DSPIC33FJ128GP306A-E/MR - 16-bit DSC 40MIPS 128KB | Microchip
부품 번호: DSPIC33FJ128GP306A-E/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.15 | $7.15 |
| 10 | $6.55 | $65.50 |
| 100 | $6.05 | $605.00 |
| 500 | $5.6 | $2,800.00 |
| 1,000 | $5.2 | $5,200.00 |
DSPIC33FJ128GP306A-E/MR 개요
A digital signal controller (DSC) is a hybrid of a microcontroller (MCU) and a digital signal processor (DSP): it pairs a 16-bit RISC CPU with DSP instructions, a barrel shifter, and multiple internal buses, so one chip can run both real-time control loops and signal-processing algorithms. DSCs sit within the broader embedded-processor hierarchy alongside general-purpose MCUs and DSPs.
Key features include the 40 MHz / 40 MIPS 16-bit dsPIC core, 128KB self-programming Flash, extensive analog and digital peripherals typical of the dsPIC 33F General Purpose family, automotive AEC-Q100 qualification, and the thermally efficient 64-VFQFN exposed-pad package with 0.5 mm terminal pitch. Seamless migration options exist to PIC24 MCUs and dsPIC30F DSCs in similar packages.
Architecturally, the device uses a modified Harvard, fixed-point CMOS core with multiple internal buses and a barrel shifter, supporting boundary scan (JTAG) for test. The A suffix denotes the enhanced revision of the dsPIC33FJ128GP306 die with improved errata coverage and peripheral refinements over the original part.
Typical applications include automotive control modules, motor control and power conversion, digital power supplies, and industrial sensing and signal-conditioning systems where DSP math and robust MCU peripherals must coexist in a compact, thermally capable package.
For design, decouple all VDD/VDDCORE pins with 0.1 uF ceramics close to the package and take full advantage of the exposed thermal pad for ground and heat conduction. The 9x9 mm QFN demands attention to via-in-pad design for rework access.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33FJ128GP306A-E/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33FJ128GP306A-E/MR (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Supply Voltage, Core Architecture, Packaging.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33FJ128GP306A-I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ128GP306AT-E/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ256GP306A-E/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ64GP306A-E/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33EV256GM006-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.1 / 개
데이터시트 보기 →DSPIC33FJ128GP306A-E/MR 최대 정격 & 전기적 특성
| Core | dsPIC33F, 16-bit |
| Program Memory Size | 128KB (128K x 8) Flash |
| Maximum Operating Frequency | 40 MHz |
| Performance | 40 MIPS |
| 공급 전압 | 3.0 V to 3.6 V (3.3 V nominal) |
| 동작 온도 | -40C to +125C (E, extended) |
| 패키지 | 64-VQFN (9x9 mm), Exposed Pad |
| Terminal Pitch | 0.5 mm |
| 실장 유형 | Surface Mount |
| Architecture | Fixed-point DSP, barrel shifter, multiple internal buses |
| Boundary Scan | Yes (JTAG) |
| Qualification | Automotive, AEC-Q100 |
| Family | dsPIC 33F General Purpose |
| Migration Path | Seamless migration to PIC24 MCU and dsPIC30F DSC in similar packages |
| Packaging | Tube (per findic listing) |
DSPIC33FJ128GP306A-E/MR 64-vqfn (9x9 mm), exposed pad 핀 구성 가이드
DSPIC33FJ128GP306A-E/MR(64-vqfn (9x9 mm), exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33FJ128GP306A-E/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33FJ128GP306A-E/MR 적합 용도: 6 애플리케이션s: Automotive Control Modules, Digital Motor Control, Digital Power Supplies, Industrial Sensing and Signal Conditioning, Audio and Speech Processing, Embedded Control and IoT Nodes.
Automotive Control Modules
The DSPIC33FJ128GP306A-E/MR fits automotive electronic control units because it is AEC-Q100 qualified and rated -40C to +125C, covering harsh in-vehicle environments. Its 40 MIPS 16-bit DSP core runs closed-loop control and diagnostic algorithms deterministically, while 128KB self-programming Flash supports field firmware updates. In body-control, sensor-fusion, or actuator-driver modules, the QFN-64 exposed-pad package provides both compactness and a low-impedance ground/thermal path. Designers should qualify the supply network against automotive load-dump transients and use the JTAG boundary scan for production board test.
추천
Digital Motor Control
Digital motor control is a classic dsPIC33F use case: the DSPIC33FJ128GP306A-E/MR executes field-oriented control (FOC) at 40 MIPS using hardware DSP multiply and a barrel shifter, sustaining kHz-rate current loops for PMSM, BLDC, and induction machines. Family PWM, ADC, and timer peripherals synchronize sampling to PWM edges, minimizing torque ripple. The -40C to +125C rating tolerates drive-enclosure heat, and the QFN-64 exposed pad conducts gate-driver and MCU ground current cleanly. Budget cycle time carefully: FOC at 20 kHz consumes a significant fraction of the 40 MIPS budget, leaving headroom for communications and supervision.
추천
Digital Power Supplies
In digital power conversion (LLC, buck, PFC stages), the DSPIC33FJ128GP306A-E/MR replaces analog control loops with firmware: the 40 MIPS core implements voltage-mode or current-mode compensation with sub-microsecond interrupt latency, and 128KB Flash holds multiple operating profiles. The 3.0V-3.6V core cleanly interfaces with optocoupler and gate-driver logic on the secondary side. Extended -40C to +125C operation suits sealed PSU enclosures, and the QFN exposed pad ties controller ground to the power ground plane with low impedance. Verify ADC trigger-to-PWM-update latency in firmware against your loop bandwidth requirement before committing the layout.
추천
Industrial Sensing and Signal Conditioning
Industrial sensor front-ends benefit from the DSPIC33FJ128GP306A-E/MR's combination of ADC sampling and DSP math: filtering, RMS computation, and FFT-based diagnostics run on-chip at 40 MIPS without a separate DSP. 128KB Flash stores compensation tables and communication stacks for industrial protocols. The extended temperature rating survives panel and machinery enclosures, while the 64-pin QFN exposes enough I/O for multi-channel analog multiplexing and digital I/O banks. Place analog reference routing away from switching I/O on the QFN fanout and use the boundary-scan chain for ICT coverage on dense sensor boards.
추천
Audio and Speech Processing
The General Purpose (GP) dsPIC33F family is widely deployed in audio: the 40 MIPS DSP engine handles FIR/IIR filtering, echo cancellation, AGC, and speech compression, while the DSPIC33FJ128GP306A-E/MR's 128KB Flash holds codecs and effect libraries. On-chip peripheral support for serial audio streams (via SPI/DCI-class peripherals) interfaces with audio codecs at standard sample rates. The 9x9 mm QFN suits compact ceiling, intercom, and handset hardware, and AEC-Q100/extended temperature fits automotive audio nodes. Keep the analog supply domain separated on the QFN fanout to preserve noise floor in microphone and line-level paths.
추천
Embedded Control and IoT Nodes
As a general embedded controller, the DSPIC33FJ128GP306A-E/MR offers 16-bit deterministic execution, 128KB self-programmable Flash for OTA-style updates, and rich timers/UART/SPI/I2C peripherals in one 64-pin QFN - suitable for smart-metering, HVAC, and gateway-adjacent nodes. Seamless migration to PIC24 MCUs in similar packages (per Microchip) protects the software investment as requirements evolve. The -40C to +125C range covers outdoor and rooftop enclosures, and JTAG boundary scan simplifies production test. For radio-equipped nodes, budget the 40 MIPS core for protocol stacking while offloading heavy DSP to dedicated front ends if needed.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33FJ128GP306A-E/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33FJ128GP306A-I/MR | DSPIC33FJ128GP306AT-E/MR | DSPIC33FJ256GP306A-E/MR | DSPIC33FJ64GP306A-E/MR | DSPIC33EV256GM006-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) MR, Exposed Pad | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) PQCC64 - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128KB (128K x 8) | 128KB | 128KB | 256KB | 64KB | 256KB |
| Performance | 40 MIPS / 40 MHz, 16-bit | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 70 MIPS (dsPIC33EV core) |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E, automotive) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Key Differentiator | Extended temp + automotive qualification + 128KB | Lower cost, industrial temp only | Automotive shipping quantity (T) variant | Double program memory | Lowest cost, half memory | Newer core, USB device, 70 MIPS |
주요 차별점
- Extended temperature range at identical cost structure (vs DSPIC33FJ128GP306A-I/MR)
- Program memory upgrade path without PCB change (vs DSPIC33FJ256GP306A-E/MR)
- Automotive qualification level (vs DSPIC33FJ128GP306A-I/MR)
설계 노트
The 9x9 mm 64-VQFN has 0.5 mm pitch and an exposed pad that must be soldered to a dedicated ground array. Use a 3x3 or 4x4 via-in-pad grid (0.3 mm vias) under the pad to stitch to internal ground planes; this is both the primary thermal path and the return-current path for all I/O. Partially filled vias or a solder-paste window pattern prevent pad lift during reflow. Leave keep-out clearance for rework if field service is expected - QFN joints are invisible to visual inspection.
Supply the device from a clean 3.0V-3.6V rail; dsPIC33F is not 5V tolerant, so any 5V signals need level shifting or series resistors per datasheet limits. Decouple every VDD pin pair with 0.1 uF ceramics placed within 2 mm of the pin, plus bulk 4.7-10 uF near the package. During Flash self-programming, core current spikes - do not share the VDDCORE decoupling network with high-slew digital loads. Estimated: a 40 MIPS dsPIC33F draws tens of mA core current; size the regulator accordingly with margin.
Confusing temperature suffixes is the most common ordering error: -E/MR is -40C to +125C while -I/MR is only to +85C - a board designed for the automotive environment will fail early with the -I part. Also confirm configuration (fuse) settings for oscillator startup; dsPIC33F devices can hang on POR if the clock-switch sequence in the datasheet is not followed. Finally, the 'A' suffix die has distinct errata from the original non-A dsPIC33FJ128GP306 - always code against A-revision errata documents.
규정 준수 정보
AEC-Q100 automotive qualification confirmed via DigiKey, GlobalSpec, and Hotenda listings. RoHS/REACH/lead-free status not stated in the provided web data; confirm on Microchip's official product page.
