EP1AGX50DF780I6 - Arria GX FPGA 50K LE 780-FBGA | Altera | Intel
부품 번호: EP1AGX50DF780I6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $325 | $162,500.00 |
| 1,000 | $295 | $295,000.00 |
EP1AGX50DF780I6 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing. It sits within the programmable logic device (PLD) hierarchy, alongside CPLDs, and bridges the flexibility gap between fixed ASICs and software-defined processors. The Arria GX family specifically targets applications that need multi-gigabit transceivers without the cost of full Stratix-class silicon, positioning it between Cyclone (low-cost) and Stratix (high-performance) in the Altera product taxonomy.
Key features of the EP1AGX50DF780I6 include 2,508 logic array blocks (LABs), embedded multiplier blocks for DSP, 4 transceivers supporting CPRI, PCI Express, Serial RapidIO, and Gigabit Ethernet protocols, dedicated PLL clock management with up to 8 PLLs per device, and 432 Kbits of distributed RAM plus 4.5 Mbits of block RAM (M4K) with 32-bit ECC support. The device family is supported by the Altera Quartus II design software (legacy) and integrates seamlessly with Nios II embedded processor cores.
Architecturally, the Arria GX FPGA combines a logic fabric of adaptive logic modules (ALMs) with embedded transceivers (up to 4 channels at 3.125 Gbps), dedicated DSP blocks, and configurable I/O standards including LVDS, LVTTL, SSTL, and HSTL. The 90 nm process delivers a balance of low static power (~1.5 W typical) and high performance (up to 260 MHz on internal logic), while the 780-FBGA package provides adequate thermal mass for fanless industrial designs when paired with proper PCB thermal vias.
Typical applications include wireless baseband processing, PCI Express endpoint cards, Serial RapidIO bridging, industrial video processing, and protocol bridging in telecom backhaul equipment. The transceiver channels make it particularly well-suited for serial connectivity backplanes. When designing with the EP1AGX50DF780I6, ensure the PCB supports 100-ohm differential routing for transceiver channels and that decoupling follows the Altera Power Distribution Network (PDN) design guidelines for the Arria GX family.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate sourcing and second-source options for legacy Arria GX designs.
드롭인 대체품: EP1AGX50DF780I6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1AGX50DF780I6 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Operating Temperature, RoHS Status, Process Technology, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1AGX50DF780I6N
✅ 드롭인✓ 재고 있음
$255 / 개
데이터시트 보기 →EP1AGX50DF780C6
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →EP1AGX35DF780I6
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP1AGX35DF780I6N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1AGX50DF780C7
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1AGX50DF780C6N
✅ 드롭인✓ 재고 있음
$327.76 / 개
데이터시트 보기 →EP1AGX50DF780I6 최대 정격 & 전기적 특성
| Series | Arria GX |
| Family | Arria GX |
| Manufacturer | Altera (Intel) |
| Number of Logic Elements (LE) | 50,160 |
| Number of LABs/CLBs | 2,508 |
| Total RAM Bits | 2,475,072 |
| Number of I/O | 350 |
| Number of Transceivers | 4 (up to 3.125 Gbps) |
| Core Voltage | 1.15 V to 1.25 V |
| Process Technology | 90 nm |
| 패키지 / 케이스 | 780-BBGA, FCBGA (29x29 mm) |
| Supplier Device Package | 780-FBGA |
| 동작 온도 | -40C to +100C (TJ) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Unknown - verify with manufacturer |
EP1AGX50DF780I6 780-fbga 핀 구성 가이드
EP1AGX50DF780I6(780-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1AGX50DF780I6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1AGX50DF780I6 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, PCI Express Endpoint Card, Serial RapidIO Bridge, Industrial Video Processing, Telecom Backplane Aggregation, Military/Aerospace Protocol Converter.
Wireless Baseband Processing
The EP1AGX50DF780I6 fits wireless baseband processing because its 50,160 logic elements and embedded DSP blocks deliver the parallel arithmetic throughput required for PHY-layer baseband algorithms, while the 4 transceiver channels at 3.125 Gbps natively interface CPRI links to remote radio heads. The 780-FBGA package provides the I/O density needed for CPRI data, antenna data, and backhaul aggregation. With 2,475,072 bits of embedded RAM, the device buffers pre/post-FFT samples on-chip, reducing external memory accesses. Designers typically instantiate Nios II embedded processors alongside custom DSP datapaths. Power consumption is in the 1.5 W to 4 W range at full utilization, manageable with the FC-FBGA thermal envelope.
추천
PCI Express Endpoint Card
The EP1AGX50DF780I6 is well suited for PCI Express endpoint cards because the integrated transceivers support PCIe Gen1 x1 hard IP without external PHY chips, reducing BOM cost and board area. The 50,160 LE fabric accommodates protocol stack logic, DMA engines, and application accelerators simultaneously. Designers implement the PIPE interface to external clocking and use the 780-FBGA's 350 I/Os for endpoint-side local bus, DDR2 memory interface, and GPIO. The I6 industrial speed grade guarantees timing closure for 250 MHz internal operation. Quartus II provides the PCIe Compiler wizard to generate TLP/DLLP handling, MSI/MSI-X interrupt logic, and verification testbench in minutes.
추천
Serial RapidIO Bridge
The EP1AGX50DF780I6 supports Serial RapidIO (SRIO) bridging applications through its 3.125 Gbps transceivers, which are hard-IP compatible with the SRIO physical layer. The device can bridge between SRIO endpoints and local fabric (e.g., DSP chains, ASICs, or processors) using its 50,160 logic elements and 432 Kbits of distributed RAM for protocol packet buffers. Block RAM (M4K) supports 32-bit ECC for SRIO payload integrity. Typical designs use the device in DSP farm aggregation cards for wireless infrastructure or military radar signal processing, where deterministic low-latency fabric interconnect is critical.
추천
Industrial Video Processing
The EP1AGX50DF780I6 supports industrial video processing tasks such as multi-channel HD-SDI aggregation, video format conversion, and real-time image preprocessing. The 50,160 logic elements implement line buffers, scaling engines, and color space converters, while 4 transceiver channels accept HD/3G-SDI input at up to 2.97 Gbps. The 350 user I/Os in the 780-FBGA package accommodate parallel video buses (BT.1120, BT.656), DDR2/DDR3 frame buffers, and control interfaces. Industrial temperature grade (-40C to +100C TJ) allows deployment in factory-floor vision systems without additional thermal management.
추천
Telecom Backplane Aggregation
In telecom backplane aggregation systems, the EP1AGX50DF780I6 acts as a serial-interface concentrator, aggregating multiple low-rate TDM or Ethernet links into a higher-speed uplink using its 4 transceiver channels. The 90 nm process and 1.15-1.25 V core supply deliver static power in the 1.5 W range, suitable for fanless line cards. The 780-FBGA package's 350 user I/Os expose local bus interfaces to backplane ASICs, timing clocks from Stratum-3 sources, and redundancy control. Designers use the embedded PLLs (up to 8 per device) for jitter-cleaning clock distribution across aggregated links.
추천
Military/Aerospace Protocol Converter
The EP1AGX50DF780I6 fits military and aerospace protocol converter applications where multiple serial standards (MIL-STD-1553, ARINC 429, Fibre Channel, custom serial) must be bridged. The 4 transceivers at 3.125 Gbps accommodate Fibre Channel 1 Gbps links, while the logic fabric implements 1553/ARINC controllers with the soft IP libraries available in Quartus II. The industrial temperature range (-40C to +100C TJ) covers most MIL-STD-810 environmental requirements. The 780-FBGA package's 1.0 mm ball pitch requires standard PCB manufacturing (not HDI), simplifying MIL-spec board fabrication.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1AGX50DF780I6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1AGX50DF780I6N | EP1AGX50DF780C6 | EP1AGX35DF780I6 | EP1AGX35DF780I6N | EP1AGX50DF780C7 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 50,160 | 50,160 | 50,160 | 33,880 | 33,880 | 50,160 |
| Embedded RAM (bits) | 2,475,072 | 2,475,072 | 2,475,072 | 1,346,112 | 1,346,112 | 2,475,072 |
| Transceivers | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps |
| User I/O | 350 | 350 | 350 | 350 | 350 | 350 |
| Temperature Grade | Industrial (-40C to +100C TJ) | Industrial (-40C to +100C TJ) | Commercial (0C to 85C TJ) | Industrial (-40C to +100C TJ) | Industrial (-40C to +100C TJ) | Commercial (0C to 85C TJ) |
| Speed Grade | I6 (mid-tier) | I6 (mid-tier) | C6 (mid-tier) | I6 (mid-tier) | I6 (mid-tier) | C7 (faster) |
주요 차별점
- Highest logic density in the 780-FBGA Arria GX package (vs EP1AGX35DF780I6)
- Industrial temperature grade with same die as commercial variant (vs EP1AGX50DF780C6)
- Lead-free finish option available for RoHS compliance (vs EP1AGX50DF780I6 (non-N))
설계 노트
The 780-FBGA uses a 1.0 mm ball pitch and requires 4-6 layer PCB stackup with controlled-impedance differential routing for the transceiver channels. Per the Altera Arria GX board design guidelines, place the MGT (Multi-Gigabit Transceiver) decoupling capacitors within 50 mils of the MGT power pins, and use a continuous ground plane beneath the BGA with thermal vias (10-12 per BGA quadrant) to reduce junction-to-ambient thermal resistance. Estimate: for a 3 W dissipation design, junction-to-ambient thermal resistance must be below 20 C/W to stay within industrial temperature limits at 70 C ambient.
The Arria GX core requires a 1.15 V to 1.25 V supply with tight regulation (3% tolerance) and peak current up to 4-6 A depending on logic utilization. Per the Arria GX datasheet, use a dedicated switching regulator (e.g., Altera Enpirion EN5339QI for 3 A continuous) with 100 uF of bulk ceramic decoupling on the VCCINT plane. Estimated: at 50% logic utilization and 200 MHz internal clock, expect approximately 2.5 A core current; enable Smart Voltage ID (SVID) if supported on the host regulator. Separate the VCCPD (3.3 V) rail from VCCIO rails with a ferrite bead to prevent I/O noise injection into the PLL analog supply.
Transceiver channel routing requires 100-ohm differential impedance with intra-pair length matching to within 5 mils and pair-to-pair matching to within 20 mils per the Altera Arria GX PCB Design Guidelines. Use a high-speed PCB material such as FR4-5 (loss tangent 0.018) for channels up to 8 inches, or move to Megtron 6 for longer reach. The reference clock input requires 50-ohm termination at the FPGA pin with no stub taps - clock jitter must be below 100 fs RMS for 3.125 Gbps link compliance. Estimate: an 8-inch Megtron 6 differential pair at 3.125 Gbps exhibits approximately 1.5 dB insertion loss, well within the Arria GX receiver equalization budget.
규정 준수 정보
RoHS/lead-free compliance not explicitly stated in verified web data. The N-suffixed variant (EP1AGX50DF780I6N) is the RoHS/lead-free option per Altera part-number convention. AEC-Q100 is not applicable for FPGAs (this is a commercial/industrial programmable logic device, not an automotive-grade qualified IC).