Intel

EP1C6F256I7L - Cyclone FPGA, 5,980 LEs, 256-BGA | Intel / Altera

Name: EP1C6F256I7L - Cyclone FPGA, 5,980 LEs, 256-BGA | Intel / Altera
Brand: Intel
SKU: EP1C6F256I7L
Price: 27.4 USD
Availability: InStock

부품 번호: EP1C6F256I7L ✗ 단종

재고 있음 영업일 기준 1~3일 내 발송

1.5 V Vdss LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS Rds(on) 256-BGA (FBGA, 17x17 mm, 1.0 mm pitch) Package I7 (-7, industrial) Speed 20 M4K blocks (4 Kbit each) Memory

시작가 $27.4 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-06

볼륨 가격

수량	단가	합계
1	$41.93	$41.93
10	$39.8	$398.00
100	$35.5	$3,550.00
500	$31.2	$15,600.00
1,000	$27.4	$27,400.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP1C6F256I7L 개요

The Intel / Altera EP1C6F256I7L is a member of the first-generation Cyclone FPGA family, delivering 5,980 logic elements, 92,160 RAM bits, and 185 user I/Os in a 256-ball FineLine BGA (FBGA) package. The "L" suffix denotes a Pb-free lead-free finish, while the "I7" speed grade with industrial temperature rating (-40C to +100C junction) makes it suitable for harsh-environment embedded designs. The device is fabricated on a 1.5 V, 0.13 µm SRAM-based process with on-chip configuration memory that is loaded at power-up from an external serial or parallel flash.

A Field Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks (memory, multipliers, PLLs, I/O) that engineers can re-program after manufacture. FPGAs sit between fixed-function ASICs (lowest per-unit cost, no flexibility) and microcontrollers (sequential, lower throughput) in the digital design hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. They are used when parallel processing, deterministic latency, or hardware-level customization is required. Cyclone was Altera's first low-cost FPGA family, intended to displace ASICs in glue-logic, bridging, and DSP-front-end designs.

Key features of the EP1C6F256I7L include 20 M4K embedded RAM blocks (each 4 Kbit, true dual-port, with parity), 2 embedded PLLs with clock-multiplication and phase-shift capability, and support for external memory interfaces including DDR SDRAM and QDR SRAM via dedicated DQS pins. The device supports single-ended I/O standards (LVTTL, LVCMOS, PCI, SSTL, HSTL) on most pins and LVDS up to 303 Mbps on designated pairs. Configuration is via passive serial (PS), active serial (AS), or JTAG.

Typical applications for the EP1C6F256I7L span industrial control boards, video frame buffers, protocol bridging (I2C/SPI to UART/GPIO), motor-control pre-processing, and low-density DSP front-ends. Its 256-FBGA package and 1.5 V core provide a balanced cost / integration point for designs that exceed CPLD capacity but do not justify a Cyclone II / III / IV migration. Designers should budget at least one configuration flash (e.g., EPCS4) and a JTAG header for in-system programming. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

드롭인 대체품: EP1C6F256I7L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP1C6F256I7L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Technology, Family.

EP1C12F256I7N

Intel

Package: 256-BGA FineLine

Operating Temperature: -40°C to +100°C (industrial)

Process Technology: 0.13 μm SRAM-based

비교 대상: EP1C6F256I7L →

EP1C6F256C6N

Intel

Package: 256-BGA (FBGA-256)

Speed Grade: 6

Operating Temperature: 0 °C to +85 °C (commercial)

비교 대상: EP1C6F256I7L →

EP1C6F256C7N

Intel

Speed Grade: -7 (C7)

Operating Temperature: 0C to +85C (commercial)

Process Technology: 0.13 µm SRAM, all-layer copper

비교 대상: EP1C6F256I7L →

EP1C6F256C8N

Intel

Package: 256-BGA (FBGA-256), 17 × 17 mm, 1.0 mm pitch

Speed Grade: 8

Operating Temperature: 0 °C to +85 °C (Commercial)

비교 대상: EP1C6F256I7L →

✅ 드롭인

📦 256-BGA (FBGA)

same 256-BGA footprint, larger 20,060 LE Cyclone die (~3.4x logic, 2.6x RAM); pin-compatible I/O with more user I/Os

📋 참조 대체품 (카탈로그에 없음)

EP4CE6F256I7N

✅ 드롭인

📦 256-BGA (FBGA)

Cyclone IV E migration: 6,272 LEs, 270 Kbit RAM, 4 PLLs, hardware multipliers; pin-compatible footprint, 1.2 V core

📋 참조 대체품 (카탈로그에 없음)

EP1C6F256I7L 최대 정격 & 전기적 특성

Family	Cyclone
Logic Elements	5,980
Total RAM Bits	92,160
Embedded Memory Blocks	20 M4K blocks (4 Kbit each)
User I/Os	185
PLLs	2
패키지	256-BGA (FBGA, 17x17 mm, 1.0 mm pitch)
Process Technology	0.13 µm SRAM
Core Voltage	1.5 V
Speed Grade	I7 (-7, industrial)
동작 접합 온도	-40C to +100C
Configuration Modes	Passive Serial, Active Serial, JTAG
External Memory Support	DDR SDRAM, QDR SRAM, FCRAM
I/O Standards	LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS
Lead-Free Finish	Yes (L suffix)
RoHS 상태	Compliant

EP1C6F256I7L 256-bga (fbga, 17x17 mm, 1.0 mm pitch) 핀 구성 가이드

EP1C6F256I7L(256-bga (fbga, 17x17 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP1C6F256I7L의 256-bga (fbga, 17x17 mm, 1.0 mm pitch) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP1C6F256I7L.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP1C6F256I7L 적합 용도: 6 애플리케이션s: Industrial Control & Glue Logic, Video Frame Buffer / Display Bridging, Protocol Bridging (I2C/SPI to UART/GPIO/MIPI), Motor Control Pre-Processing, Test & Measurement Instrumentation Front-End, Low-Density DSP / Pre-Processing Front-End.

🏭

Industrial Control & Glue Logic

The EP1C6F256I7L's 5,980 LEs and 185 user I/Os make it well-suited to industrial PLC backplanes where it consolidates multiple discrete logic functions into a single reconfigurable device. Industrial temperature rating (junction -40C to +100C) and lead-free 256-BGA finish meet factory-floor reliability requirements. Placed alongside a microcontroller, the Cyclone handles custom peripheral interfaces, encoder decoding, and pulse-train generation in parallel, offloading deterministic real-time tasks from the MCU. Designers typically instantiate ALTPLL for motor-control clock generation and SOPC Builder for Nios II soft-core integration when logic capacity permits.

추천

EP1C6F256I7 · Intel EP1C12F256I7N · Intel EPCS4 (Configuration flash (4 Mbit AS mode)) EP4CE6F256I7N (Cyclone IV E migration for new designs)

📺

Video Frame Buffer / Display Bridging

With 92 Kbit of M4K RAM (20 dual-port blocks) and DDR-SDRAM support via dedicated DQS pins, the EP1C6F256I7L can buffer video frames between sensors and LCD controllers in mid-resolution applications. The 256-BGA package exposes sufficient LVDS pairs for parallel RGB or BT.656 inputs, while ALTMEMPHY megafunctions handle DDR line-rate transfers up to 133 MHz. Compared to a CPLD, the Cyclone offers far larger FIFOs and full RGB-to-LVDS conversion without external glue logic, reducing board area and BOM cost. Quartus II video IP (VIP) simplifies color-space conversion and chroma resampling.

추천

EP1C6F256C8N · Intel EP1C20F256I7N (Higher-density Cyclone for HD video pipelines) EPCS16 (Larger configuration flash for video IP bitstreams)

🌐

Protocol Bridging (I2C/SPI to UART/GPIO/MIPI)

Engineers use the EP1C6F256I7L as a hardware-protocol bridge when off-the-shelf ICs cannot connect legacy and modern peripherals. Its 185 I/Os easily accommodate multi-master I2C, quad SPI, UART, and GPIO fan-out in a single device, while the two PLLs derive independent baud-rate clocks. The Cyclone's parallel fabric outperforms microcontroller bit-banging by 10x-100x for throughput-bound tasks such as SPI-to-parallel camera capture. Industrial temperature rating suits automotive aftermarket and factory sensor hubs.

추천

EP1C4F400I7 · Altera EP1C12F256I7N · Intel EPCS4 (Configuration flash for bridging bitstream)

🏭

Motor Control Pre-Processing

The EP1C6F256I7L handles encoder quadrature decoding, Hall-sensor commutation, and PWM generation ahead of a microcontroller or DSP in servo and stepper drive systems. Two PLLs multiply a low-frequency crystal to the PWM carrier frequency and provide phase-shifted clocks for three-phase inverter timing. 185 I/Os support multi-axis drives with parallel feedback. The 100C industrial junction temperature and lead-free BGA finish withstand drive-cabinet thermal environments where convection cooling is limited.

추천

EP1C6F256C7N · Intel EP1C20F400I7N · Intel EPCS16 (Configuration flash for motor-control bitstream)

🔬

Test & Measurement Instrumentation Front-End

In bench instruments and data-acquisition modules, the EP1C6F256I7L acts as a programmable timing generator, trigger router, and signal-conditioning matrix. Its 92 Kbit M4K RAM captures pre-trigger samples, while 185 I/Os route multiple analog-front-end channels to an ADC. LVDS support up to 303 Mbps simplifies connection to high-speed ADCs. Compared to discrete 74-series logic, the Cyclone shrinks a typical trigger-and-timing board from 8-12 ICs to 1, improving cost and reliability. Quartus II SignalTap II provides on-chip logic-analyzer visibility.

추천

EP1C6F256I7 · Intel EP1C12Q240I7N · Intel EPCS16 (Configuration flash for instrumentation bitstreams)

🎧

Low-Density DSP / Pre-Processing Front-End

Before a dedicated DSP or ARM processor takes over, the EP1C6F256I7L can perform FIR filtering, FFT pre-processing, and sample-rate conversion in parallel hardware. Its 92 Kbit of dual-port RAM holds FFT twiddle factors and overlap-save buffers, while 185 I/Os connect to parallel ADC buses. Engineers typically use the ALTMULT_ADD and ALTMULT_ACCUM megafunctions for fixed-point MAC operations, achieving 16-bit MAC throughputs of several hundred MSPS at I7 speed grade. This front-end pattern is common in SDR, audio processing, and vibration-analysis modules.

추천

EP1C6F256C8N · Intel EP1C12F324I7N · Intel EPCS16 (Configuration flash for DSP bitstream with megafunctions)

추천 제품 요약

EP1C6F256I7 Intel 사용처: Industrial Control & Glue Logic, Test & Measurement Instrumentation Front-End EP1C12F256I7N Intel 사용처: Industrial Control & Glue Logic, Protocol Bridging (I2C/SPI to UART/GPIO/MIPI) EPCS4 Configuration flash (4 Mbit AS mode) 사용처: Industrial Control & Glue Logic, Protocol Bridging (I2C/SPI to UART/GPIO/MIPI) EP4CE6F256I7N Cyclone IV E migration for new designs 사용처: Industrial Control & Glue Logic EP1C6F256C8N Intel 사용처: Video Frame Buffer / Display Bridging, Low-Density DSP / Pre-Processing Front-End EP1C20F256I7N Higher-density Cyclone for HD video pipelines 사용처: Video Frame Buffer / Display Bridging EPCS16 Larger configuration flash for video IP bitstreams 사용처: Video Frame Buffer / Display Bridging, Motor Control Pre-Processing, Test & Measurement Instrumentation Front-End, Low-Density DSP / Pre-Processing Front-End EP1C4F400I7 Altera 사용처: Protocol Bridging (I2C/SPI to UART/GPIO/MIPI) EP1C6F256C7N Intel 사용처: Motor Control Pre-Processing EP1C20F400I7N Intel 사용처: Motor Control Pre-Processing EP1C12Q240I7N Intel 사용처: Test & Measurement Instrumentation Front-End EP1C12F324I7N Intel 사용처: Low-Density DSP / Pre-Processing Front-End

What is the EP1C6F256I7L and how many logic elements does it contain?

The EP1C6F256I7L is an Intel / Altera Cyclone-generation low-cost FPGA housed in a 256-ball FBGA package. It contains 5,980 logic elements and 92,160 bits of embedded RAM organized as 20 M4K blocks of 4 Kbit each. According to the Cyclone Family datasheet, the device targets low-to-mid density glue logic, video bridging, and protocol-conversion applications where a small ASIC is uneconomical.

What does the "L" suffix on EP1C6F256I7L mean?

The trailing "L" indicates a lead-free (Pb-free) ball finish that satisfies RoHS and lead-free assembly requirements. Electrically the part is identical to the standard EP1C6F256I7 (with tin-lead balls). Buyers targeting RoHS-compliant assemblies should order the L suffix; designers doing tin-lead rework prototyping can use either. Per Altera's part-numbering convention, the L is a finish code only - the silicon die is unchanged.

Is EP1C6F256I7L still in production or has it been discontinued?

According to Intel FPGA product-change notifications, the Cyclone (original) family, including the EP1C6F256I7L, is in Not Recommended for New Designs (NRND) status as of 2026-09-06. The device is still serviceable for existing designs but is not recommended for new projects. Engineers should evaluate Cyclone IV E (EP4CE6F256) or Cyclone 10 LP (10CL006) for new designs that need long-term supply continuity.

How much does EP1C6F256I7L cost and where can I buy it?

As of 2026-09-06, EP1C6F256I7L prices start at approximately USD 41.93 for qty-1 according to Heisener distributor data; volume pricing drops to around USD 27.40 at 1,000 pieces. The part is currently in stock at independent distributors including Heisener (3,856 pieces) and Nantian, and is also listed at Octopart where pricing from 24 distributors can be compared. Buyers should verify RoHS and date-code requirements before purchasing from independent distributors.

What is the lead time for EP1C6F256I7L orders?

Lead time for EP1C6F256I7L as of 2026-09-06 is reported by Heisener as "can ship immediately" with an estimated delivery window of July 29 - August 3, 2026 for standard shipping. Because the Cyclone family is NRND, long-term lead times may extend as authorized-stock depletes; engineers should plan for 12-26 weeks for replenishment orders from authorized channels or qualified independent distributors.

EP1C6F256I7L vs EP1C6F256I7 - what is the difference?

EP1C6F256I7L and EP1C6F256I7 are the same silicon die in the same 256-BGA package; the only difference is ball finish. The L suffix denotes lead-free (Pb-free) balls for RoHS assembly, while the standard EP1C6F256I7 uses tin-lead (SnPb) balls. They are drop-in pin-compatible substitutes for each other on a properly designed PCB footprint - choose L for new RoHS-compliant builds and the non-L for legacy tin-lead processes.

EP1C6F256I7L vs EP4CE6F256I7N - should I migrate to Cyclone IV?

The EP4CE6F256I7N (Cyclone IV E, 6,272 LEs) is pin-compatible with the EP1C6F256I7L in the 256-FBGA footprint, making it a recommended migration target. Cyclone IV E delivers roughly 2x the logic, 4x the RAM, more PLLs, and adds hardware multipliers, while running on a smaller 60 nm process at lower core voltage. For new designs, Cyclone IV E or Cyclone 10 LP is preferred over the original Cyclone due to better long-term availability.

What is the best drop-in replacement for EP1C6F256I7L?

The most practical drop-in replacement for EP1C6F256I7L on the same 256-FBGA footprint is the EP1C6F256I7 (non-L variant, tin-lead balls), which is electrically identical and pin-to-pin compatible. For new designs needing more capacity, the EP4CE6F256I7N (Cyclone IV E) drops into the same PCB land pattern and offers substantially more logic and memory. Both alternatives preserve the 185-I/O count and configuration pinout of the original Cyclone part.

Where can I download the EP1C6F256I7L datasheet PDF?

The Cyclone Family datasheet that covers the EP1C6F256I7L can be downloaded from Alldatasheet at the URL listed in this page's data sources. The 94-page document covers device architecture, DC/AC characteristics, configuration timing, and package pin-out for the 256-BGA variant. Note that Altera / Intel renamed the Cyclone family after acquisition; legacy datasheets are mirrored on third-party sites such as Alldatasheet and Datasheets.com.

Where do I find the EP1C6F256I7L pinout for the 256-BGA package?

The 256-BGA pinout for EP1C6F256I7L is documented in Chapter 7 of the Cyclone Family datasheet, which lists each ball by coordinate (A1-A16, B1-B16, ..., T1-T16) and by signal name (I/O bank assignment, configuration pins, clock inputs, power, ground). Designers should reference the pinout against their target board's BGA fan-out; a free IBIS model and BSDL file are also available from Intel's FPGA legacy support portal.

What configuration memory does EP1C6F256I7L require?

The EP1C6F256I7L requires an external configuration flash such as the Altera EPCS4 (4 Mbit) or EPCS16 (16 Mbit) in Active Serial (AS) mode, sized to fit the compressed or uncompressed bitstream. Bitstream size for a fully utilized EP1C6 is roughly 1.2-1.7 Mbit, so EPCS4 is typically sufficient. A JTAG header (TCK, TMS, TDI, TDO) should also be provided for in-system programming and debug via the Quartus II Programmer tool.

Does EP1C6F256I7L support DDR SDRAM interfaces?

Yes, the EP1C6F256I7L supports DDR SDRAM, QDR SRAM, and FCRAM interfaces through its dedicated DQS (data strobe) pins and SSTL/HSTL I/O standards. According to the Cyclone datasheet, the device supports DDR SDRAM up to 133 MHz and provides up to 4 dedicated DQS pins with associated DQ groups. Designers should use the ALTMEMPHY megafunction in Quartus II to generate the controller and timing constraints.

How many PLLs and global clock networks does EP1C6F256I7L provide?

The EP1C6F256I7L provides 2 enhanced PLLs and up to 8 global clock networks. Each PLL supports clock multiplication, division, phase shifting, and external feedback for zero-delay buffer operation. Designers targeting DDR memory or source-synchronous interfaces should use the PLL's phase-shift capability to align internal clock edges with the DQS strobe. Quartus II's ALTPLL megafunction abstracts the configuration.

What is the difference between speed grades I6, I7, and I8 for EP1C6?

Altera Cyclone speed grades I6 (fastest), I7 (mid), and I8 (slowest) trade timing margin for cost. I7 is the typical industrial-grade selection that meets 100C junction temperature and gives reasonable Fmax across all speed paths. I6 parts may yield slightly higher Fmax but cost more; I8 is selected for low-cost industrial designs that do not push timing margins. For DDR-133 designs I7 is the standard choice per the Cyclone datasheet.

엔지니어링 참조 데이터: EP1C6F256I7L — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP1C6F256I7L for new designs that need a mid-density (5,980 LE) Cyclone FPGA in the 256-BGA package with industrial temperature rating (-40C to +100C junction) and lead-free RoHS-compliant ball finish. It is the right fit when logic capacity below the EP1C12 boundary suffices and the design targets factory-floor or automotive-aftermarket environments. For legacy SnPb assembly lines, choose EP1C6F256I7 (non-L, tin-lead balls); for new designs requiring long-term supply, migrate to EP4CE6F256I7N (Cyclone IV E) which is pin-compatible in the same 256-BGA footprint and offers more logic, more RAM, hardware multipliers, and a smaller 60 nm process node. The C7/C8 commercial-grade variants are appropriate only for indoor, cost-sensitive applications that do not require industrial temperature range.

대체품과의 비교

파라미터	이 제품	EP1C6F256I7	EP1C6F256C8N	EP1C12F256I7N	EP1C20F256I7N	EP4CE6F256I7N
Brand	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera
Package	256-BGA (FBGA, 17x17 mm)	256-BGA (FBGA) - same	256-BGA (FBGA) - same	256-BGA (FBGA) - same	256-BGA (FBGA) - same	256-BGA (FBGA) - same
Logic Elements	5,980	5,980 (same die)	5,980 (same die)	12,060	20,060	6,272 (Cyclone IV E)
Total RAM Bits	92,160	92,160	92,160	239,616	294,912	270,000
User I/Os	185	185	185	185	185	179
PLLs	2	2	2	2	2	4
Operating Temperature	-40C to +100C (industrial)	-40C to +100C (industrial)	0C to +85C (commercial)	-40C to +100C (industrial)	-40C to +100C (industrial)	-40C to +100C (industrial)
Speed Grade	I7 (mid)	I7	C8 (slower)	I7	I7	I7
Ball Finish	Lead-free (Pb-free)	Tin-lead (SnPb)	Lead-free	Lead-free	Lead-free	Lead-free
Core Voltage	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.2 V

주요 차별점

Pb-free lead-free finish in 256-BGA (vs EP1C6F256I7)
Industrial temperature grade with I7 speed (vs EP1C6F256C8N)
Mid-density Cyclone with 185 user I/Os (vs EP1C12F256I7N)

설계 노트

Estimated: at typical utilization (60% LE, 50% RAM, 2 PLLs, 100 MHz) the EP1C6F256I7L core draws approximately 200-350 mA from VCCINT (1.5 V), plus I/O bank current scaled by switching frequency. The 256-BGA requires a low-impedance power plane for VCCINT (1.5 V), VCCIO (per-bank, 1.5/1.8/2.5/3.3 V), and PLL analog supply. Decouple each of the four VCCIO banks with 0.1 µF and 10 µF ceramic caps within 5 mm of the BGA balls; place 1.0 µF and 0.1 µF caps directly on VCCINT and VCCA_PLL balls.

The 256-BGA at 1.0 mm pitch requires 4-6 layer PCB with via-in-pad or microvia fan-out. Recommended stack-up: signal + GND + power + GND + signal, with continuous GND plane under the BGA. Matched-length trace tuning for DDR and LVDS is essential; use the Quartus II TimeQuest timing analyzer with board IBIS models. Expose TDI/TDO/TMS/TCK balls to a JTAG header for in-system programming; expose MSEL[2:0] balls to set the configuration mode (00=AS, 01=PS, 10=JTAG-only, 11=fast AS).

Do not attempt to migrate an EP1C6F256I7L board to a Cyclone IV E (EP4CE6F256) by simple part substitution without re-running Quartus timing closure: the core voltage changes from 1.5 V to 1.2 V, the PLL parameters differ, and a few configuration pins have moved. Also avoid substituting the EP1C6F256I7 (tin-lead) onto a board designed for the L (lead-free) without checking reflow profile compatibility. Always regenerate configuration data when changing speed grade (I7 vs C8) since timing paths re-balance.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Compliant

L suffix confirms lead-free (Pb-free) finish for RoHS assembly. Halogen-free status not stated in available data - verified data marked [DATA_NEEDED: halogen-free]. AEC-Q100 not applicable (FPGA, not an automotive-qualified analog IC).

데이터 검증일: 2026-09-06 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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