EP1AGX50DF780C6N - 50K LE Arria GX FPGA with 3.125Gbps Transceivers | Intel
부품 번호: EP1AGX50DF780C6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $546.26 | $546.26 |
| 10 | $491.63 | $4,916.30 |
| 100 | $437.01 | $43,701.00 |
| 500 | $382.38 | $191,190.00 |
| 1,000 | $327.76 | $327,760.00 |
EP1AGX50DF780C6N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and hardened I/O peripherals, allowing hardware designers to implement arbitrary digital logic that is re-programmable in the field. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside CPLDs and are widely used for digital signal processing, protocol bridging, parallel processing, and ASIC prototyping. The Arria GX family specifically targets mid-density designs with integrated multi-gigabit transceivers (MGTs), occupying the middle ground between Intel's low-cost Cyclone and high-end Stratix lines.
Key features of the EP1AGX50DF780C6N include 4 transceivers operating up to 3.125 Gbps (supporting PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and XAUI), 2,475,072 bits of embedded RAM (roughly 303 Kbytes), and a -6 speed grade with commercial 0°C to 85°C operating temperature. The device also offers dedicated DSP blocks for high-performance fixed- and floating-point math, on-chip PLLs, and JTAG-based configuration via the IEEE 1149.1 boundary-scan and IEEE 1532 in-system programmability standards.
Architecturally, the Arria GX family uses a 90 nm process with a 1.2 V core supply and 3.3 V/2.5 V tolerant I/O banks. Embedded transceiver macro hard IP delivers signal-integrity features such as adaptive equalization, pre-emphasis, and 8b/10b encoding, eliminating external PHY devices on most serial links. The combination of hard transceivers, embedded memory, and rich DSP makes this part a single-chip solution for mid-range communication and image-processing cards.
Typical applications include PCIe endpoint cards, gigabit Ethernet bridges, Serial RapidIO fabrics in wireless baseband boards, broadcast video conversion (SDI/HD-SDI), and protocol-conversion mezzanine cards. The 780-BGA package provides ample user I/O and supply pins for high-speed serial channel routing and parallel memory interfaces such as DDR2/QDRII.
When designing with this device, ensure the board provides clean 1.2 V core and 3.3 V auxiliary rails with sufficient bulk capacitance near the BGA, follow Intel's transceiver PCB layout guidelines for 100-ohm differential routing, and use the Quartus II design software (version supporting Arria GX) for compilation and configuration file generation. The device is now NRND/EOL — verify long-term availability with Intel before committing to new production designs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP1AGX50DF780C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1AGX50DF780C6N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, RoHS Status, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1AGX60DF780C6N
✅ 드롭인✓ 재고 있음
$142 / 개
데이터시트 보기 →EP1AGX35DF780C6N
✅ 드롭인✓ 재고 있음
$199.5 / 개
데이터시트 보기 →EP1AGX50DF780C6
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →EP1AGX50DF780C6N 최대 정격 & 전기적 특성
| Family | Arria GX |
| Logic Elements | 50,160 |
| Number of LABs/CLBs | 2,508 |
| Total RAM Bits | 2,475,072 (303 Kbytes) |
| User I/O Count | 350 |
| Number of Transceivers | 4 (up to 3.125 Gbps) |
| Core Voltage | 1.2 V |
| Speed Grade | -6 |
| 동작 온도 | 0°C to 85°C (Commercial) |
| Package Type | 780-pin FC-FBGA (DF780) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (lead-free per verified data) |
| Configuration Interface | JTAG (IEEE 1149.1), IEEE 1532 in-system programmability |
| DSP Blocks | Yes (dedicated hardware multipliers) |
| On-chip PLLs | Yes |
EP1AGX50DF780C6N 780-pin fc-fbga (df780) 핀 구성 가이드
EP1AGX50DF780C6N(780-pin fc-fbga (df780) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1AGX50DF780C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1AGX50DF780C6N 적합 용도: 6 애플리케이션s: PCI Express Endpoint Cards, Gigabit Ethernet Bridge and Switch Fabric, Serial RapidIO Baseband Cards, Broadcast Video SDI/HD-SDI Converters, ASIC Prototyping Platforms, Industrial Motor Control and Servo Drives.
PCI Express Endpoint Cards
The EP1AGX50DF780C6N fits PCIe Gen1 x4 endpoint designs because its 4 integrated 3.125 Gbps transceivers map directly to the PCIe PHY Interface (PIPE) without external SERDES. Its 50,160 logic elements comfortably host a PCIe Hard IP block, DMA engine, and application logic for host-bus adapters and instrumentation cards. The 1.2 V core keeps power within PCIe CEM slot budgets.
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Gigabit Ethernet Bridge and Switch Fabric
Arria GX transceivers support 1.25 Gbps Gigabit Ethernet (1000BASE-X) and XAUI (4×3.125 Gbps) interfaces, making the EP1AGX50DF780C6N ideal for protocol-conversion bridges between Ethernet and proprietary backplanes. The 350 user I/Os of the 780-BGA package provide ample GMII/RGMII or SGMII pins for multi-port switches, while 2,475 Kbit embedded RAM buffers packet data. Quartus II IP cores include MAC and PCS functions.
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Serial RapidIO Baseband Cards
Wireless baseband and DSP accelerator cards benefit from Serial RapidIO (sRIO) at 1.25/2.5/3.125 Gbps per lane, a protocol natively supported by the Arria GX hard transceivers. The EP1AGX50DF780C6N's 50K LE and dedicated DSP blocks implement turbo decoders, FFT engines, and matrix multipliers for LTE/HSPA+ baseband processing. Four transceivers enable x4 sRIO links for low-latency DSP-to-DSP connectivity.
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Broadcast Video SDI/HD-SDI Converters
The Arria GX transceiver meets SMPTE 259M (SD-SDI at 270 Mbps) and SMPTE 292M (HD-SDI at 1.485 Gbps) bit-rate requirements, enabling the EP1AGX50DF780C6N to serve as a low-cost broadcast video converter between SDI and HDMI/DVI. Embedded RAM acts as a frame buffer for up/down/cross-conversion, while 350 user I/Os handle parallel video buses and audio embedding. The commercial temperature grade suits indoor studio racks.
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ASIC Prototyping Platforms
Engineers prototyping ASIC designs in the 200K-500K gate range find the EP1AGX50DF780C6N a cost-effective platform: 50,160 logic elements plus dedicated DSP blocks map cleanly to common ASIC RTL. The 780-BGA provides abundant user I/O for DUT-to-platform interconnects and test header pins. Quartus II supports ASIC prototyping flow with multi-FPGA partitioning and chip-select logic.
추천
Industrial Motor Control and Servo Drives
Although the EP1AGX50DF780C6N is commercial-grade (0°C to 85°C), it remains viable for industrial motor controllers when housed in temperature-controlled enclosures. Its DSP blocks accelerate Park/Clark transforms and SVPWM generation for 3-phase motor drives. The 4 transceivers support EnDat 2.2, BiSS, or HIPERFACE DSL absolute encoder feedback over RS-485/SerDes, while 350 I/Os drive power-stage gate drivers.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1AGX50DF780C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1AGX60DF780C6N | EP1AGX35DF780C6N | EP1AGX50DF780C6 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-pin FC-FBGA (DF780) | 780-pin FC-FBGA (DF780) - same | 780-pin FC-FBGA (DF780) - same | 780-pin FC-FBGA (DF780) - same |
| Logic Elements | 50,160 | 60,000 | 35,000 | 50,160 |
| Number of LABs | 2,508 | 2,992 | 1,750 | 2,508 |
| User I/O Count | 350 | 350 | 350 | 350 |
| Number of Transceivers | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) |
| Embedded RAM (bits) | 2,475,072 | 2,475,072 | 1,728,000 | 2,475,072 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -6 | -6 | -6 | -6 |
| Lifecycle Status | NRND | NRND | NRND | NRND |
주요 차별점
- Highest density in the Arria GX DF780 family (vs EP1AGX35DF780C6N)
- Drop-in compatible with EP1AGX60DF780C6N for upgrade path (vs EP1AGX60DF780C6N)
- 4 integrated 3.125 Gbps transceivers eliminate external SERDES (vs Cyclone III EP3C40/80 (no transceivers))
설계 노트
The 780-pin FC-FBGA package uses 1.0 mm ball pitch on a 29×29 mm body. Implement a 6-layer stack-up with dedicated ground and power planes beneath the device; place 0402-size 0.1 µF decoupling capacitors on every power pin pair within 200 mils of the BGA ball. Use microvia or via-in-pad technology if possible to reduce inductance for the 1.2 V core rail, which may draw 2-4 A under full logic utilization.
Differential transceiver channels require 100-ohm ±10% differential impedance with matched trace lengths (5 mil tolerance within a pair). Reference Intel Application Note AN508 for Arria GX PCB layout — it specifies 8-15 mil trace width and 4-8 mil spacing for the 3.125 Gbps channels. Use AC-coupling capacitors (0.01 µF) at each transmit pin and ensure receiver common-mode voltage meets 0.4-1.4 V swing range.
The Arria GX family requires at least three supply rails: VCCINT (1.2 V core), VCCIO (3.3 V / 2.5 V / 1.8 V for I/O banks), and VCCA (2.5 V PLL analog). Bulk capacitance of 220 µF low-ESR polymer or tantalum per rail plus high-frequency ceramic decoupling prevents voltage droop during sudden logic switching. Enable the in-rush current limiter IC to avoid triggering distribution breakers at configuration time.
Never design a new board around the Arria GX family — it is NRND and not recommended for new designs; use Arria II GX (EP2AGX50) for new projects. Configuration mode pins MSEL[3:0] must be set correctly: 0000 = AS, 0010 = PS, 0100 = JTAG-only. Failing to configure MSEL causes 'configuration failure' with no further debug output. Use a JTAG header on every board for recovery.
규정 준수 정보
RoHS compliance verified from the Heisener/Electronicount listings which describe the part as 'COMPLIANT IC, GX FPGA EP1AGX50D, FBGA 780 PINS'. AEC-Q100 is not applicable (FPGA does not target automotive-grade qualification directly). REACH, halogen-free, and conflict-mineral statements are not present in the verified web data.
