DSPIC33EV256GM104-E/ML - 16-bit 60 MIPS 5V DSC | Microchip
부품 번호: DSPIC33EV256GM104-E/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.1 | $6.10 |
| 10 | $5.55 | $55.50 |
| 100 | $4.8 | $480.00 |
| 500 | $4.35 | $2,175.00 |
| 1,000 | $3.9 | $3,900.00 |
DSPIC33EV256GM104-E/ML 개요
A digital signal controller combines the computational core of a microcontroller with the mathematical acceleration of a digital signal processor in a single chip. Within the power management hierarchy of embedded systems, a DSC such as the dsPIC33EV sits between general-purpose MCUs and dedicated DSPs, offering deterministic control loops plus math-intensive signal processing. The dsPIC33EV family from Microchip targets harsh-environment 5V industrial, appliance, and automotive designs where 3.3V processors require level-shifting.
Key features include an extended-temperature rating (-40C to +125C), 4.5V to 5.5V single-supply operation, an on-chip CAN 2.0B controller, six motor-control PWM channels, four integrated operational amplifiers, and a Charge Time Measurement Unit (CTMU) for capacitive touch and time-domain measurements. Hardware ECC on the 256KB Flash program memory protects against bit errors, supporting functional-safety (FuSa) development as flagged on distributor listings.
Architecturally, the dsPIC DSC core pairs a 16-bit modified Harvard pipeline with DSP engine features including a barrel shifter, high-throughput multiply-accumulate, and four DMA channels that move data between peripherals and RAM without CPU intervention. The SENT peripheral supports the SAE J2716 single-wire automotive sensor protocol, and dual UART/SPI/I2C communication resources round out connectivity.
Typical applications include automotive sensor and control units, BLDC/PMSM motor control drives, industrial automation nodes on CAN networks, and appliance power-stage supervision. The 5V rail tolerance and extended temperature range eliminate external level translators in noisy 24V systems with 5V logic domains.
For design, place 0.1uF decoupling on every VDD pin and keep the exposed thermal pad soldered to a ground pour for thermal and EMI performance. The 60 MIPS rating corresponds to a 60 MHz instruction clock from an external or internal oscillator source.
This page synthesizes verified distributor specifications, drop-in family alternatives, and application guidance not consolidated in the manufacturer datasheet, with pricing as of 2026-09-26.
드롭인 대체품: DSPIC33EV256GM104-E/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EV256GM104-E/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Functional Safety Support, On-chip Op Amps, SENT Peripheral.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EV256GM104-I/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EV128GM104-E/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33EV64GM104-E/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.85 / 개
데이터시트 보기 →DSPIC33EV32GM104-E/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EV256GM104-E/MLVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33EV256GM006-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.1 / 개
데이터시트 보기 →DSPIC33EV256GM104-E/ML 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dsPIC DSC |
| Max CPU Speed | 60 MIPS (60 MHz) |
| Program Memory | 256KB (85.5K x 24) ECC Flash |
| RAM Size | 16 KB |
| Supply Voltage Range | 4.5 V to 5.5 V |
| 동작 온도 | -40C to +125C (E grade) |
| 패키지 | 44-QFN (8x8 mm) with exposed pad |
| CAN Controller | Yes (CAN 2.0B) |
| Motor Control PWM | 6 channels |
| On-chip Op Amps | 4 |
| CTMU | Yes (Charge Time Measurement Unit) |
| SENT Peripheral | Yes (SAE J2716) |
| DMA Channels | 4 |
| Barrel Shifter | Yes |
| Technology | CMOS |
| Functional Safety Support | Yes (FuSa class per DigiKey listing) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
DSPIC33EV256GM104-E/ML 44-qfn (8x8 mm) with exposed pad 핀 구성 가이드
DSPIC33EV256GM104-E/ML(44-qfn (8x8 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EV256GM104-E/ML.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EV256GM104-E/ML 적합 용도: 6 애플리케이션s: Automotive Sensor and Control Units, BLDC and PMSM Motor Control Drives, Industrial CAN Network Nodes, Appliance Power and Control Boards, Battery-Powered and Portable Industrial Instruments, Embedded Data Acquisition and Logging Systems.
Automotive Sensor and Control Units
The DSPIC33EV256GM104-E/ML fits automotive sensor nodes and body control units because it combines a -40C to +125C temperature rating with 5V I/O that speaks directly to legacy automotive signaling levels. The integrated SENT peripheral implements the SAE J2716 sensor protocol, while the CAN 2.0B controller connects the node to the vehicle network with hardware message buffering that offloads the 60 MIPS core. ECC-protected 256KB Flash sustains code integrity across temperature and lifetime drift, supporting functional-safety (FuSa) workflows flagged in the family positioning. The four on-chip op amps condition analog sensor fronts without external amplifiers, reducing board area. Used as the main controller between SENT sensors and the CAN bus, the device trades a lower clock than 32-bit alternatives for deterministic 16-bit timing, lower EMI, and single-supply 5V operation that eliminates level-shift components in the harness interface.
추천
BLDC and PMSM Motor Control Drives
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33EV256GM104-E/ML provides six motor-control PWM channels with complementary outputs and dead-time insertion, plus four on-chip operational amplifiers that amplify shunt-resistor current feedback internally. The 60 MIPS DSP core executes field-oriented control (FOC) loops with multiply-accumulate and barrel-shift operations, keeping current-loop bandwidth high at moderate clock rates. The 5V rail drives industry-standard gate drivers without level translation, and the -40C to +125C E-grade rating survives drive-enclosure heat. ECC Flash protects the control firmware, which is critical because corrupted loop code can destroy a power stage. In a typical topology the device reads three phase currents through the internal op amps, computes the FOC transform, and updates the six PWM channels each control cycle, with the CTMU supporting position-sensor or touch interfaces on the same board.
추천
Industrial CAN Network Nodes
Industrial automation nodes benefit from the DSPIC33EV256GM104-E/ML's combination of CAN 2.0B networking, four DMA channels, and 5V noise-immune I/O. On a factory bus, the CAN controller handles frame arbitration and error containment in hardware while DMA moves received messages directly into the 16KB RAM, keeping CPU load low for application logic running at 60 MIPS. The 256KB ECC Flash accommodates protocol stacks, a bootloader, and field-updatable application code with room to spare. The extended -40C to +125C rating covers panel-mounted enclosures near drives and power supplies where ambient temperatures climb. Compared with 3.3V MCUs, the native 5V ports tolerate industrial noise margins and connect to legacy PLC I/O without buffers. Four op amps and the CTMU additionally support local analog and capacitive-sensing duties, making the part a single-chip node controller for remote I/O modules and machine-mounted sensors.
추천
Appliance Power and Control Boards
Appliance main control boards - washing machines, dishwashers, induction cooktops - use the DSPIC33EV256GM104-E/ML because it merges motor PWM, analog front-ends, and user-interface resources on one 5V chip. The six motor-control PWM channels drive compressor or drum motor stages, while the four op amps and ADC channels read temperature (NTC), pressure, and current sensors directly at 5V signal levels common in white goods. The CTMU enables capacitive-touch buttons on the sealed fascia without dedicated touch ICs, and the -40C to +125C rating tolerates heat near motor windings and power electronics. ECC Flash ensures firmware integrity through mains-borne transients typical of appliance environments. Per the Microchip family positioning, harsh-environment appliance designs are a primary dsPIC33EV target. The single-chip approach shortens BOM and certification effort by removing level shifters, separate amplifiers, and touch controllers from the board.
추천
Battery-Powered and Portable Industrial Instruments
Handheld and portable industrial instruments - HVAC analyzers, environmental meters, diagnostic tools - deploy the DSPIC33EV256GM104-E/ML for its 60 MIPS signal-processing throughput, generous 256KB ECC Flash, and integrated analog conditioning. The DSP engine accelerates FFT and filtering on sampled data from the four on-chip op amps feeding the ADC, while four DMA channels stream conversion results into the 16KB RAM without CPU stalls. Native 5V operation simplifies battery-pack power design where 3.3V rails require extra regulation, and the 44-QFN 8x8 mm package fits compact enclosures. The -40C to +125C grade covers instruments left in vehicles or used near machinery. CTMU-based capacitive touch supports button-free sealed front panels, and UART/SPI/I2C ports connect displays and wireless modules. Designers trade the dsPIC's 16-bit architecture for lower EMI and deterministic timing versus higher-clocked 32-bit parts in battery-tight designs.
추천
Embedded Data Acquisition and Logging Systems
Standalone data loggers and distributed acquisition nodes use the DSPIC33EV256GM104-E/ML where analog channels, timestamping, and networked upload must coexist. The four on-chip op amps buffer sensor signals before the integrated ADC, the CTMU provides precise time-interval and charge measurement for event timing, and four DMA channels move samples into the 16KB RAM while the 60 MIPS core compresses and formats records. The 256KB ECC Flash stores both firmware and boot/configuration data with error protection suited to long unattended deployments, and the CAN interface feeds records into vehicle or plant networks. The -40C to +125C E-grade rating allows mounting in engine bays, outdoor cabinets, and process equipment. Compared with external front-end amplifier ICs, the integrated analog path reduces board area and calibration points; the trade-off is 16-bit precision that suits industrial ranges rather than laboratory-grade metrology.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EV256GM104-E/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EV256GM104-I/ML | DSPIC33EV128GM104-E/ML | DSPIC33EV64GM104-E/ML | DSPIC33EV32GM104-E/ML | DSPIC33EV256GM104-E/MLVAO |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 256KB (85.5K x 24) ECC | 256KB (85.5K x 24) ECC | 128KB ECC | 64KB ECC | 32KB ECC | 256KB (85.5K x 24) ECC |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Temperature Range | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| CAN / SENT / Op Amps | CAN 2.0B / SENT / 4 op amps | CAN 2.0B / SENT / 4 op amps | CAN 2.0B / SENT / 4 op amps | CAN 2.0B / SENT / 4 op amps | CAN 2.0B / SENT / 4 op amps | CAN 2.0B / SENT / 4 op amps |
| Key Selection Trade-off | Maximum Flash for extended-temperature designs | Lower cost where ambient stays below +85C | Lower cost if code fits 128KB | Cost-optimized for small firmware | Lowest cost drop-in, minimal Flash | Equivalent with vaqualified flow marking |
주요 차별점
- Extended -40C to +125C operation in the full 44-QFN family (vs DSPIC33EV256GM104-I/ML)
- Largest Flash density available in the pin-compatible 44-QFN footprint (vs DSPIC33EV128GM104-E/ML)
- Integrated analog front-end (4 op amps + CTMU) (vs DSPIC33EV32GM104-E/ML)
- Trade-off: 16-bit architecture vs modern 32-bit MCUs (vs STM32G4-series (cross-brand, non-drop-in))
설계 노트
The 44-QFN 8x8 mm package has an exposed thermal pad that must be soldered to a grounded copper pour with an array of thermal vias. This pad is the primary ground return and heat-removal path; an unsoldered or cold-soldered pad raises junction temperature and worsens EMC performance. Decouple each VDD pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus one bulk 4.7uF to 10uF capacitor near the supply entry. Follow the layout guidelines in the dsPIC33EVXXXGM00X/10X family data sheet (DS70005144H) minimum connection chapter before first power-up.
The device operates from a nominal 5V supply with a 4.5V to 5.5V permitted range. In automotive or industrial systems powered through a 12V/24V rail, use a regulator that stays within this window across load transients and cold crank. Estimated: at 60 MHz operation with moderate I/O loading, core plus peripheral current is typically in the tens-of-milliamps range; verify exact figures in the datasheet electrical characteristics tables rather than sizing the regulator from estimates. Brown-out and low-voltage detection features should be enabled so Flash writes and PWM outputs are held safe during supply dips.
Do not confuse package suffixes: the /ML variant is the 44-QFN 8x8 mm, while /PT is the 44-TQFP 10x10 mm - they share peripheral mapping but are not footprint-compatible. Second, the E grade (-40C to +125C) is required for automotive under-hood use; substituting the cheaper I grade limits you to +85C ambient. Third, when migrating to a smaller-Flash drop-in variant, confirm the compiled image plus bootloader fits below the target Flash size and that the linker addresses remain valid. Finally, enable ECC-checked Flash handling per the family reference manual in functional-safety projects.
When driving the six motor-control PWM channels to external gate drivers, keep PWM traces short and matched in length, and route them away from the analog front-end feeding the four on-chip op amps. Use the internal dead-time insertion rather than software delays for precise complementary switching. For the CAN interface, place the transceiver close to the CAN TX/RX pins with a local ground reference and a common-mode choke at the connector. The 5V I/O edges are fast enough to require attention to crosstalk on adjacent analog traces in mixed-signal appliance boards.
규정 준수 정보
RoHS compliance and lead-free finish inferred from Microchip current-production policy for the dsPIC33EV family; formal REACH/halogen/conflict-minerals declarations not present in the retrieved data - request compliance certificates from Microchip.
