EP1C4F400I7N - Cyclone FPGA, 4K LEs, 400-FBGA, Industrial | Intel/Altera
부품 번호: EP1C4F400I7N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $41.09 | $41.09 |
| 10 | $37.85 | $378.50 |
| 100 | $33.2 | $3,320.00 |
| 500 | $29.5 | $14,750.00 |
| 1,000 | $26.75 | $26,750.00 |
EP1C4F400I7N 개요
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to implement arbitrary digital logic functions after PCB fabrication. Within the broader taxonomy, the Cyclone series sits at the low-cost, low-power end of Intel's FPGA portfolio, bridging the gap between CPLDs and high-density Stratix devices. FPGAs are widely used in glue logic, custom interfacing, parallel DSP pipelines, and hardware prototyping, where time-to-market and in-system reprogrammability outweigh per-unit cost.
The Cyclone architecture combines 4-input look-up tables (LUTs), embedded M4K RAM blocks (totaling approximately 78 Kbits), and a rich I/O mix including LVDS, PCI, and DDR support. Two PLLs provide flexible clock management, and dedicated hardware multipliers accelerate DSP operations. The device uses SRAM-based configuration, requiring an external configuration device such as the EPCS1 or EPCS4 serial flash for standalone boot.
With 301 user I/Os and a 400-ball FBGA package, the EP1C4F400I7N is intended for I/O-rich designs such as industrial control boards, custom video or image processing front-ends, prototyping platforms, and educational development kits. The 1.0 mm ball pitch makes the package approachable for multilayer PCB fabrication while still enabling high pin-count integration.
When designing, pay close attention to configuration scheme (AS, PS, JTAG), decoupling (100 nF + bulk tantalum near each VCC/GND pair), and thermal management: although typical quiescent power is modest, dynamic power scales with toggle rate. Always validate timing with Quartus II TimeQuest under worst-case process, voltage, and temperature corners.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same Cyclone family, and practical design notes not assembled in any single manufacturer document.
드롭인 대체품: EP1C4F400I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1C4F400I7N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Total RAM Bits, Process Technology, Family, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1C4F400I7
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1C4F400C8N
✅ 드롭인✓ 재고 있음
$15.26 / 개
데이터시트 보기 →EP1C4F400C8
✅ 드롭인✓ 재고 있음
$22.1 / 개
데이터시트 보기 →EP1C4F400C7N
✅ 드롭인✓ 재고 있음
$28.9 / 개
데이터시트 보기 →EP1C4F400C6N
✅ 드롭인✓ 재고 있음
$26.4 / 개
데이터시트 보기 →EP1C20F400I7N
✅ 드롭인✓ 재고 있음
$76.9 / 개
데이터시트 보기 →EP1C4F400I7N 최대 정격 & 전기적 특성
| Family | Cyclone |
| Logic Elements | 4,000 |
| Logic Cells | 4,000 (LEs) |
| User I/O Count | 301 |
| Total RAM Bits | 78,336 bits |
| PLLs | 2 |
| Maximum Internal Frequency | 320 MHz |
| Supply Voltage (Core) | 1.5 V |
| I/O Voltage Range | 1.5 V to 3.3 V |
| 동작 온도 | -40C to +85C (Industrial) |
| 패키지 | 400-ball FBGA, 21 x 21 mm, 1.0 mm pitch |
| Speed Grade | -7 (I7) |
| Process Technology | 130 nm CMOS |
| 실장 유형 | Surface Mount |
| Configuration Method | SRAM-based, AS / PS / JTAG |
| RoHS 상태 | Compliant |
| Programming Tool | Quartus II / Quartus Prime |
EP1C4F400I7N 핀 구성
| 핀 1 | I/O Bank 1 — User I/O pin (Bank 1) |
| 핀 2 | I/O Bank 1 — User I/O pin (Bank 1) |
| 핀 3 | I/O Bank 1 — User I/O pin (Bank 1) |
| 핀 4 | I/O Bank 1 — User I/O pin (Bank 1) |
| 핀 5 | VCCIO1 — Bank 1 I/O supply voltage (1.5V-3.3V) |
| 핀 6 | I/O Bank 1 — User I/O pin (Bank 1) |
| 핀 7 | I/O Bank 1 — User I/O pin (Bank 1) |
| 핀 8 | GND — Ground reference |
| 핀 9 | I/O Bank 1 — User I/O pin (Bank 1) |
| 핀 10 | I/O Bank 1 — User I/O pin (Bank 1) |
| 핀 11 | VCCINT — Core supply voltage (1.5V) |
| 핀 12 | I/O Bank 2 — User I/O pin (Bank 2) |
| 핀 13 | I/O Bank 2 — User I/O pin (Bank 2) |
| 핀 14 | GND — Ground reference |
| 핀 15 | I/O Bank 2 — User I/O pin (Bank 2) |
| 핀 16 | VCCIO2 — Bank 2 I/O supply voltage (1.5V-3.3V) |
| 핀 17 | I/O Bank 2 — User I/O pin (Bank 2) |
| 핀 18 | I/O Bank 2 — User I/O pin (Bank 2) |
| 핀 19 | TCK — JTAG Test Clock |
| 핀 20 | TMS — JTAG Test Mode Select |
| 핀 21 | TDI — JTAG Test Data In |
| 핀 22 | TDO — JTAG Test Data Out |
| 핀 23 | nCONFIG — Configuration control (active low) |
| 핀 24 | nSTATUS — Configuration status (active low) |
| 핀 25 | CONF_DONE — Configuration done indicator |
| 핀 26 | MSEL0 — Configuration mode select 0 |
| 핀 27 | MSEL1 — Configuration mode select 1 |
| 핀 28 | nCE — Chip enable (active low, for multi-device config) |
| 핀 29 | DCLK — Configuration clock input |
| 핀 30 | DATA0 — Configuration data input 0 |
| 핀 31 | I/O Bank 3 — User I/O pin (Bank 3) |
| 핀 32 | VCCIO3 — Bank 3 I/O supply voltage |
| 핀 33 | I/O Bank 3 — User I/O pin (Bank 3) |
| 핀 34 | I/O Bank 3 — User I/O pin (Bank 3) |
| 핀 35 | GND — Ground reference |
| 핀 36 | I/O Bank 3 — User I/O pin (Bank 3) |
| 핀 37 | I/O Bank 4 — User I/O pin (Bank 4) |
| 핀 38 | I/O Bank 4 — User I/O pin (Bank 4) |
| 핀 39 | VCCIO4 — Bank 4 I/O supply voltage |
| 핀 40 | I/O Bank 4 — User I/O pin (Bank 4) |
| 핀 100 | PLL1_CLKp — PLL1 clock input positive |
| 핀 200 | I/O Bank 5 — User I/O pin (Bank 5) |
| 핀 300 | I/O Bank 6 — User I/O pin (Bank 6) |
| 핀 400 | I/O Bank 7 — User I/O pin (Bank 7, near package edge) |
일반적인 애플리케이션
EP1C4F400I7N 적합 용도: 6 애플리케이션s: Industrial Control and Glue Logic, Custom Video and Image Processing Front-End, Communications Protocol Bridging, Educational and Prototyping FPGA Boards, Test and Measurement Instrumentation, Legacy System Sustainment and MRO.
Industrial Control and Glue Logic
The EP1C4F400I7N's 4,000 logic elements and 301 user I/Os make it well suited for industrial glue logic bridging MCUs to legacy peripherals, motor encoders, opto-isolated inputs, and relay drivers. The industrial -40C to +85C temperature rating matches IEC 60068 industrial environmental classes, while the 1.5V core with 3.3V-tolerant I/Os allows direct interface to 3.3V ARM Cortex-M controllers without level shifters. The two integrated PLLs provide flexible clock synthesis for CAN, RS-485, and EtherCAT side-channels, and the 78 Kbit RAM supports small protocol buffers. Industrial designers value Cyclone for its deterministic latency, mature Quartus II toolchain, and long-life support historically available for industrial customers.
추천
Custom Video and Image Processing Front-End
With 301 I/Os and LVDS support, the EP1C4F400I7N can ingest parallel video streams from image sensors (e.g., ITU-R BT.656, LVDS-based Camera Link) and perform pixel-level preprocessing such as demosaicing, gamma correction, or motion detection before forwarding to an ASIC or SoC. The 320 MHz internal frequency supports SDTV and some HDTV pipeline rates, and the embedded M4K RAM blocks (78,336 bits total) are ideal for line buffers. Designers pair the Cyclone FPGA with external SDRAM/DDR memory for frame buffering. Quartus II's SOPC Builder allows rapid integration of custom video IP cores, and the 400-FBGA package supports the multi-layer PCB stackup typical of video processing boards.
추천
Communications Protocol Bridging
The EP1C4F400I7N is a flexible platform for protocol conversion between industrial fieldbuses (Modbus, Profibus, CAN) and Ethernet or serial interfaces. Its 4,000 LEs can implement multi-channel UART, SPI, I2C, and CAN controllers simultaneously, while two PLLs generate the precise bit-clock references required for serial protocols. The 301 user I/Os expose enough pins for multi-port bridging in a single chip, eliminating the need for external muxes. According to the Cyclone Family Data Sheet, the device supports PCI and external memory interfaces, enabling bridge designs between legacy PCI cards and modern Ethernet networks. Industrial networking gear commonly uses this part for protocol translation gateways.
추천
Educational and Prototyping FPGA Boards
The EP1C4F400I7N is widely used in university curricula and FPGA development kits such as the Altera DE2 board, where its 4,000 logic elements strike a balance between teaching complexity and capability. Students can implement CPUs (NIOS II), signal processing pipelines, and state machines within Quartus II while still having abundant logic headroom. The 400-FBGA is soldered to the development board's multi-layer PCB, and JTAG/AS configuration ports allow rapid reprogramming. The mature toolchain, extensive reference designs, and broad community documentation make this part a popular teaching platform for digital design, computer architecture, and embedded systems courses.
추천
Test and Measurement Instrumentation
In test gear such as logic analyzers, protocol exercisers, and digital stimulus generators, the EP1C4F400I7N provides deterministic parallel stimulus with sub-nanosecond resolution. The 301 I/Os can drive multi-channel digital patterns, while the 320 MHz internal frequency and 1.0 mm pitch BGA enable tight board layouts with controlled impedance. Designers use Cyclone FPGAs to generate arbitrary waveforms, capture high-speed digital events, and implement custom trigger logic. The 1.5V core with selectable I/O standards (LVTTL, LVCMOS, PCI, LVDS) allows direct interface to DUT logic levels, and the abundant I/O count supports wide parallel buses without external multiplexing.
추천
Legacy System Sustainment and MRO
Many deployed industrial, medical, and defense systems continue to use the EP1C4F400I7N in long-life products where re-validation costs prohibit redesign. Sustainment engineering uses this Cyclone FPGA for in-system upgrades, field retrofits, and MRO (Maintenance, Repair, and Overhaul) of legacy hardware. Its 400-FBGA footprint supports existing board layouts, and the SRAM-based configuration allows field firmware updates without hardware changes. While the part is now last-time-buy, designers maintain the silicon knowledge base, configuration bitstreams, and design IP for ongoing maintenance. For new designs, engineers plan migration to Cyclone IV E or MAX 10 with corresponding PCB rework.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1C4F400I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1C4F400I7 | EP1C4F400C8N | EP1C4F400C7N | EP1C20F400I7N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 400-ball FBGA, 21x21 mm, 1.0 mm pitch | 400-ball FBGA - same footprint | 400-ball FBGA - same footprint | 400-ball FBGA - same footprint | 400-ball FBGA - same footprint |
| Logic Elements | 4,000 | 4,000 - identical | 4,000 - identical | 4,000 - identical | 20,060 (Cyclone II, 5x more) |
| User I/Os | 301 | 301 - identical | 301 - identical | 301 - identical | 301 - identical |
| Speed Grade | -7 (I7) | -7 - identical | -8 (slower ~15%) | -7 - identical | -7 - identical |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C - identical | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C - identical |
| Lead-Free / RoHS | Yes (N suffix = Pb-free) | No (SnPb balls, RoHS non-compliant) | Yes | Yes | Yes |
| Core Voltage | 1.5 V | 1.5 V - identical | 1.5 V - identical | 1.5 V - identical | 1.2 V (Cyclone II) |
| Unit Price (qty 1, USD) | $41.09 | Quote (legacy tin-lead, rare) | Quote (commercial, generally lower) | Quote (commercial -7) | Quote (Cyclone II, newer) |
주요 차별점
- Industrial temperature grade with -7 speed grade for maximum timing margin (vs EP1C4F400C8N)
- RoHS-compliant lead-free (Pb-free) packaging (vs EP1C4F400I7)
- Identical 400-FBGA footprint allows in-field density upgrade (vs EP1C20F400I7N)
설계 노트
The EP1C4F400I7N requires a low-noise 1.5V core supply and up to four separate VCCIO rails (one per I/O bank) ranging from 1.5V to 3.3V. Decoupling strategy: place a 100 nF X7R ceramic capacitor at every VCCINT and VCCIO ball, plus a 10 uF tantalum or ceramic bulk capacitor within 25 mm of the package. The PLL analog supply (VCCA_PLL) requires its own filtered 1.5V rail with a ferrite bead and 10 uF + 100 nF LC network to minimize jitter. According to the Cyclone Family Data Sheet, power sequencing is not strictly required but proper ramp rates (0.5 ms to 100 ms) prevent inrush current spikes.
The 400-ball FBGA package has 1.0 mm ball pitch, which is the upper limit for cost-effective 4-layer PCB fabrication using standard 4 mil (100 um) trace-and-space rules. Escape routing requires via-in-pad or micro-via (HDI) technology for inner balls. Maintain at least 0.5 mm clearance between BGA balls and other components. Use continuous ground and power planes on inner layers; never route signals across split planes beneath the BGA. The exposed pad (if present on this package variant) should be soldered to a thermal pad connected to GND for improved thermal dissipation.
Although the EP1C4F400I7N is rated for industrial -40C to +85C operation, dynamic power dissipation scales linearly with toggle rate and clock frequency. At 320 MHz with 70% utilization, expect 1-2 W typical dissipation, manageable with the FBGA's theta_JA of approximately 15 C/W on a standard JEDEC 4-layer test board. For continuous high-utilization designs in sealed enclosures, calculate worst-case junction temperature using the Quartus PowerPlay Early Power Estimator and derate accordingly. Add thermal vias beneath the package and copper pours on outer layers for additional heat spreading.
Configuration mode pins MSEL[1:0] must be correctly strapped to select AS (10), PS (00), or JTAG (01) modes; floating MSEL pins cause configuration failures. The nCONFIG pin must be held high during normal operation - a low pulse triggers reconfiguration. CONF_DONE must rise within the specified timeout (typically 100 us after DCLK starts) or configuration is aborted. Always include a JTAG header on the PCB even in production for in-system programming and debug access - factory-only programming is a common production bottleneck.
규정 준수 정보
RoHS compliant per 'N' suffix in MPN indicating Pb-free ball finish. AEC-Q100 not applicable for FPGAs (automotive qualification requires separate Q-grade part). Halogen-free and conflict minerals status not explicitly listed in verified web data; set to unknown.
