DSPIC33EV64GM006T-I/MR - 16-bit 70 MIPS 5V DSC 64KB Flash | Microchip
부품 번호: DSPIC33EV64GM006T-I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.88 | $48.80 |
| 100 | $4.35 | $435.00 |
| 500 | $3.9 | $1,950.00 |
| 1,000 | $3.52 | $3,520.00 |
DSPIC33EV64GM006T-I/MR 개요
A digital signal controller combines the compute architecture of a microcontroller with DSP-style math acceleration in a single chip. In the product hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP: it executes real-time control loops (PI, FOC, digital filters) with single-cycle MAC instructions while retaining peripherals, interrupts, and I/O familiar to embedded firmware teams. The dsPIC33EV family extends this concept to 5V operation, directly interfacing with industrial and automotive sensors without level shifting.
Key features include a 16-bit modified Harvard core running at up to 70 MIPS, 64KB of ECC-protected Flash for functional-safety designs, and an operating voltage range centered on 5V for harsh, noisy environments. The ECC Flash protects program memory against single-bit faults, which supports reliability targets in motor control and power conversion products.
Technically, the device integrates DMA channels, multiple timers, and a 10-bit ADC with many input channels for simultaneous sampling of phase currents and bus voltages in motor drives. DSP engine features (barrel shifter, single-cycle MAC, modulo and bit-reversed addressing) enable efficient filter and transform execution without an external DSP.
Typical applications include brushless DC and PMSM motor control, switch-mode power supplies and digital power conversion, and automotive/industrial sensor interfaces operating in high-vibration, high-noise conditions.
Design consideration: exploit the exposed thermal pad of the VQFN-64 for ground plane heat spreading, and use the ECC Flash plus watchdog features early in your safety analysis rather than retrofitting them.
This page synthesizes distributor pricing, drop-in same-family alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33EV64GM006T-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EV64GM006T-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Core, Peripherals, Product Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EV256GM006-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.1 / 개
데이터시트 보기 →DSPIC33EV256GM006-E/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EV128GM006-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.3 / 개
데이터시트 보기 →DSPIC33EV64GM006T-E/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EV64GM106T-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EV256GM106T-I/MR
✅ 드롭인✓ 재고 있음
$3.72 / 개
데이터시트 보기 →DSPIC33EV64GM006T-I/MR 최대 정격 & 전기적 특성
| Core | dsPIC33EV 16-bit DSC core |
| Core Architecture | 16-bit modified Harvard, CISC |
| Max CPU Speed | 70 MIPS |
| Program Memory | 64KB (22K x 24) ECC Flash |
| RAM | 8KB |
| 공급 전압 | 5V |
| 패키지 | 64-VQFN (9x9 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| Number of Timers | 9 |
| DMA Channels | 4 |
| ADC Resolution | 10-bit |
| ADC Channels | 36 |
| 동작 온도 | -40C to +85C (I grade) |
| Functional Safety Support | Yes (FuSa variant designation) |
| Packaging | Tape & Reel (T) |
| Product Family | dsPIC33EV64GM006 series |
DSPIC33EV64GM006T-I/MR 64-vqfn (9x9 mm) with exposed pad 핀 구성 가이드
DSPIC33EV64GM006T-I/MR(64-vqfn (9x9 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EV64GM006T-I/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EV64GM006T-I/MR 적합 용도: 6 애플리케이션s: Brushless DC / PMSM Motor Control, Digital Power Conversion (SMPS, PFC, Solar Inverters), Automotive Body and Sensor Control Units, Industrial Appliances (Washing Machines, Compressors, HVAC), Sensor Interfaces and Data Acquisition Nodes, Battery Chargers and Power Management Units.
Brushless DC / PMSM Motor Control
The DSPIC33EV64GM006T-I/MR fits motor control because its 16-bit dsPIC33EV core executes single-cycle MAC and DSP multiply instructions at 70 MIPS, sustaining field-oriented-control (FOC) loop rates in the tens of kilohertz. The 36-channel 10-bit ADC samples phase currents and DC bus voltage, while dedicated motor-control PWM peripherals generate complementary outputs with dead time for the inverter bridge. Quadrature Encoder Interface (QEI) inputs handle position feedback from incremental encoders, or sensorless algorithms run from back-EMF observations on the same ADC. Placed in a 9x9 mm VQFN-64 with exposed pad, the controller sits close to gate drivers, shortening analog traces and improving noise immunity on current-sense inputs. The 5V I/O domain also talks directly to hall sensors and industrial encoders without level shifting, a concrete benefit over 3.3V Cortex-M alternatives in electrically noisy drive cabinets.
추천
Digital Power Conversion (SMPS, PFC, Solar Inverters)
Digital power supplies need deterministic, high-rate control loops, and the DSPIC33EV64GM006T-I/MR delivers with its 70 MIPS DSP core: a boost PFC current loop at 100 kHz or a phase-shifted full-bridge voltage loop closes comfortably in software. The high-speed 10-bit ADC with multiple simultaneous channels samples input/output voltages and inductor current each switching period, synchronized to the PWM via trigger outputs so sampling noise from switching transients is avoided. The 4 DMA channels stream sampled data without CPU intervention, keeping loop latency predictable. Because the dsPIC33EV family operates from 5V, gate-driver and optocoupler interface levels match legacy industrial power rails directly. ECC Flash protects firmware from single-bit upsets caused by high dv/dt environments in switch-mode converters, supporting long-term field reliability in telecom rectifiers, server PSUs, and solar micro-inverter control boards.
추천
Automotive Body and Sensor Control Units
The dsPIC33EV family is explicitly targeted by Microchip at harsh automotive and appliance environments with noise and vibration, and the VAO-qualified variant of this exact die extends the option to automotive programs. The DSPIC33EV64GM006T-I/MR handles LIN/CAN-networked body functions such as pump control, wiper modules, and actuator position loops: the 5V I/O connects to inductive position sensors and Hall switches natively, and robust ESD/noise margins reduce component count versus dual-rail 3.3V designs. The 36-channel 10-bit ADC digitizes multiple sensor inputs (pressure, temperature bridges) at 0-5V range, and ECC Flash preserves program integrity under automotive load-dump-induced EMI. The industrial -I temperature grade covers under-dash and engine-bay-adjacent modules; for full under-hood requirements select the E-grade or VAO variant. Firmware support includes Microchip's functional-safety collateral for FuSa-targeted designs.
추천
Industrial Appliances (Washing Machines, Compressors, HVAC)
Appliance motor drives combine cost pressure, vibration, and conductive-noise challenges - precisely the profile Microchip cites for the dsPIC33EV family. The DSPIC33EV64GM006T-I/MR runs sensorless FOC or trapezoidal control for washing-machine direct-drive motors, compressor drives, and HVAC blower motors from a single chip: 70 MIPS accommodates both the control loop and housekeeping tasks (temperature monitoring, cycle sequencing, user interface scanning). The 5V-tolerant I/O reads AC-zero-cross detection, door-interlock switches, and NTC thermistor dividers directly, while the 10-bit ADC handles current feedback. Vibration tolerance benefits from the VQFN solder-joint geometry, and the ECC Flash prevents code corruption from relay-contact transients common in appliance control boxes. The 64-pin package provides enough PWM outputs to drive both a main motor and auxiliary loads (drain pumps, fans) from one controller, reducing BOM cost.
추천
Sensor Interfaces and Data Acquisition Nodes
Industrial sensor nodes benefit from the DSPIC33EV64GM006T-I/MR's combination of a 36-channel 10-bit ADC, DSP math for filtering and linearization, and multiple communication ports for fieldbus attachment. Thermocouple, RTD, and pressure-bridge signals conditioned to 0-5V feed the ADC directly without external level translation; on-chip DSP instructions execute IIR/FIR filtering and thermocouple linearization in real time at 70 MIPS. SPI, I2C, UART, and CAN interfaces connect to display drivers, external precision ADCs, and plant networks respectively, while the 4 DMA channels offload data streaming. The 64-pin footprint exposes enough GPIO for valve and relay control alongside acquisition, making one controller serve as a complete measurement-and-actuation node. Operation from a single 5V industrial rail simplifies power-tree design in retrofitted panels where 3.3V rails do not exist, and the VQFN exposed pad aids thermal and ground integrity in metal enclosures.
추천
Battery Chargers and Power Management Units
Smart battery chargers require synchronized multi-channel control plus safety supervision, a strong fit for the DSPIC33EV64GM006T-I/MR. Its high-speed 10-bit ADC monitors battery voltage, charge current, and pack temperature on separate channels each cycle, and the 70 MIPS DSP core implements CC/CV charging curves, coulomb-counting, and delta-peak termination algorithms with headroom for logging. Motor-control-class PWM peripherals generate the buck or buck-boost converter switching at tens to hundreds of kilohertz with cycle-by-cycle current limiting. The 5V I/O domain interfaces directly with industrial charger front-ends, relays, and indicator LEDs. ECC Flash protects charge-profile firmware, and abundant timers support watchdog and sequencing functions required by safety standards for lithium charging. The 64-pin VQFN provides GPIO for multi-bank charger designs, fan control, and communication with host systems over CAN or UART, consolidating the entire charger controller into one device.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EV64GM006T-I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EV256GM006-I/MR | DSPIC33EV128GM006-I/MR | DSPIC33EV64GM006T-E/MR | DSPIC33EV256GM106T-I/MR |
|---|---|---|---|---|---|
| Package | VQFN-64 (MR, 9x9 mm, exposed pad) | VQFN-64 (MR, 9x9 mm) - same | VQFN-64 (MR, 9x9 mm) - same | VQFN-64 (MR, 9x9 mm) - same | VQFN-64 (MR, 9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / MIPS | dsPIC33EV 16-bit, 70 MIPS | dsPIC33EV 16-bit, 70 MIPS | dsPIC33EV 16-bit, 70 MIPS | dsPIC33EV 16-bit, 70 MIPS | dsPIC33EV 16-bit, 70 MIPS |
| Program Memory | 64KB ECC Flash | 256KB ECC Flash | 128KB ECC Flash | 64KB ECC Flash | 256KB ECC Flash |
| RAM | 8KB | 8KB | 8KB | 8KB | 8KB (verify per datasheet) |
| Supply Voltage | 5V | 5V | 5V | 5V | 5V |
| Temperature Grade | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) |
주요 차별점
- Native 5V operation eliminates level shifting (vs DSPIC33EV256GM006-I/MR)
- More code headroom at same footprint (vs DSPIC33EV64GM006T-E/MR)
- Cost-efficient entry to 64-pin peripheral density (vs DSPIC33EV256GM106T-I/MR)
설계 노트
Connect the VQFN-64 exposed pad to a solid ground pour with an array of thermal vias (4x4 grid recommended) to the inner ground layer. The exposed pad is the primary ground return for the die; relying only on perimeter ground pins increases ground bounce on the analog domain and degrades ADC accuracy. Estimated: with a 4x4 via array and 2 oz copper, thermal resistance drops substantially versus no-pad connection, keeping junction rise low at the estimated ~0.25 W dissipation at 70 MIPS. Follow Microchip's layout guidelines in the dsPIC33EV family reference manual.
Decouple each VDD pin with 0.1 uF ceramic capacitors placed within 2 mm of the pin, plus at least one bulk 4.7-10 uF capacitor near the package. Keep AVDD on its own RC filter (ferrite bead plus 0.1 uF and 1 uF) from the digital rail to preserve 10-bit ADC accuracy in motor-drive environments with high switching noise. Estimated: an AVDD ripple below 1 LSB (about 4.9 mV at 5V full scale) requires rejection of inverter switching transients, which the RC network plus proper star grounding provides.
Do not assume pin compatibility across dsPIC33EV family members without checking the datasheet pin diagram: the GM002/GM004 variants use different footprints (SP, SS, PT, P8, ML suffixes) and peripheral-to-pin mapping changes with pin count. When swapping between GM006 memory grades (64/128/256KB) in the same MR footprint, verify the configuration-word and PPS mapping remain identical in MPLAB X before programming. Also confirm MCLR programming voltage requirements for your ICSP toolchain, as dsPIC33EV parts require specific programming voltages per the programming specification.
규정 준수 정보
Compliance status not stated in provided web data; verify RoHS/REACH status on the Microchip product page. AEC-Q100 qualification applies only to the VAO/automotive variants of the dsPIC33EV64GM006 die, not this standard I-grade part.
