DSPIC33EP64GS502T-E/MX - 70 MIPS 64KB Digital Power DSC | Microchip
부품 번호: DSPIC33EP64GS502T-E/MX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP64GS502T-E/MX 개요
A digital signal controller combines the compute throughput of a digital signal processor with the control peripherals, interrupt architecture and ease of use of a microcontroller. Within the power-management hierarchy, the dsPIC33EP family sits at the level of a dedicated power-conversion controller, bridging general-purpose MCUs and full DSPs. The dsPIC33EP64GS502 belongs to the SMPS and Digital Power Conversion family (dsPIC33EPXXGS50X), purpose-built for multi-loop digital switch-mode power supplies.
Key features include a 16-bit dsPIC33EP core with DSP engine, high-resolution PWM modules suited to peak-current-mode and multi-phase converters, and serial connectivity via I2C, SPI, UART and IrDA. The extended temperature grade (E suffix) supports automotive-adjacent and industrial environments up to 125C ambient.
Architecturally, the device pairs a pipelined 16-bit core with dedicated DSP instructions (MAC, DSP multiply) and fast interrupt handling, allowing closed-loop control loops for buck, boost, LLC and PFC stages to execute at hundreds of kHz update rates. According to Microchip product documentation, the GS50X family is optimized specifically for digital power applications rather than general embedded control.
Typical applications include AC-DC and DC-DC SMPS controllers, digital PFC stages, LED drivers, battery chargers, solar micro-inverters and intelligent lighting/power-supply subsystems where adaptive control algorithms replace analog compensation networks.
Design consideration: because the MX package is a 6x6 mm UQFN with an exposed thermal pad, allocate a solid ground pour and thermal vias under the pad; also verify PWM dead-time and ADC sampling synchronization in firmware, as digital power performance depends more on loop timing than on raw MIPS.
This page synthesizes verified distributor data, same-family drop-in alternatives, datasheet navigation and application guidance in one place, adding cross-reference and design value beyond the manufacturer datasheet alone.
드롭인 대체품: DSPIC33EP64GS502T-E/MX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP64GS502T-E/MX (동일 폼 팩터 및 풋프린트) — 차이점: Package, Packaging, Program Memory (Flash), Mounting Type, Core.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP64GS502-E/MX
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33EP64GS502T-I/MX
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP64GS502T-E/2N
✅ 드롭인✓ 재고 있음
$3.73 / 개
데이터시트 보기 →DSPIC33EP32GS502T-E/MX
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.08 / 개
데이터시트 보기 →DSPIC33EP128GS502T-E/MX
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP64GS506T-E/MX
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP64GS502T-E/MX 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dsPIC33EP Digital Signal Controller |
| Max CPU Speed | 70 MIPS |
| Program Memory Size | 64 KB (64K x 8) FLASH |
| RAM Size | 8 KB |
| 패키지 | 28-UQFN (MX), 6x6 mm |
| 동작 온도 범위 | -40C to +125C (E grade) |
| Interface Peripherals | I2C, SPI, UART, IrDA |
| Application Focus | SMPS and Digital Power Conversion |
| 실장 유형 | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Functional Safety Support | Yes (dsPIC33EP FuSa family) |
| RoHS 상태 | Compliant (per Microchip product family policy) |
DSPIC33EP64GS502T-E/MX 28-uqfn (mx), 6x6 mm 핀 구성 가이드
DSPIC33EP64GS502T-E/MX(28-uqfn (mx), 6x6 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP64GS502T-E/MX.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP64GS502T-E/MX 적합 용도: 6 애플리케이션s: AC-DC SMPS Digital Controller, Digital PFC Stage Control, DC-DC Converter Modules, LED Drivers and Intelligent Lighting, Battery Chargers, Solar Micro-Inverters.
AC-DC SMPS Digital Controller
The DSPIC33EP64GS502T-E/MX is purpose-built by Microchip for multi-loop digital switch-mode power supplies, per the manufacturer product page. Its 70 MIPS 16-bit core with DSP multiply-accumulate instructions executes voltage- and current-loop compensator ISRs at hundreds of kHz, while dedicated PWM and ADC peripherals support peak-current-mode control of flyback, forward and LLC stages. Firmware-based compensation replaces analog error amplifiers, enabling adaptive tuning, soft-start profiles and digital protection (OCP/OVP/OTP) in one IC. Placed as the sole control IC on the secondary or primary side, it reduces BOM count and allows field firmware updates; the trade-off versus analog controllers is firmware validation effort.
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Digital PFC Stage Control
Power-factor-correction stages in AC-DC supplies benefit directly from this DSC. The DSPIC33EP64GS502T-E/MX samples the input voltage, inductor current and bus voltage with its fast ADC, and generates the boost-switch PWM duty from a firmware compensator - average-current-mode PFC loops update cleanly at the device's 70 MIPS throughput. Digital implementation allows phase management, inrush control and dynamic bus-voltage trimming that analog PFC chips cannot offer. The E temperature grade (-40C to +125C) suits sealed adapters and enclosed power supplies near hot components. Design consideration: budget the control-loop ISR execution time carefully so ADC sampling, compensator math and PWM update all complete inside one switching period.
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DC-DC Converter Modules
For point-of-load and intermediate-bus DC-DC bricks, the DSPIC33EP64GS502T-E/MX provides multi-loop control (voltage, current, temperature) in a compact 28-UQFN 6x6 mm footprint that fits dense power modules. Its 64 KB FLASH stores multiple converter profiles selectable at runtime, and the 8 KB RAM handles state machines and telemetry buffering. UART/I2C links report VOUT, IOUT and fault status to a system host via PMBus-style messaging implemented in firmware. Compared with dedicated analog controllers, the digital approach adds programmability (sequencing, margining, foldback) at the cost of quiescent firmware complexity; the E temperature rating supports automotive-adjacent module environments.
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LED Drivers and Intelligent Lighting
High-current LED drivers demand precise, dimmable, thermally protected current control - a natural fit for this DSC. The DSPIC33EP64GS502T-E/MX drives buck or boost LED stages with its PWM outputs, implementing firmware dimming curves (PWM, analog or CCR dimming), multi-string current balancing and 2-wire or DALI-style communication over UART/I2C. Per the Microchip product family description, intelligent lighting power supplies are an explicitly supported GS50X use case. The 70 MIPS core leaves headroom for color-mixing and presence-detection logic in the same IC, consolidating driver and controller functions; the extended temperature grade tolerates luminaire enclosure heat.
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Battery Chargers
Multi-chemistry battery chargers (Li-ion, lead-acid, NiMH) require staged CC/CV charging profiles, thermal derating and safety cutoffs - all firmware tasks this DSC handles in one chip. The DSPIC33EP64GS502T-E/MX closes the charging current loop at high update rate using its PWM and fast ADC, executes charge-state machines from its 64 KB FLASH, and communicates charge status to a host over UART or I2C. Digital control enables adaptive algorithms (impedance tracking, dynamic charge termination) impossible with fixed analog chargers. Its -40C to +125C E grade covers vehicle and industrial charging environments. Verify ADC channel count in the datasheet matches your voltage/current/temperature sensing budget.
추천
Solar Micro-Inverters
Micro-inverter control demands simultaneous MPPT execution, grid-synchronous current injection and safety monitoring - a workload matched to the DSPIC33EP64GS502T-E/MX's 70 MIPS DSP core. Firmware runs the MPPT search while a second control loop shapes the grid current waveform via the high-resolution PWM outputs, with grid-fault detection (over/under voltage and frequency) in software. The 64 KB FLASH accommodates MPPT, grid-connection and communication firmware together. The extended temperature grade suits outdoor, thermally stressed enclosures. Trade-off versus dedicated inverter ASICs: full flexibility and certification-driven firmware control in exchange for higher software validation effort and loop-timing discipline.
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추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP64GS502T-E/MX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP64GS502-E/MX | DSPIC33EP64GS502T-I/MX | DSPIC33EP64GS502T-E/2N | DSPIC33EP32GS502T-E/MX | DSPIC33EP128GS502T-E/MX |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (MX) 6x6 mm | 28-UQFN (MX) 6x6 - same | 28-UQFN (MX) 6x6 - same | 28-UQFN 6x6 - verify footprint code | 28-UQFN (MX) 6x6 - same | 28-UQFN (MX) 6x6 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Program Memory | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 128 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 60-70 MIPS (listing variance - verify) | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Serial Peripherals | I2C, SPI, UART, IrDA | I2C, SPI, UART, IrDA | I2C, SPI, UART, IrDA | I2C, SPI, UART, IrDA | I2C, SPI, UART, IrDA | I2C, SPI, UART, IrDA |
주요 차별점
- Extended -40C to +125C temperature grade (vs DSPIC33EP64GS502T-I/MX)
- Upgrade path without PCB change (vs DSPIC33EP128GS502T-E/MX)
- Digital-power-optimized peripheral set (vs Generic dsPIC33EP GP502 family parts)
- Trade-off: no verified cross-brand drop-in (vs STM32F334 (conceptual equivalent))
설계 노트
The 28-UQFN (MX) 6x6 mm package has a central exposed thermal pad that must be soldered to a grounded copper pour for both thermal dissipation and a low-inductance ground return. Use a 4x4 (or per-land-pattern-recommendation) via array under the pad to tie into inner ground planes. Follow the Microchip UQFN land-pattern guideline exactly - paste segmentation on the thermal pad prevents solder voiding and device tombstoning during reflow.
Decouple each VDD pin with a 0.1 uF ceramic capacitor placed within 2 mm of the pin, plus one bulk 4.7-10 uF capacitor near the device (typical dsPIC33EP practice; verify exact values in the datasheet capacitor table). In digital power layouts, keep the controller's analog supply separate from power-stage gate-drive rails, or filter the controller supply with an RC/LC network, so switching-node transients do not corrupt ADC readings and cause control-loop jitter.
Two frequent errors: (1) forgetting that ICSP programming pins (MCLR, PGD, PGC) must have header access on the production PCB - omitting them forces rework; (2) assuming the /MX and /2N ordering codes share an identical land pattern - they are different package codes, so verify the datasheet outline before a BOM substitution. Also configure unused I/O as outputs-low or inputs with pull resistors per Microchip's I/O guideline to prevent floating-pin leakage in power products.
In SMPS layouts, route the PWM outputs away from ADC input traces and the crystal/OSC pins; a switching node running millivolts of coupled noise into an ADC sense line translates directly into output-voltage ripple in a digital control loop. Keep the sense traces as a Kelvin connection to the shunt or divider, and sample ADC as far from the PWM switching edge as the loop timing allows.
규정 준수 정보
RoHS/lead-free inferred from Microchip current-production policy for dsPIC33EP MX-package parts; per-part certificate not present in retrieved data - confirm via Microchip environmental datasheet. Not an AEC-Q100 qualified ordering code; the Q1/automotive variants of the family carry that qualification.
