EP1S80B956C5N - Stratix 79K Logic Elements 956-FCBGA FPGA | Intel
부품 번호: EP1S80B956C5N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $175 | $175,000.00 |
EP1S80B956C5N 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device (PLD) that lets engineers implement arbitrary digital logic, memory, DSP, and high-speed serial functions on a single silicon die. Within the broader semiconductor taxonomy, FPGAs sit under programmable logic devices (PLDs) -> field programmable gate arrays (FPGAs) -> programmable semiconductors, and they are the device-of-choice when design requirements outgrow fixed-function ASICs or microcontrollers in logic density, parallelism, or I/O bandwidth.
Key features of the EP1S80B956C5N include the Stratix TriMatrix on-chip memory architecture, dedicated DSP blocks for high-throughput multiply-accumulate operations, multiple phase-locked loops (PLLs) for clock synthesis, and high-speed LVDS I/O support. The 956-ball FCBGA package exposes a very large user-I/O count and dedicated global clock routing, enabling the device to interface to external DDR SDRAM memories and multiple high-speed parallel buses simultaneously.
Architecturally, the Stratix family introduced a look-up-table (LUT) based logic element combined with embedded array blocks (EABs) and DSP blocks. The 1.5 V core reduces dynamic power relative to earlier 2.5 V Stratix predecessors, while the 130 nm process provides mature, well-characterized timing closure for complex synchronous designs.
Typical applications include high-performance digital signal processing, telecom baseband processing, industrial video and image processing, networking line-card prototyping, and ASIC prototyping/emulation platforms. Designers also use this device in test & measurement front-ends and in military/aerospace prototypes that demand high logic density with commercial-grade screening.
When designing with this device, pay attention to power budgeting: the 1.5 V core combined with up to 500 MHz clock domains means multi-amp core currents and the need for extensive decoupling. The 956-ball FCBGA also requires multi-layer PCB stack-ups with buried vias and controlled-impedance routing for LVDS pairs.
This page synthesizes distributor inventory, current market pricing, same-family drop-in Stratix alternatives, and practical engineering guidance not bundled in the manufacturer datasheet.
드롭인 대체품: EP1S80B956C5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S80B956C5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, DSP Blocks, Operating Temperature, PLLs, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S80B956C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S80B956C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S80B956I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S80B956C5N 최대 정격 & 전기적 특성
| Family | Altera Stratix |
| Logic Elements | 79,040 |
| Maximum Internal Clock Frequency | 500 MHz |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 패키지 | 956-ball FCBGA |
| 동작 온도 | 0 °C to +85 °C (commercial, 'C' grade) |
| Speed Grade | 5 |
| 실장 유형 | Surface Mount (BGA) |
| Memory Architecture | TriMatrix on-chip memory |
| DSP Blocks | Yes (dedicated hardware multipliers) |
| PLLs | Yes (multiple) |
| I/O Standard Support | LVDS, LVTTL, LVCMOS, SSTL, HSTL (per Stratix family) |
EP1S80B956C5N 956-ball fcbga 핀 구성 가이드
EP1S80B956C5N(956-ball fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S80B956C5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S80B956C5N 적합 용도: 6 애플리케이션s: Telecom Baseband Signal Processing, ASIC Prototyping and Emulation, Industrial Video and Image Processing, Networking Line-Card Packet Processing, Test and Measurement Instrumentation, Military and Aerospace Prototyping.
Telecom Baseband Signal Processing
The EP1S80B956C5N's 79,040 logic elements, dedicated DSP blocks, and 500 MHz internal clock performance make it well-suited for telecom baseband processing. With TriMatrix on-chip memory, the device can buffer multiple symbol windows while DSP blocks execute multiply-accumulate operations for channel estimation, equalization, and turbo decoding. The 956-ball FCBGA exposes high LVDS I/O counts needed to interface to external ADCs, DACs, and CPRI/OBSAI framer ASICs in 3G/4G base-station prototyping.
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ASIC Prototyping and Emulation
With 79K logic elements and abundant on-chip memory, the EP1S80B956C5N serves as an effective ASIC prototyping vehicle for designs in the 50K-200K gate range. Multiple EP1S80 devices can be paralleled on a multi-FPGA prototyping board to emulate larger ASICs, taking advantage of LVDS-based chip-to-chip communication and the Stratix family's deterministic timing. Quartus II design partitioning tools simplify the multi-FPGA split.
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Industrial Video and Image Processing
The EP1S80B956C5N's DSP blocks and high I/O bandwidth support real-time video pipelines at SD, HD, and early 4K resolutions. The 956-ball FCBGA exposes sufficient LVDS pairs to drive multiple Camera Link channels or HDMI/DVI interfaces, while TriMatrix memory buffers line buffers and frame stores. Designers implement motion-estimation, filtering, and color-space conversion directly in FPGA fabric, offloading the host processor.
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Networking Line-Card Packet Processing
In networking line cards the EP1S80B956C5N performs header parsing, classification, and traffic shaping at line rate. Its abundant LVDS I/O and on-chip memory enable wire-speed processing of 1G and 10G Ethernet streams, while dedicated DSP blocks accelerate hash and CRC operations. The 1.5 V core reduces power per lookup compared to older 2.5 V Stratix predecessors, easing line-card thermal budgets.
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Test and Measurement Instrumentation
The EP1S80B956C5N enables custom logic-analyzer, protocol-analyzer, and arbitrary-waveform-generator front-ends. Its 500 MHz fabric, multiple PLLs, and LVDS I/O support pattern generation at hundreds of megahertz with precise edge placement. The high logic density allows a single FPGA to implement both the pattern generator and the compare/verification engine, replacing multiple discrete test chips on the same board.
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Military and Aerospace Prototyping
Although the EP1S80B956C5N is commercial-temperature grade (0 °C to +85 °C), it is widely used in military/aerospace prototype and bench development where the engineering environment is controlled. Designers prototype algorithms intended for later porting to radiation-hardened FPGAs, taking advantage of the Stratix architecture's deterministic timing. The industrial-grade variant EP1S80B956I7N is preferred when -40 °C operation is required.
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추천 제품 요약
엔지니어링 참조 데이터: EP1S80B956C5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S80B956C6N | EP1S80B956C7N | EP1S80B956I7N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 956-ball FCBGA | 956-ball FCBGA - same | 956-ball FCBGA - same | 956-ball FCBGA - same |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | 5 (fastest commercial) | 6 | 7 (slowest commercial) | 7 (industrial) |
| Temperature Range | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Maximum Internal Clock | 500 MHz | slightly slower than C5 | slower than C6 | similar to C7 |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
주요 차별점
- Fastest speed grade in the EP1S80 commercial family (vs EP1S80B956C6N)
- Pure commercial temperature range (vs EP1S80B956I7N)
- High logic density at 79K LEs (vs EP1S60F1508C7N)
설계 노트
Estimated: The EP1S80B956C5N at 500 MHz core clock with full I/O switching typically draws 3-5 A on the 1.5 V VCCINT rail, plus 1-2 A on the 3.3 V VCCIO rails. Design the regulator stage with at least 30% headroom and place low-ESR ceramic decoupling (10 µF + 0.1 µF per supply pin group) within 5 mm of each BGA via. For 956-ball FCBGA layouts, use a 6- or 8-layer PCB stack-up with dedicated power and ground planes to suppress core-noise coupling onto LVDS pairs.
Estimated: At full 500 MHz operation the die dissipation can exceed 8 W, requiring junction-to-ambient thermal management. Although the FCBGA package has a modest theta_JA, in practice attach a small heat-spreader or thermal pad covering the die shadow on the top of the BGA. For enclosed chassis, derate by 20% above 60 °C ambient. Industrial-grade EP1S80B956I7N variants are recommended above 85 °C ambient.
The 956-ball FCBGA mandates a high-density interconnect (HDI) PCB. Use microvias (laser-drilled, 0.1 mm pad) or stacked microvias for breakout routing from inner balls. Maintain at least 4 ground vias adjacent to the BGA perimeter for return-path integrity, and follow the Altera Stratix Board Design Guidelines for skew-matched LVDS routing (max 10 mil within-pair mismatch). Add a keep-out region beneath the BGA to allow for the heat-spreader attachment.
Do not confuse the EP1S80B956C5N with the Stratix II EP2S80 (different die, different BGA ball-map, not pin-compatible). Always verify the full MPN, especially the speed-grade digit, before ordering - EP1S80B956C5, C6, C7 and I5/I7 are distinct part numbers with different timing. Configuration mode (Passive Serial, Fast Passive Parallel, JTAG) must match the board's boot PROM to avoid lockup at power-up.
규정 준수 정보
The 'N' suffix in the MPN indicates lead-free packaging per Altera/Intel legacy naming convention. RoHS and REACH compliance status are not present in the verified web data; consult Intel's PCN archive for the specific date code.
