EP1C6F256C6N - Cyclone 6K LEs FPGA, 185 I/O, FBGA-256 | Intel
부품 번호: EP1C6F256C6N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21.8 | $21,800.00 |
EP1C6F256C6N 개요
An FPGA is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed by the designer after manufacture. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs (smaller, non-volatile) and ASICs (custom, non-reprogrammable). The Cyclone family is Intel's low-cost, high-volume line, optimized for ASIC replacement, glue logic, and digital signal processing rather than maximum logic density or transceiver performance.
Key features of the EP1C6F256C6N include 5,980 LEs, 92 Kbits (92160 bits) of embedded RAM arranged in M4K blocks, two phase-locked loops (PLLs) for clock management, and 185 user I/Os supporting LVTTL, LVCMOS, SSTL, and differential I/O standards. The device supports up to 3.3 V I/O tolerance and operates from a 1.5 V core supply.
The architecture combines 4-input look-up tables (LUTs), embedded memory blocks, and routing fabric on a single die. Designers configure the device via SRAM configuration cells, allowing unlimited re-programming in-system through JTAG or active serial configuration. The two PLLs support clock multiplication, division, and phase shifting for multi-clock domain designs.
Typical applications include digital signal processing front-ends, industrial control and motor drives, video and image processing pipelines, communications protocol bridging, ASIC prototyping, and embedded controller glue logic. The 185 user I/Os allow direct interfacing to external DDR/DDR2 memory, parallel ADCs/DACs, and high-speed parallel buses.
When designing with the EP1C6F256C6N, observe decoupling guidelines: place 0.1 µF capacitors adjacent to every VCCINT/VCCIO pin and a bulk 33 µF tantalum on each supply rail. The JTAG chain must be terminated with a 10 kΩ pull-up on TCK per IEEE 1149.1 to avoid spurious configuration. Pin-compatible drop-ins within the Cyclone family allow cost optimization without PCB rework.
This page consolidates distributor pricing, drop-in compatible alternatives from the Cyclone family and competing lines, and practical design notes not aggregated elsewhere.
드롭인 대체품: EP1C6F256C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1C6F256C6N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1C6F256C7N
✅ 드롭인✓ 재고 있음
$18.2 / 개
데이터시트 보기 →EP1C6F256C8N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EP1C6F256I6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1C6F256C6
✅ 드롭인✓ 재고 있음
$38.9 / 개
데이터시트 보기 →EP1C6F256C2
✅ 드롭인✓ 재고 있음
$13.8 / 개
데이터시트 보기 →LFE6-6BG256
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1C6F256C6N 최대 정격 & 전기적 특성
| Family | Cyclone |
| Logic Elements (LEs) | 5,980 |
| Embedded RAM Bits | 92,160 |
| User I/O Pins | 185 |
| 패키지 | 256-BGA (FBGA-256) |
| Core Voltage | 1.5 V |
| 동작 온도 | 0 °C to +85 °C (commercial) |
| Speed Grade | 6 |
| PLLs | 2 |
| Logic Array Blocks (LABs) | 598 |
| Process Technology | 0.13 µm SRAM |
| Configuration Method | JTAG / Active Serial |
| I/O Standards | LVTTL, LVCMOS, SSTL, LVDS |
| RoHS 상태 | Compliant (Pb-free) |
| 실장 유형 | Surface Mount (BGA) |
EP1C6F256C6N 256-bga (fbga-256) 핀 구성 가이드
EP1C6F256C6N(256-bga (fbga-256) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1C6F256C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1C6F256C6N 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drives, Video Image Processing Pipeline, ASIC Prototyping and Validation, Communications Protocol Bridge, Digital Signal Processing Front-End, Embedded Glue Logic and Bus Bridge.
Industrial Motor Control and Drives
The EP1C6F256C6N fits industrial motor control with 5,980 LEs sufficient for a multi-axis PID loop, SVPWM generation, and encoder decoding. The 185 user I/Os support parallel interface to gate drivers and three-phase current-sensing ADCs. The two PLLs enable precise PWM timing at 50 kHz carrier frequency without external DDS chips, while the 92 Kbits of block RAM buffer waveform tables and field-orientation lookup data.
추천
Video Image Processing Pipeline
The EP1C6F256C6N fits mid-resolution video processing with logic capacity for ITU-R BT.656 or VGA pipelines, color-space conversion, and on-the-fly gamma correction. The 92 Kbits of M4K embedded RAM line-buffer a 720×576 image at 8 bits/pixel, while 185 user I/Os interface directly to DDR/DDR2 memory controllers for frame buffering. Designers typically pair this FPGA with a TI TVP5154 video decoder and an ADV7123 video DAC.
추천
ASIC Prototyping and Validation
The EP1C6F256C6N fits ASIC prototyping where its 5,980 LEs map 1:1 to roughly 50K gates of equivalent ASIC logic, while 185 user I/Os replicate the pad ring for ASIC bring-up validation. The SRAM-based fabric supports unlimited in-system JTAG re-programming for iterative debug, and the two PLLs emulate ASIC clock-tree insertion. This makes the part a popular target for pre-silicon functional verification before committing to a 130 nm cell library tape-out.
추천
Communications Protocol Bridge
The EP1C6F256C6N fits protocol bridging between industrial buses (SPI, I2C, UART) and Ethernet or USB stacks. The 5,980 LEs implement a complete soft-MAC 10/100 Ethernet controller plus a TCP/IP offload core, while 185 user I/Os simultaneously drive multiple SPI peripherals and UART channels. The 92 Kbits of RAM buffer TCP/IP packets, and the JTAG port allows field firmware updates without removing the assembly.
추천
Digital Signal Processing Front-End
The EP1C6F256C6N fits DSP pre-processing for radar, sonar, or instrumentation front-ends with logic capacity for FIR filters, FFT engines, and decimators. Its 92 Kbits of block RAM stores coefficient tables and window functions, while 185 user I/Os stream data from 16-bit parallel ADCs at sample rates up to 65 MSPS. The two PLLs generate the ADC sampling clock and derive an integer-ratio DSP clock from a single 50 MHz reference.
추천
Embedded Glue Logic and Bus Bridge
The EP1C6F256C6N fits glue-logic consolidation where designers replace scattered 74-series TTL with a single reconfigurable device. Its 5,980 LEs implement custom state machines, FIFOs, and bus arbiters, while 185 user I/Os bridge legacy 8/16/32-bit parallel buses. The 1.5 V core plus selectable 3.3 V/2.5 V/1.8 V I/O banks allow direct interface to legacy 5 V-tolerant logic through external resistor dividers, simplifying system integration.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1C6F256C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1C6F256C7N | EP1C6F256I6N | LFE6-6BG256 |
|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA (same) | 256-FBGA (same) | 256-fpBGA (same) |
| Brand | Intel | Intel | Intel | Lattice Semiconductor |
| Logic Elements / LUTs | 5,980 LEs | 5,980 LEs | 5,980 LEs | 6,000 LUTs |
| Embedded RAM | 92,160 bits | 92,160 bits | 92,160 bits | 92,160 bits |
| User I/O | 185 | 185 | 185 | 190 |
| Speed Grade | 6 (standard) | 7 (15% faster) | 6 (industrial) | 7 / 8 |
| Process Technology | 130 nm | 130 nm | 130 nm | 90 nm |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.2 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Active |
주요 차별점
- Speed-grade flexibility on identical footprint (vs EP1C6F256C7N)
- Commercial vs. industrial temperature options (vs EP1C6F256I6N)
- Cross-brand pin-compatibility with Lattice ECP6 (vs LFE6-6BG256)
설계 노트
Estimated: the EP1C6F256C6N draws approximately 25 mA quiescent current on VCCINT (1.5 V core) and up to 800 mA on VCCIO banks at full I/O toggle. Place one 0.1 µF MLCC per power pin pair, one 4.7 µF bulk on each supply rail, and one 33 µF tantalum at the regulator output. With internal switching at 100 MHz and 50 % toggle, total board power is roughly 0.6 W. The 17 mm × 17 mm FBGA thermal pad must be soldered to a 1 oz copper pour with at least 8 thermal vias to a heatsink pour for adequate cooling.
Route all 4 configuration layers as impedance-controlled 50 Ω microstrip, with continuous ground reference plane beneath. BGA escape requires via-in-pad (VIP) for the inner rows; use 0.20 mm laser-drilled vias with 0.40 mm pad, capped and plated over. JTAG chain length must not exceed 6 inches to meet TCK rise-time budgets; add 10 kΩ pull-up on TCK and 33 Ω series damping on TMS/TDI/TDO.
Common pitfalls when designing with the EP1C6F256C6N: (1) VCCIO bank voltage mismatch - the device has 4 I/O banks, each with independent VCCIO pins; mixing 3.3 V and 2.5 V signals on the same bank will damage the I/O cells. (2) Configuration mode pins MSEL[2:0] must be tied to VCCA or GND via 1 kΩ resistors to select Active Serial mode; floating values cause un-recoverable configuration failure. (3) Never assert nCONFIG low during user-mode operation or the device will re-load and erase the design - add a hardware debounce on the configuration button.
규정 준수 정보
RoHS and REACH compliant per Intel/Altera product declaration. The 'N' suffix denotes Pb-free NiPdAu ball finish. Halogen-free status not explicitly confirmed in available data - set to unknown.
