature: -40C to +85C (I grade)
Package: 28-SPDIP (SP), through-hole
Communication Interfaces: CAN 2.0B, UART, SPI, I2C
Microchip Technology
Operating Temperature: -40C to +125C (E grade)
Core Architecture: 16-bit dsPIC33E DSC core
Program Memory (Flash): 128KB (43K x 24), ECC-protected

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

DSPIC33EP64GP502-I/SP

✅ 드롭인 ⚠️ 사양 미검증
Microchip Technology
📦 28-pin SPDIP
dsPIC33E 16-bit DSC · 70 MIPS · 64KB (22K x 24) Flash · 16 bit · 3 V to 3.6 V · -40C to +85C (I grade) · 28-SPDIP (SP), through-hole · Through Hole

✓ 재고 있음

$3.55 / 개

데이터시트 보기 →

DSPIC33EP64GP504-I/SP

✅ 드롭인 ⚠️ 사양 미검증
📦 28-pin SPDIP
same package/pinout and 60 MIPS core, but 128 KB Flash (+100%) and different peripheral mix (no on-chip op amps); upper +85C industrial temp

📋 참조 대체품 (카탈로그에 없음)

DSPIC33EP32GP502-I/SP

✅ 드롭인 ⚠️ 사양 미검증
Microchip Technology
📦 28-pin SPDIP
16-bit dsPIC33E (modified Harvard) · 70 MIPS · 32 KB · 4 KB · 3.0 V to 3.6 V · -40C to +85C (industrial) · 28-pin SPDIP (SP) · Through Hole

✓ 재고 있음

$3.62 / 개

데이터시트 보기 →

DSPIC33EP64GP502-E/SP 최대 정격 & 전기적 특성

Core dsPIC33E 16-bit DSC
CPU Speed 60 MIPS / 60 MHz
Program Memory (Flash) 64 KB (22K x 24)
SRAM 8 KB
공급 전압 3 V to 3.6 V
동작 온도 -40C to +125C (extended, E suffix)
패키지 28-pin SPDIP
실장 유형 Through Hole
CAN 1x CAN 2.0B
Op Amps (on-chip) 3
Comparators 4
Peripheral Trigger Generator Yes (PTG)
Charge Time Measurement Unit Yes (CTMU)
High-Speed PWM Yes
Life Cycle Stage Active (In Production)

DSPIC33EP64GP502-E/SP 28-pin spdip 핀 구성 가이드

DSPIC33EP64GP502-E/SP(28-pin spdip 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

DSPIC33EP64GP502-E/SP의 28-pin spdip 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP64GP502-E/SP.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

DSPIC33EP64GP502-E/SP 적합 용도: 6 애플리케이션s: Digital Power Supplies and PFC, BLDC/PMSM Motor Control, Industrial Sensing and CTMU Measurement, CAN Networking Nodes, Battery Chargers and Power Management, Prototype and Educational Embedded Platforms.

⚡

Digital Power Supplies and PFC

The DSPIC33EP64GP502-E/SP fits digital AC-DC and DC-DC power conversion because its High-Speed PWM peripheral provides complementary outputs, programmable dead time, and high resolution, while the 60 MIPS DSP core executes voltage- and current-loop compensators with deterministic latency. The three on-chip op amps buffer shunt and divider signals without external amplifier ICs, and the four comparators implement cycle-by-cycle overcurrent limiting independent of software. The extended -40C to +125C rating suits sealed PSU enclosures. In a typical PFC stage, the DSC closes the loop between the input bridge and MOSFET gate driver, achieving tightly regulated output with low component count; trade-off is firmware development effort versus a fixed-function analog controller.

🏭

BLDC/PMSM Motor Control

For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33EP64GP502-E/SP offers the High-Speed PWM for six-step or field-oriented-control gating, the on-chip op amps to amplify shunt-resistor phase currents, and comparators for hardware overcurrent trip that reacts faster than any software loop. The 60 MIPS 16-bit DSP engine executes the Park/Clarke transforms and PI compensators of FOC within the PWM period. The -40C to +125C E-grade covers motor-attached electronics where ambient near the controller rises above 85C. The 28-pin SPDIP also eases prototype revisions of drive boards; in volume, the same-die /MM QFN variant shrinks the layout without firmware changes.

🧩

Industrial Sensing and CTMU Measurement

The DSPIC33EP64GP502-E/SP suits industrial sensing nodes through its Charge Time Measurement Unit (CTMU), which enables precise capacitive-touch, time-of-flight, and resistance measurements, and the Peripheral Trigger Generator (PTG), which automates measurement sequences with minimal CPU intervention. On-chip op amps condition sensor outputs such as bridge or pH probes, and the 12-class analog front end feeds the DSP core for filtering and linearization at 60 MIPS. The extended -40C to +125C rating permits mounting in outdoor cabinets and near heat sources. CAN 2.0B connectivity links the node into factory buses; the result is a single-chip sensor frontend and fieldbus interface with fewer board-level components.

🌐

CAN Networking Nodes

With an integrated CAN 2.0B controller, the DSPIC33EP64GP502-E/SP serves as a compact fieldbus node for industrial and vehicular networks, requiring only an external CAN transceiver at the pins. The 60 MIPS core manages protocol stacks, message filtering, and application logic concurrently, while 8 KB SRAM buffers CAN traffic plus control state. The -40C to +125C E-grade rating is critical for under-hood and factory-floor installations where enclosures exceed industrial temperature limits. The 28-pin SPDIP through-hole format benefits serviceable industrial control panels where boards are socketed for field replacement; pair the DSC with a suitable CAN transceiver and 5 V-to-3.3 V supply regulation for a complete node.

🔋

Battery Chargers and Power Management

Smart battery chargers benefit from the DSPIC33EP64GP502-E/SP combination of High-Speed PWM for buck/boost power stages, on-chip op amps for precise charge-current sensing, and comparators for termination and fault thresholds implemented in hardware. The 60 MIPS DSP core runs charge algorithms (CC/CV, Li-ion safety timers, coulomb counting) with ample processing margin, and CTMU supports battery impedance estimation. The -40C to +125C range covers chargers integrated into engine bays and outdoor equipment. Firmware-programmable charging profiles let one hardware design serve multiple battery chemistries, reducing SKU count; the trade-off versus dedicated charger ICs is the need for validated firmware and safety review.

🔧

Prototype and Educational Embedded Platforms

The 28-pin SPDIP package of the DSPIC33EP64GP502-E/SP makes it a natural choice for breadboards, socketed prototype boards, university labs, and hobbyist DSP/motor-control platforms: through-hole pins accept direct socketing and hand soldering, while the extended E-grade silicon matches what ships in production. Users program it via ICSP with PICkit-class tools in MPLAB X with the XC16 compiler. The 60 MIPS core, 64 KB Flash, and integrated op amps/comparators let students implement real DSP filtering and closed-loop control without analog design overhead. When the prototype graduates to volume SMT manufacturing, the same-die /SO SOIC and /MM QFN variants allow a layout change without firmware rework.

What is the DSPIC33EP64GP502-E/SP?
The DSPIC33EP64GP502-E/SP is a Microchip Technology 16-bit Digital Signal Controller running at 60 MIPS with 64 KB Flash and 8 KB SRAM in a 28-pin SPDIP package. The E suffix indicates an extended -40C to +125C operating temperature range. Per Microchip product pages, the device integrates High-Speed PWM, CAN 2.0B, three op amps, four comparators, PTG and CTMU peripherals, and operates from a 3.0 V to 3.6 V supply.
What is the price of DSPIC33EP64GP502-E/SP?
As of 2026-09-25, DSPIC33EP64GP502-E/SP is priced at approximately $5.62 for single-piece quantities, dropping to roughly $3.51 at the 1000-unit break on XAIPART, with equivalent tiered discounting across authorized distributors. Octopart compares bulk pricing from 8 distributors for this MPN. Because DSC pricing fluctuates with inventory cycles, request a quote on this page for current volume pricing before finalizing your BOM cost.
Where to buy DSPIC33EP64GP502-E/SP online?
You can buy DSPIC33EP64GP502-E/SP on XAIPART, and it is also stocked by DigiKey (listed as 'ships today'), Mouser, Arrow, and Octopart-listed brokers such as Fusion Worldwide. DigiKey's product page shows the part as an in-stock dsPIC 33EP 16-Bit 60 MIPS 64KB Flash 28-SPDIP DSC. Always purchase through authorized distribution to avoid counterfeit risk on extended-temperature E-grade parts used in industrial designs.
Is DSPIC33EP64GP502-E/SP in stock and what is the lead time?
Yes, DSPIC33EP64GP502-E/SP is an active, in-production part listed as 'Order today, ships today' on DigiKey as of 2026-09-25. Microchip's product page confirms Status: In Production. Because the part is catalog-active rather than NRND, standard stocking distributors typically ship same-day with no factory lead time; broker channels (Octopart lists 8 distributors) provide backfill for volume orders beyond distributor inventory.
What is the difference between DSPIC33EP64GP502-E/SP and DSPIC33EP64GP502-E/MM?
The only meaningful difference is the package: the /SP variant is a 28-pin SPDIP through-hole package, while the /MM variant is a 28-pin QFN surface-mount package. Both use the same die with identical 60 MIPS core, 64 KB Flash, 8 KB SRAM, CAN, op amps, comparators, PTG and CTMU, and both carry the -40C to +125C E-grade rating. The /MM QFN is not drop-in on an SPDIP footprint, so choose /SP for through-hole prototyping and /MM for reflow production.
DSPIC33EP64GP502 vs DSPIC33EP32GP502 - which is better for digital power control?
For digital power control, the DSPIC33EP64GP502 is the better choice when your control firmware includes compensators, logging, or communication stacks that exceed 32 KB of program space. Both parts share the same 60 MIPS core, High-Speed PWM, and 28-pin SPDIP footprint; the only key difference is Flash, 64 KB versus 32 KB. If your compiled image is well under 32 KB, the DSPIC33EP32GP502 saves cost on the identical footprint; otherwise the 64 KB GP502 avoids late-stage memory pressure.
What is the best drop-in replacement for DSPIC33EP64GP502-E/SP?
The best drop-in replacement on the same 28-pin SPDIP footprint is DSPIC33EP64GP502-I/SP, which uses the identical die with an industrial -40C to +85C rating instead of the extended +125C E-grade; it is pin-to-pin compatible and fits applications that never exceed 85C ambient. For more Flash headroom, DSPIC33EP64GP504-I/SP is also SPDIP-28 pin-compatible with 128 KB Flash. Verify the exact temperature requirement before substituting E-grade with I-grade silicon.
Can DSPIC33EP32GP502 replace DSPIC33EP64GP502?
Yes, physically it can: the DSPIC33EP32GP502 in the /SP package is pin-to-pin compatible with the DSPIC33EP64GP502 on the 28-pin SPDIP footprint and offers the same 60 MIPS core and peripheral set. The functional limitation is program memory: 32 KB versus 64 KB of Flash, a 50% reduction. If your compiled application image occupies more than roughly 28 KB (leaving reserve for self-programming and future updates), the swap will overflow at link time and you must stay with the 64 KB part.
Is there an STM32 or other cross-brand equivalent for DSPIC33EP64GP502-E/SP?
No verified pin-to-pin cross-brand equivalent exists for the DSPIC33EP64GP502-E/SP in the 28-pin SPDIP package. STMicroelectronics STM32 and other cross-brand MCUs are functional alternatives but require a PCB redesign because their pinouts and footprints differ. Microchip's own dsPIC33EP family provides the only true drop-in options; Microchip also operates an official cross-reference search tool for migrating from competitor parts into the dsPIC33EP family, which is the recommended migration path.
When should I choose the /SP package over the /SO or /MM variants?
Choose the /SP 28-pin SPDIP variant for prototyping, breadboarding, socketed production, repairable industrial hardware, and educational platforms where through-hole soldering is an advantage. Choose /SO (SOIC-28) for standard reflow SMT production, and /MM (QFN-28) for minimum board area. All three package suffixes share the same die, 60 MIPS performance, and E-grade -40C to +125C temperature rating, so the decision is purely mechanical: assembly process, board space, and field serviceability.
Where to download the DSPIC33EP64GP502 datasheet PDF?
The official DSPIC33EP64GP502 datasheet PDF is available from Microchip's product page at microchip.com/en-us/product/dsPIC33EP64GP502. The document is a 510-page reference covering the 16-bit DSC family with up to 512 KB Flash, approximately 9 MB in file size. Mirror copies are hosted on Alldatasheet, Datasheet4U, and Octopart, but Microchip's site always carries the latest revision, which matters because errata and electrical specifications are updated there first.
Is DSPIC33EP64GP502-E/SP suitable for motor control applications?
Yes, the DSPIC33EP64GP502-E/SP is well suited to motor control: its High-Speed PWM peripheral generates complementary outputs with dead-time control for BLDC, PMSM, and stepper drives, while the on-chip op amps condition shunt-resistor current feedback and the comparators provide fast overcurrent trip without CPU latency. The 60 MIPS DSP core executes field-oriented-control loops with headroom. The extended -40C to +125C E-grade rating also covers sealed motor-drive environments where ambient near the controller can approach 105C.
What are the key specifications of DSPIC33EP64GP502-E/SP engineers should know?
Engineers should know these six key specifications: (1) 16-bit dsPIC33E DSC core at 60 MIPS; (2) 64 KB Flash program memory (22K x 24 instructions); (3) 8 KB SRAM; (4) 28-pin SPDIP package, extended -40C to +125C temperature grade; (5) 3.0 V to 3.6 V single supply; (6) integrated analog and connectivity including CAN 2.0B, three op amps, four comparators, High-Speed PWM, PTG and CTMU. These figures come from Microchip's product page and the family datasheet.
Does DSPIC33EP64GP502-E/SP require a programmer, and which tools are supported?
Yes, the DSPIC33EP64GP502-E/SP requires an external programmer such as Microchip PICkit 3/4, ICD 3/4, or REAL ICE, connected via the ICSP pins (MCLR, PGD, PGC) available on the 28-pin SPDIP. Development is done in MPLAB X IDE with the XC16 compiler, and Microchip Code Configurator (MCC) generates peripheral setup code. The ICSP pins are shared with general-purpose RB5/RB6 port functions, so design your connector footprint accordingly and avoid loading these pins during programming.
Is the DSPIC33EP64GP502 RoHS compliant and lead free?
The DSPIC33EP64GP502-E/SP is supplied in Microchip's standard commercial packaging, which is RoHS-compliant and lead-free, consistent with current Microchip In Production status for catalog parts. Microchip marks non-compliant legacy parts explicitly with a nickel-lead finish notice, which does not apply to this MPN. For the authoritative compliance certificate, download the RoHS certificate of compliance from the Microchip product page for your specific date code, as material declarations are maintained per manufacturing site.

엔지니어링 참조 데이터: DSPIC33EP64GP502-E/SP — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose DSPIC33EP64GP502-E/SP when your board must survive above 85C ambient (E-grade, up to +125C), needs on-chip op amps for current sensing, and requires a through-hole SPDIP for prototyping, socketing, or repairable industrial hardware. Choose DSPIC33EP64GP502-I/SP when your environment stays within -40C to +85C and unit cost matters more than temperature margin - it is the identical die on the identical footprint. Choose DSPIC33EP64GP504-I/SP when firmware outgrows 64 KB Flash and you can add external analog parts, since it doubles memory but drops the op amps. Choose DSPIC33EP32GP502-I/SP for cost-optimized designs with small firmware images. If your production line is reflow-based, select the same-die /SO (SOIC-28) or /MM (QFN-28) package variants instead - no firmware changes are needed, only a layout change.

대체품과의 비교

파라미터 이 제품 DSPIC33EP64GP502-I/SP DSPIC33EP64GP504-I/SP DSPIC33EP32GP502-I/SP
Package 28-pin SPDIP 28-pin SPDIP - same 28-pin SPDIP - same 28-pin SPDIP - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
CPU Speed 60 MIPS 60 MIPS 60 MIPS 60 MIPS
Flash Memory 64 KB 64 KB 128 KB 32 KB
SRAM 8 KB 8 KB 16 KB 4 KB
On-chip Op Amps 3 3 0 (GP family without op amps) 3
Operating Temperature -40C to +125C (E grade) -40C to +85C (I grade) -40C to +85C (I grade) -40C to +85C (I grade)
CAN Yes (CAN 2.0B) Yes Yes Yes

주요 차별점

  • Extended -40C to +125C temperature grade in through-hole SPDIP (vs DSPIC33EP64GP502-I/SP)
  • Integrated analog (3 op amps, 4 comparators) reduces BOM (vs DSPIC33EP64GP504-I/SP)
  • Full 64 KB program space on cost-optimized 28-pin footprint (vs DSPIC33EP32GP502-I/SP)

설계 노트

The DSPIC33EP64GP502-E/SP requires a single 3.0 V to 3.6 V supply with a VCAP/VDDCORE pin that must have the specified low-ESR capacitor to the internal core regulator. Never omit or substitute the VCAP capacitor value - the internal LDO becomes unstable and can cause sporadic resets that are difficult to diagnose. Decouple each VDD pin with 0.1 uF ceramic placed within 5 mm of the pin, plus one bulk 10 uF per supply rail.

In the SPDIP package, keep the MCLR/ICSP routing (MCLR, PGD, PGC on RB5/RB6) short and route it to a standard 5-pin ICSP header even in production boards; the cost is negligible and enables field firmware updates via the self-programmable 64 KB Flash. Avoid loading PGD/PGC with pull-downs stronger than 10k during programming, and place a 10k pull-up plus 100 ohm series resistor on MCLR for robust in-circuit programming.

A frequent substitution error is swapping the E-grade (-40C to +125C) part for the cheaper I-grade (-40C to +85C) sibling DSPIC33EP64GP502-I/SP in enclosures that reach 90C+; the part will run but reliability derates outside the rated range. Also verify Flash sizing before downgrading to DSPIC33EP32GP502: XC16 compiled images with CAN stacks and DSP libraries routinely exceed 32 KB. Check the errata document on the Microchip product page for the silicon revision on your date code before finalizing analog calibration constants.

규정 준수 정보

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Unknown

RoHS/lead-free per Microchip standard commercial packaging for current In Production catalog parts. REACH, halogen-free, and conflict-minerals declarations should be confirmed via the certificate of compliance on the Microchip product page for your date code.

데이터 검증일: 2026-09-25 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

Microchip Technology DSPIC33EP64GP502-E/SP DSPIC33EP64GP502-I/SP DSPIC33EP64GP504-I/SP DSPIC33EP32GP502-I/SP dsPIC33E Digital Signal Controller DSC 16-bit microcontroller 60 MIPS SPDIP-28 through-hole package CAN 2.0B CTMU PTG (Peripheral Trigger Generator) High-Speed PWM MPLAB X XC16 compiler RoHS extended temperature range digital power conversion BLDC motor control ICSP programming
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