DSPIC33FJ64GP708-I/PT - 16-bit DSC 40MIPS 64KB Flash | Microchip
부품 번호: DSPIC33FJ64GP708-I/PT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.92 | $8.92 |
| 10 | $8.18 | $81.80 |
| 100 | $7.42 | $742.00 |
| 500 | $6.9 | $3,450.00 |
| 1,000 | $6.35 | $6,350.00 |
DSPIC33FJ64GP708-I/PT 개요
A Digital Signal Controller blends the features of both MCUs and DSPs into a single-chip solution, sitting in the power-management hierarchy between general-purpose microcontrollers (such as the PIC24 family) and dedicated digital signal processors (DSPs). The dsPIC33F family lets engineers add DSP features, such as multiply-accumulate and high-throughput math, to embedded applications without moving to a full DSP architecture. According to Microchip, the dsPIC33F General Purpose DSC family offers seamless migration options to/from PIC24F, PIC24H MCUs and dsPIC30F DSCs in similar packages, protecting software investment across generations.
Key differentiating characteristics include the 40 MIPS core at a nominal 40 MHz execution (the device is clocked from sources up to 32 MHz with internal PLL per distributor specifications), 64KB self-programming Flash for field upgrades, industrial temperature capability (-40C to +85C indicated by the I suffix), and General Purpose (GP) peripheral integration supporting motor control, digital power, and audio signal chains. The GP variant provides a broad mixed-signal peripheral set rather than the motor-control (MC)-specific PWM modules of the companion dsPIC33FJ MC family.
Architecturally, the dsPIC33F core uses a 16-bit modified Harvard pipeline with DSP engine support, C compiler friendly instruction set, and deterministic interrupt latency, which suits real-time closed-loop control. In-Circuit Serial Programming (ICSP) and in-circuit debugging are supported via PGECx/PGEDx pin pairs using tools such as MPLAB SNAP; note that programming requires pairing a PGECx with its matching PGEDx and connecting all VDD/VSS pins.
Typical applications include digital power supplies, industrial automation sensors, audio signal processing, and general-purpose embedded control where DSP math accelerates filtering or transform algorithms.
Design consideration: multiple VDD/VSS and AVDD/AVSS pairs must all be connected and decoupled; omitting any supply pin commonly causes programming or analog-reference failures.
This page synthesizes distributor pricing, drop-in alternatives, datasheet sources, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: DSPIC33FJ64GP708-I/PT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33FJ64GP708-I/PT (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Program Memory (Flash), Package, ADC, Max CPU Speed.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33FJ64GP708A-I/PT
✅ 드롭인✓ 재고 있음
$4.18 / 개
데이터시트 보기 →DSPIC33FJ128GP708-I/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.64 / 개
데이터시트 보기 →DSPIC33FJ256GP708-I/PT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ128GP808-I/PT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ256GP808-I/PT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ64GP708-I/PT 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dsPIC33F DSC |
| Maximum Execution Speed | 40 MIPS |
| Program Memory (Flash) | 64KB (64K x 8) |
| Package Type | 80-TQFP (12 x 12 mm), PT |
| 동작 온도 범위 | -40C to +85C (I suffix, industrial) |
| 실장 유형 | Surface Mount |
| Programming Interface | ICSP via PGECx/PGEDx pairs (MPLAB SNAP compatible) |
| Family Migration | Pin-compatible migration to/from PIC24F, PIC24H, dsPIC30F in similar packages |
| Device Marking / Temp Suffix | -I = Industrial, /PT = TQFP tray/TP |
DSPIC33FJ64GP708-I/PT 80-tqfp (12 x 12 mm), pt 핀 구성 가이드
DSPIC33FJ64GP708-I/PT(80-tqfp (12 x 12 mm), pt 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33FJ64GP708-I/PT.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33FJ64GP708-I/PT 적합 용도: 6 애플리케이션s: Digital Power Supplies, Industrial Automation and Sensing, Audio Signal Processing, Embedded Control and IoT Nodes, Test and Measurement Instruments, Battery-Powered Portable Devices.
Digital Power Supplies
The DSPIC33FJ64GP708-I/PT's 40 MIPS DSP engine provides the deterministic loop-closure bandwidth needed for digitally controlled DC-DC converters and power-factor-correction stages. Running compensation filters and control math in single-cycle multiply-accumulate operations lets the controller execute current- and voltage-loop updates at tens of kilohertz with predictable latency. Placed as the supervisory and control IC between the feedback dividers and the gate-drive stage, the 16-bit core adds DSP-grade filtering without a separate DSP, while the 64KB Flash retains headroom for state machines, soft-start logic, and fault logging. Industrial temperature rating (-40C to +85C) suits power supplies in factory environments.
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Industrial Automation and Sensing
In factory automation nodes, the DSPIC33FJ64GP708-I/PT handles sensor conditioning, protocol bridging, and local decision logic on one chip. The 40 MIPS core executes FIR/IIR filters on ADC samples for vibration or load sensing, while its general-purpose peripherals manage industrial communication tasks on the board. The industrial -40C to +85C temperature rating and 80-pin TQFP with ample I/O make it suitable for IO modules, transmitters, and small PLC auxiliaries. The seamless migration path documented by Microchip to PIC24H and dsPIC30F devices in similar packages protects long-lifetime industrial designs against silicon obsolescence without PCB redesign.
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Audio Signal Processing
The GP (General Purpose) peripheral set of the DSPIC33FJ64GP708-I/PT supports audio paths such as microphone preamp control, equalization, and audio-effect processing in cost-sensitive products. Its DSP engine performs block-based math (IIR biquads, gain staging, peak detection) at 40 MIPS, sufficient for single- and low-channel-count audio enhancement, while the 64KB Flash stores coefficient tables and USB-free boot logic. In a typical chain the device reads converter data, applies filtering, and writes back to a codec interface configured through its serial peripherals. For higher-fidelity multi-channel audio, Microchip's family scaling lets designers migrate code to higher-memory GP parts in similar packages.
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Embedded Control and IoT Nodes
As a general-purpose embedded controller, the DSPIC33FJ64GP708-I/PT drives user interfaces, actuators, and communication peripherals in smart devices and industrial IoT endpoints. The 40 MIPS 16-bit core outperforms typical 8-bit MCUs by an order of magnitude in control-loop and math workloads, making it a strong upgrade path from PIC18 designs. The 80-pin TQFP offers generous GPIO for keypads, displays, and multiple sensor buses, while ICSP programming via PGECx/PGEDx pairs supports field update fixtures on production lines. Designs benefit from Microchip's free MPLAB X IDE and XC16 compiler, keeping toolchain cost at zero for volume products.
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Test and Measurement Instruments
Bench and portable instruments - handheld meters, data loggers, and sensor calibrators - use the DSPIC33FJ64GP708-I/PT as the main signal-processing controller. The 40 MIPS throughput sustains oversampling and averaging algorithms on ADC streams to improve effective measurement resolution, and deterministic interrupt behavior keeps sample timing accurate. Its 3.3V supply aligns with typical analog front-end rails, and the 64KB self-programming Flash supports firmware updates and calibration constants stored on-chip. The industrial temperature range and TQFP-80's 0.5mm pitch suit both handheld enclosures and automated test fixtures requiring reliable reflow assembly.
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Battery-Powered Portable Devices
Portable instruments and handheld controllers exploit the dsPIC33F family's power-management features - idle, sleep, and doze modes - to stretch battery life while retaining 40 MIPS burst performance for signal processing tasks. The 3.0V to 3.6V operating supply matches single-cell lithium and 3-cell alkaline architectures through a simple LDO or buck regulator. The DSP engine handles short, high-throughput bursts (sensor fusion, filtering) followed by low-current sleep, a duty profile where the DSC's combination of high peak MIPS and low standby current outperforms always-on lower-speed MCUs. Designers should budget wake-up latency from sleep into real-time scheduling.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33FJ64GP708-I/PT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33FJ64GP708A-I/PT | DSPIC33FJ128GP708-I/PT | DSPIC33FJ256GP708-I/PT | DSPIC33FJ128GP808-I/PT | DSPIC33FJ256GP808-I/PT |
|---|---|---|---|---|---|---|
| Package | 80-TQFP (12x12 mm) | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64KB (64K x 8) | 64KB (64K x 8) | 128KB | 256KB | 128KB | 256KB |
| Max Execution Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Core / Architecture | 16-bit dsPIC33F DSC | 16-bit dsPIC33F DSC | 16-bit dsPIC33F DSC | 16-bit dsPIC33F DSC | 16-bit dsPIC33F DSC | 16-bit dsPIC33F DSC |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
주요 차별점
- Lowest-cost entry in the 708 GP Flash ladder (vs DSPIC33FJ128GP708-I/PT)
- Revision A silicon available as pin-identical upgrade (vs DSPIC33FJ64GP708A-I/PT)
- Same footprint with 256KB Flash ceiling (vs DSPIC33FJ256GP708-I/PT)
설계 노트
Connect and individually decouple every power pin. The dsPIC33FJ64GP708 provides multiple VDD/VSS pairs plus separate AVDD/AVSS for the analog domain - Microchip's programming documentation explicitly warns that programming may fail if any supply pin is not connected. Use one 100nF ceramic capacitor per supply pin placed within 2-3 mm of the pin, plus one bulk 4.7-10uF capacitor per supply domain. Tie AVDD to VDD through a ferrite bead if ADC accuracy is critical, and keep analog routing away from fast digital switching traces on the 12x12 mm TQFP breakout.
ICSP programming requires matched PGECx/PGEDx pairs: if PGEC2 is used for ICSPCLK, ICSPDAT must connect to PGED2 - mixing pairs from different groups causes programming failure. Additionally, the SDO1 pin toggles at high frequency during programming, so ensure anything connected to SDO1 tolerates this activity. Reserve an unpopulated 5-6 pin programming header (MCLR, VDD, GND, PGECx, PGEDx) on every production board for field firmware updates, and add a series resistor on MCLR (approximately 100 ohm to 10k pull-up) per Microchip ICSP guidelines.
The device runs from a nominal 3.3V rail; generate it with a low-noise LDO or a buck converter with adequate post-filtering so that ADC reference noise stays low. Budget core current based on the 40 MIPS operating point and add margin for Flash write current during self-programming operations, which occurs when storing calibration data. Estimated: for typical dsPIC33F operation at 40 MIPS, plan 60-100 mA supply headroom plus peripheral current; verify against the 'DC Characteristics' table in the manufacturer datasheet before finalizing the regulator sizing.
규정 준수 정보
RoHS/REACH/lead-free status for this MPN was not captured in the provided web data; verify on the Microchip product page or via Microchip's Material Declaration report before regulatory-critical production.