EP1S40F1020C7N - Stratix 41K LE FPGA, 1020-FBGA | Intel
부품 번호: EP1S40F1020C7N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1323.97 | $1,323.97 |
| 10 | $1191.57 | $11,915.70 |
| 100 | $1059.18 | $105,918.00 |
| 500 | $992.98 | $496,490.00 |
| 1,000 | $926.78 | $926,780.00 |
EP1S40F1020C7N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined by the user after manufacturing, consisting of an array of programmable logic elements, configurable I/O blocks, programmable interconnect, and dedicated hardware blocks such as block RAM and DSP multipliers. FPGAs sit in the programmable-logic branch of the broader semiconductor taxonomy (FPGA -> programmable logic -> digital IC -> integrated circuit) and are commonly deployed as hardware accelerators, prototyping platforms, and glue-logic bridges between processors and high-speed peripherals.
Key device features for the EP1S40F1020C7N include 3,423,744 embedded RAM bits distributed across TriMatrix memory blocks, embedded DSP blocks with hardware multipliers, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL through dedicated I/O banks. The device includes dedicated high-speed serial interface channels, an internal configuration controller that supports multiple passive and active configuration schemes, and on-chip PLLs for clock management. Maximum internal operating frequency is specified at 420.17 MHz.
Architecturally the Stratix family combines a hierarchical routing fabric with 8-input adaptive look-up tables, fast cluster interconnects, and a row/column structure that supports efficient placement of wide datapaths. The 130 nm process node and 1.5 V core supply keep dynamic power moderate for the era, while the 1020-ball FC-FBGA package provides the I/O density and signal-integrity margin required for high-performance board designs.
Typical applications include telecommunications line cards, DSP co-processing, ASIC prototyping, high-speed serial protocol bridging, and military/aerospace signal processing. The combination of block RAM, embedded multipliers, and high I/O count makes the part particularly well-suited to wide datapath designs and parallel processing.
When designing with this part, ensure the PCB uses controlled-impedance routing for high-speed I/O banks, follow Intel Stratix hardware reference design guidelines for power-plane decoupling, and verify the configuration scheme (PS, AS, JTAG) against the chosen configuration memory density.
This page synthesizes distributor pricing, same-family drop-in alternatives, lifecycle observations, and practical design notes not found in the original Stratix datasheet, providing a single reference for engineers evaluating the EP1S40F1020C7N for new designs or as a long-term replacement target.
드롭인 대체품: EP1S40F1020C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S40F1020C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, RoHS Status, Family, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S40F1020C6N
✅ 드롭인✓ 재고 있음
$695 / 개
데이터시트 보기 →EP1S40F1020C5N
✅ 드롭인✓ 재고 있음
$280 / 개
데이터시트 보기 →EP1S40F1020C6
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP1S40F1020C5
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP1S30F1020C7N
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP1S30F1020C7
✅ 드롭인✓ 재고 있음
$575 / 개
데이터시트 보기 →EP1S40F1020C7N 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| User I/O Pins | 773 |
| Embedded Memory (bits) | 3,423,744 |
| Supply Voltage (Core) | 1.5 V |
| Maximum Operating Frequency | 420.17 MHz |
| Process Technology | 130 nm CMOS |
| 패키지 | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) |
| 동작 온도 범위 | 0 C to 85 C (Commercial) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration Schemes | PS, AS, JTAG |
| On-chip PLLs | Yes |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (verify on quote) |
EP1S40F1020C7N 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) 핀 구성 가이드
EP1S40F1020C7N(1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S40F1020C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S40F1020C7N 적합 용도: 6 애플리케이션s: Telecommunications Line Card Processing, ASIC Prototyping and Emulation, High-Speed DSP Co-Processing, Industrial High-Speed Data Acquisition, Military and Aerospace Signal Processing, High-Speed Protocol Bridging and Glue Logic.
Telecommunications Line Card Processing
The EP1S40F1020C7N suits telecom line-card designs where 41,250 logic elements and 3.4 Mbit of embedded TriMatrix memory provide parallel packet-processing datapaths without external SRAM. Its 773 user I/O pins support multiple SFI/SPI-like interfaces, while embedded DSP blocks accelerate Viterbi or Reed-Solomon encoding at the 420.17 MHz internal clock. The 1.5 V core and 130 nm node keep power manageable for 10-15 W line-card budgets.
추천
ASIC Prototyping and Emulation
The EP1S40F1020C7N is widely used to prototype multi-million-gate ASIC designs before tape-out because its 41K LE capacity maps cleanly onto partitioned ASIC blocks. The Quartus II flow supports Verilog and VHDL synthesis with timing-driven placement, while the 1020-ball FC-FBGA exposes enough user I/O to bring out wide ASIC buses. The C7 speed grade provides the timing margin needed for accurate worst-case ASIC verification at 420.17 MHz.
추천
High-Speed DSP Co-Processing
The EP1S40F1020C7N's embedded multiplier blocks accelerate fixed-point DSP workloads such as FFTs, FIR filters, and radar pulse compression in radar and signal-intelligence systems. The 3.4 Mbit of embedded memory enables deep sample buffering without external SRAM, and the 420.17 MHz Fmax supports sample rates up to several hundred megasamples per second across parallel channels. The 130 nm process node gives predictable latency for synchronous DSP pipelines.
추천
Industrial High-Speed Data Acquisition
The EP1S40F1020C7N functions as the central processing element in industrial data-acquisition systems, where 773 user I/O pins interface to multiple high-speed ADCs and DACs across LVDS and LVCMOS banks. Embedded block RAM buffers high-rate sample streams before downstream DSP, and on-chip PLLs generate the multiple clock domains needed for synchronous acquisition. The commercial 0-85 C operating range suits most factory-floor enclosures.
추천
Military and Aerospace Signal Processing
The EP1S40F1020C7N's parallel DSP blocks and 41K LE capacity support radar, electronic-warfare, and software-defined-radio subsystems where deterministic latency and on-chip memory are required. Multiple I/O banks enable simultaneous connection to RF ADCs, DACs, and high-speed transceivers while preserving signal integrity. Designers pair the device with companion Stratix-II or radiation-tolerant parts for upgrade paths, using the same 1020-FBGA footprint where possible.
추천
High-Speed Protocol Bridging and Glue Logic
The EP1S40F1020C7N serves as a programmable bridge between heterogeneous processor buses, network PHYs, and storage controllers where fixed ASSPs cannot match the required interface mix. The 773 user I/O pins support many parallel and serial protocols simultaneously, while embedded TriMatrix memory implements FIFOs and translation buffers between clock domains. The 1.5 V core supply and 130 nm node keep system power budgets reasonable for multi-rail platforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S40F1020C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S40F1020C6N | EP1S40F1020C5N | EP1S40F1020C6 | EP1S40F1020C5 | EP1S30F1020C7N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 33,000 |
| Speed Grade | C7 (fastest) | C6 | C5 | C6 | C5 | C7 |
| User I/O Pins | 773 | 773 | 773 | 773 | 773 | 773 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
주요 차별점
- Fastest speed grade in the EP1S40F1020 family (vs EP1S40F1020C6N)
- Highest logic capacity in the original Stratix family at 41K LE (vs EP1S30F1020C7N)
- Same pinout across speed grades simplifies BOM management (vs EP1S25F1020C7N)
설계 노트
Estimated: at 1.5 V core and 2 A core current, the EP1S40F1020C7N dissipates roughly 3 W internally, plus additional IO bank power; total worst-case package power can reach 8-10 W. Use thermal vias under the 33 x 33 mm FC-FBGA exposed pad to a multilayer copper ground plane. Without a thermal spreader, the 130 nm process die can exceed 100 C junction at 25 C ambient, derating Fmax. Add airflow or a heat spreader for production deployments.
The 1020-ball FC-FBGA at 1.0 mm pitch demands a high-density PCB stackup with microvia or via-in-pad construction; standard 8/8 mil via designs cannot reliably break out the inner balls. Plan for at least 6 PCB layers to provide solid reference planes for the high-speed LVDS and SSTL I/O banks. Follow the Altera Stratix hardware reference design guidelines for power-plane decoupling, placing 0.1 uF and 0.01 uF capacitors within 100 mil of every power pin.
Use controlled-impedance routing (typically 50 ohm single-ended, 100 ohm differential) for all LVDS and SSTL I/O bank traces, with length matching within 25 mil for differential pairs. The 773 user I/O pins are organized into multiple banks, each with its own VCCIO rail; isolate clocks and high-speed buses from switching I/O by dedicating separate banks. Series-termination resistors on LVTTL outputs help reduce overshoot when driving long PCB traces back to companion ASICS.
Do not confuse the EP1S40F1020C7N with the older EP1S40B956 or smaller EP1S25 variants: the 1020-FBGA pinout is unique to the -40F1020 family. Mixing configuration modes (PS, AS, JTAG) without proper MSEL pin strapping can leave the device unconfigured. Verify the configuration memory density (EPCS16, EPCS64, etc.) supports the compressed bitstream size generated by Quartus II for your design before board bring-up.
규정 준수 정보
Compliance status not stated in the verified distributor listings; confirm with the manufacturer or your distributor at quote time. AEC-Q100 is not applicable because the part is a commercial-grade FPGA, not an automotive-qualified IC.