EP20K200BC356-2XV - APEX-20K FPGA, 8320 LE, 356-BGA | Altera/Intel
부품 번호: EP20K200BC356-2XV ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $65 | $65.00 |
| 10 | $58.5 | $585.00 |
| 100 | $52 | $5,200.00 |
| 250 | $48 | $12,000.00 |
| 500 | $45 | $22,500.00 |
EP20K200BC356-2XV 개요
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that lets engineers implement arbitrary digital logic via a configurable array of logic elements, interconnect, and embedded memory blocks. Within the broader taxonomy of programmable logic, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices), PALs, and ASICs; APEX-20K is specifically a multi-core architecture that combines Look-Up Table (LUT)-based logic with dedicated embedded memory and high-speed I/O, making it a member of the pre-Cyclone/Stratix Altera lineup targeted at high-density glue logic, bus bridging, and DSP prototyping.
Key features include 8320 logic elements distributed across 832 LABs (Logic Array Blocks), 106 Kbit of embedded SRAM distributed in EABs (Embedded Array Blocks), 277 user I/O pins, JTAG/IEEE 1149.1 boundary-scan support, and a flexible multi-volt I/O ring that can interface with 1.8V/2.5V/3.3V peripherals. The 356-ball BGA package exposes all I/O while preserving board area, and the -2 speed grade designates the second-fastest commercially available bin at the time of release.
Architecturally, APEX-20K combines a fine-grained MegaLAB structure, each MegaLAB containing 16 LABs plus an EAB. Logic is implemented via 4-input LUTs in each LE, and embedded memory is implemented in EABs that can be configured as RAM, ROM, or FIFO. The -2 speed grade corresponds to faster propagation delays versus the -3 grade, enabling higher system-clock operation; users typically target this part for glue logic, custom bus interfaces, and low-volume ASIC-replacement designs.
Typical applications include custom bus-bridging logic, telecommunications line-card glue, ASIC prototyping, industrial control interfacing, and legacy system upgrades where 277 user I/O are required. The wide I/O count and embedded memory also suit custom DSP datapaths such as finite-impulse-response (FIR) filters and correlators used in instrumentation. Because the part is now mature silicon, it is most often specified for long-lifecycle designs, defense systems, and industrial equipment already in service.
Design considerations include JTAG programming through the ByteBlaster or BitBlaster cable, single-event-upset (SEU) sensitivity in SRAM-based APEX-20K devices, and the use of core/I/O decoupling per APEX-20K reference designs. For aerospace/defense applications, designers should evaluate radiation-tolerant APEX-20K variants and consider watchdog/CRC scrubbing on the configuration bitstream.
This page synthesizes verified distributor inventory and pricing as of 2026-09-07, drop-in same-package alternatives from the APEX-20K family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP20K200BC356-2XV — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K200BC356-2XV (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Operating Temperature, Package, Series, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K200BC356-2
✅ 드롭인✓ 재고 있음
$88.25 / 개
데이터시트 보기 →EP20K200BC356-1X
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP20K200BC356-1
✅ 드롭인✓ 재고 있음
$335 / 개
데이터시트 보기 →EP20K200BC356-2XV 최대 정격 & 전기적 특성
| Family | APEX-20K |
| Series | APEX-20K® |
| Number of LABs/CLBs | 832 |
| Number of Logic Elements / Cells | 8320 |
| Total RAM Bits | 106496 |
| Number of I/O | 277 |
| Number of Gates | 526000 |
| Core Voltage Supply | 2.375 V to 2.625 V |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 °C to 85 °C (TJ) |
| 패키지 / 케이스 | 356-LBGA (Ball Grid Array) |
| Speed Grade | -2 |
| Configuration Memory | SRAM-based (volatile) |
| Programming Interface | JTAG (IEEE 1149.1) |
EP20K200BC356-2XV 356-lbga (ball grid array) 핀 구성 가이드
EP20K200BC356-2XV(356-lbga (ball grid array) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K200BC356-2XV.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K200BC356-2XV 적합 용도: 6 애플리케이션s: ASIC Prototyping and Validation, Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation, Military and Defense Avionics (Legacy), Custom DSP Datapaths (FIR/FFT Filters), Legacy Medical Imaging Systems.
ASIC Prototyping and Validation
The EP20K200BC356-2XV is well-suited to ASIC prototyping because its 8320 logic elements and 106,496 bits of embedded RAM allow full mapping of mid-complexity ASICs (up to ~500K gates). The 356-BGA package exposes 277 user I/O - sufficient to break out wide datapath buses, DDR-style memory interfaces, and multiple peripheral channels typical of ASIC prototyping boards. Designers map ASIC gates to APEX-20K MegaLABs and use Quartus to validate timing before tape-out.
추천
Telecommunications Line-Card Glue Logic
Telecom line cards historically used APEX-20K devices to bridge legacy TDM buses with newer packet-processing ASICs, performing custom framing, UTOPIA/LVDS serialization, and clock-domain crossing. The EP20K200BC356-2XV's 277 user I/O and embedded RAM support UTOPIA-2/3, POS-PHY Level 2, and SPI-4.2 bridge functions, while the -2 speed grade supports the 50-77 MHz bus interfaces typical of mid-2000s telecom designs. Long product life cycles in carrier networks keep demand alive.
추천
Industrial Control and Factory Automation
Industrial control systems benefit from the EP20K200BC356-2XV's high I/O count, embedded memory, and 0-85 °C commercial temperature rating. The 277 I/O support multi-axis motor control, parallel ADC interfaces, encoder feedback channels, and fieldbus protocols (Profibus, DeviceNet) implemented in soft logic. The -2 speed grade ensures deterministic timing for closed-loop control loops, while SRAM-based configuration allows in-field firmware updates via JTAG for long-life factory equipment.
추천
Military and Defense Avionics (Legacy)
Defense programs specified APEX-20K devices including the EP20K200BC356-2XV for avionics databuses, radar signal preprocessing, and MIL-STD-1553 bridging. The wide 277-I/O capacity supports parallel MIL-STD-1553 channels, ARINC 429 receivers, and discrete I/O aggregation. Long defense program life cycles (20+ years) sustain demand even after commercial obsolescence. Designers must evaluate SEU sensitivity of the SRAM configuration memory and consider CRC scrubbing for safety-critical applications.
추천
Custom DSP Datapaths (FIR/FFT Filters)
The 106,496 bits of embedded SRAM in the EP20K200BC356-2XV map well to custom DSP datapaths such as FIR filters, FFT engines, and digital correlators. EABs (Embedded Array Blocks) can be configured as RAM/ROM lookup tables for sine/cosine generation or twiddle factors, while the 8320 LEs implement the multiplier-accumulator (MAC) tree. The -2 speed grade sustains 50-80 MHz DSP throughput, sufficient for audio-rate signal processing and moderate-bandwidth radar preprocessing in instrumentation.
추천
Legacy Medical Imaging Systems
Ultrasound and MRI imaging equipment from the early 2000s used APEX-20K FPGAs like the EP20K200BC356-2XV for beamforming, channel aggregation, and image preprocessing. The wide I/O count supports parallel LVDS data acquisition from multi-channel analog front-ends, while the embedded RAM holds line buffers and lookup tables for windowing functions. Long medical device lifecycles and FDA validation constraints keep demand for these obsolete parts active in service and refurbishment markets.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K200BC356-2XV — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K200BC356-2 | EP20K200BC356-1X | EP20K200BC356-1 |
|---|---|---|---|---|
| Brand | Altera | Altera (same) | Altera (same) | Altera (same) |
| Package | 356-LBGA | 356-LBGA (same) | 356-LBGA (same) | 356-LBGA (same) |
| Logic Elements | 8320 | 8320 | 8320 | 8320 |
| Speed Grade | -2 (extended temp) | -2 (standard temp) | -1 (extended temp) | -1 (standard temp) |
| Total RAM Bits | 106496 | 106496 | 106496 | 106496 |
| Number of I/O | 277 | 277 | 277 | 277 |
| Core Voltage | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
주요 차별점
- Extended-temperature -2 speed grade bin (vs EP20K200BC356-2)
- Faster timing closure versus -1X alternative (vs EP20K200BC356-1X)
- Identical pinout enables PCB reuse across speed grades (vs EP20K200BC356-1)
설계 노트
The APEX-20K family requires both VCCINT (core, 2.375V-2.625V) and VCCIO (I/O, 1.8V/2.5V/3.3V selectable) rails. Per the APEX-20K reference designs, place 0.1 µF ceramic decoupling capacitors adjacent to every VCCINT pin and 10 µF bulk capacitors per VCCIO bank. Estimating: with 8320 LEs at typical 20% utilization, ICCINT is approximately 200-400 mA; full utilization approaches 800 mA. Add heat-sinking for high-utilization designs.
The 356-BGA package demands 4-6 layer PCB with controlled-impedance routing for high-speed I/O. Per APEX-20K datasheet pinout supplement, JTAG signals (TCK, TMS, TDI, TDO) and configuration pins (nSTATUS, nCONFIG, CONF_DONE, DCLK) must be routed to test points for in-system programming. Maintain continuous ground planes under the BGA; break-out traces on inner layers with microvias to preserve signal integrity on LVDS/clock nets.
APEX-20K is SRAM-based, so the configuration bitstream is volatile - it must be reloaded on every power-up via a configuration PROM (e.g., EPC2, EPC8) or JTAG. Single-event upsets (SEUs) in SRAM configuration can flip logic in radiation environments - aerospace/defense designs must implement configuration scrubbing. Also note: the -2XV and -2X suffix difference is minor (commercial vs extended commercial), but timing derating differs at temperature extremes.
Estimating: at -2 speed grade, internal LE-to-LE delays are approximately 0.5 ns and MegaLAB interconnect delays are 1.5-3 ns. For 50 MHz operation, the critical path budget is 20 ns - achievable with moderate pipelining. Synchronous design with registered I/O is mandatory; asynchronous paths through global clock networks cause hold-time failures in the APEX-20K architecture. Use Quartus fitter reports to verify timing closure.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free status not provided in the verified distributor data. The APEX-20K family predates widespread RoHS adoption; many original parts are non-RoHS. Verify with the distributor for specific lot compliance. AEC-Q100 is not applicable - this is a commercial-grade FPGA, not automotive-qualified.
