EP4CE115F23C8N - Cyclone IV E FPGA 114K LE 484-BGA | Intel
부품 번호: EP4CE115F23C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $323.39 | $323.39 |
| 10 | $285.5 | $2,855.00 |
| 100 | $220 | $22,000.00 |
| 500 | $175 | $87,500.00 |
| 1,000 | $145 | $145,000.00 |
EP4CE115F23C8N 개요
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O cells can be programmed by the customer after manufacture. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), alongside simpler CPLDs, and above fixed-function ASICs in design flexibility. The Cyclone IV E family targets the mid-density segment, balancing cost, power, and performance for industrial, consumer, and communications designs.
Key features of the EP4CE115F23C8N include 114,480 logic elements arranged in an architecture of adaptive logic modules (ALMs), 432 embedded 18x18 multipliers for DSP-style signal processing, 280 general-purpose I/Os supporting LVDS, LVCMOS, SSTL, and other single-ended and differential standards, and dedicated embedded memory blocks totaling 3.8 Mbits. The device supports up to four general-purpose PLLs for clock management and serialization.
The Cyclone IV E architecture uses a 60 nm low-power process with a 1.2 V core supply, achieving substantially lower static and dynamic power than the previous Cyclone III generation. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes using industry-standard SRAM-based programming cells. The 484-BGA FineLine BGA package offers a 1.0 mm ball pitch, suitable for multilayer PCBs in mid-to-high-complexity designs.
Typical applications for the EP4CE115F23C8N include industrial motor control and machine vision, video processing and display bridges, telecom line cards, automotive driver-assistance pre-processing, and embedded control in test and measurement equipment. The combination of high logic density, embedded multipliers, and rich I/O makes it well-suited for designs that previously required larger or more expensive FPGAs.
When designing with this device, plan power decoupling around each PLL region and use the Quartus II / Quartus Prime toolchain for synthesis, place-and-route, and timing closure. Verify signal-integrity on high-speed LVDS pairs and confirm ball-pattern compatibility against any proposed migration part before PCB respin.
This page synthesizes distributor pricing, package information, drop-in alternatives, and design considerations not found in a single manufacturer datasheet, helping engineers evaluate the EP4CE115F23C8N for new designs or as a replacement candidate in legacy projects.
드롭인 대체품: EP4CE115F23C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE115F23C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Embedded 18x18 Multipliers, Configuration Modes, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CE115F23C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4CE115F23I7N
✅ 드롭인✓ 재고 있음
$87.95 / 개
데이터시트 보기 →EP4CE115F23C8N
✅ 드롭인✓ 재고 있음
$145 / 개
데이터시트 보기 →EP4CE115F23A7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4CE115F23C9N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4CE115F23C8N
✅ 드롭인✓ 재고 있음
$145 / 개
데이터시트 보기 →EP4CE115F23C8N 최대 정격 & 전기적 특성
| Series | Cyclone IV E |
| Logic Elements | 114,480 LE |
| Embedded Memory | 3,981,312 bits (3.8 Mbit) |
| User I/O Count | 280 |
| Embedded 18x18 Multipliers | 432 |
| General-purpose PLLs | 4 |
| Process Node | 60 nm |
| Core Voltage | 1.2 V |
| 패키지 | 484-ball FineLine BGA (F23) |
| Ball Pitch | 1.0 mm |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | C8 |
| RoHS 상태 | Compliant |
EP4CE115F23C8N 484-ball fineline bga (f23) 핀 구성 가이드
EP4CE115F23C8N(484-ball fineline bga (f23) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CE115F23C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CE115F23C8N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing and Display Bridge, Telecom Line Card Interface, Automotive Driver-Assistance Pre-Processing, Test and Measurement Equipment, Embedded Control and Machine Vision.
Industrial Motor Control
The EP4CE115F23C8N suits industrial motor control with 114,480 logic elements for multi-axis FOC algorithms, 432 embedded 18x18 multipliers for Park/Clark transforms, and 280 I/Os for encoder, resolver, and PWM interfaces. At 1.2 V core, it dissipates less than older Cyclone III designs, fitting enclosed IP54 cabinets. Designers should use the Quartus Prime DSP Builder for floating-point motor loops and verify PWM update latency against the speed-grade C8 timing model.
추천
Video Processing and Display Bridge
For HDMI-to-LVDS or MIPI-to-RGB bridges, the EP4CE115F23C8N's 432 embedded multipliers handle real-time color-space conversion (YUV422 to RGB888) at 1080p60 with headroom for scaling. The 3.8 Mbit embedded memory supports line-buffer storage without external SRAM. The 484-BGA F23 package allows routing of 24 LVDS pairs required for dual-channel LVDS displays. Engineers must consider HSIO bank placement for differential pairs during floorplanning.
추천
Telecom Line Card Interface
Telecom line cards benefit from the EP4CE115F23C8N's rich I/O count (280 pins) for multi-port SERDES-less serial interfaces, 4 PLLs for clock synthesis across backplane domains, and 114K logic elements for protocol termination (e.g., custom Ethernet variants). The 60 nm low-power process reduces thermal load in sealed CO enclosures. Designers should reference the Cyclone IV E handbook for HSTL/SSTL I/O standards used in telecom backplanes.
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Automotive Driver-Assistance Pre-Processing
Pre-processing for ADAS sensor fusion benefits from the EP4CE115F23C8N's 432 multipliers for radar FFT preprocessing, 114K logic elements for object-tracking state machines, and 280 I/Os for multi-sensor aggregation. For production automotive, designers should specify the F23A7N variant (AEC-Q100 not applicable to C8 commercial temp). The 484-BGA package supports high-density routing for multi-channel LVDS sensor inputs.
추천
Test and Measurement Equipment
Test instruments use the EP4CE115F23C8N for waveform synthesis, protocol decoding, and DSP filtering. The 432 embedded 18x18 multipliers implement real-time digital filters at multi-MSPS rates, while 3.8 Mbit embedded memory holds sample buffers. The 280 user I/Os route high-speed LVDS ADC/DAC data and trigger logic. Designers should use TimeQuest timing analysis in Quartus Prime to close timing on the C8 speed grade.
추천
Embedded Control and Machine Vision
Machine vision systems use the EP4CE115F23C8N to preprocess image data from CMOS sensors before passing to a host processor. The 432 multipliers accelerate Sobel, Laplacian, and morphology filters, while 114K logic elements implement custom region-of-interest engines. The 484-BGA F23 package provides sufficient I/O for multiple MIPI-CSI or LVDS camera lanes. Designers should consider external DDR memory for frame storage beyond the 3.8 Mbit on-chip memory.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE115F23C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE115F23C7N | EP4CE115F23I7N | EP4CE115F23A7N | EP4CE115F23C9N |
|---|---|---|---|---|---|
| Package | 484-ball FineLine BGA (F23) | 484-ball FineLine BGA (F23) - same | 484-ball FineLine BGA (F23) - same | 484-ball FineLine BGA (F23) - same | 484-ball FineLine BGA (F23) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 114,480 | 114,480 | 114,480 | 114,480 | 114,480 |
| Embedded Memory (bits) | 3,981,312 | 3,981,312 | 3,981,312 | 3,981,312 | 3,981,312 |
| User I/O | 280 | 280 | 280 | 280 | 280 |
| Embedded 18x18 Multipliers | 432 | 432 | 432 | 432 | 432 |
| Speed Grade | C8 (commercial) | C7 (faster, premium) | I7 (industrial) | A7 (automotive) | C9 (slower, lower cost) |
| Operating Temperature | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +125C | 0C to +85C |
| Pin Compatibility | Reference | Yes (drop-in) | Yes (drop-in) | Yes (drop-in) | Yes (drop-in) |
주요 차별점
- Highest logic density in Cyclone IV E family (vs EP4CE40F23C8N)
- Industrial temperature variant available in same package (vs EP4CE115F29I7N)
- Commercial temperature and C8 speed grade for cost-sensitive designs (vs EP4CE115F23C7N)
설계 노트
The 484-ball FineLine BGA package with 1.0 mm pitch requires at least a 6-layer PCB with microvia (HDI) construction or via-in-pad for reliable assembly. Plan escape routing in groups of 2-3 signals per row to avoid crossing power/ground planes. Use the Cyclone IV E device handbook ball map and your PCB CAD library to verify ball assignment against the bank I/O plan before fabrication. Decoupling: place 0.1uF X7R capacitors under the package within 5 mm of each power ball group.
The EP4CE115F23C8N requires a 1.2 V core supply (VCCINT), a 2.5 V or 3.3 V auxiliary supply (VCCAUX), and per-bank I/O supplies (VCCIO). Estimate worst-case core current at approximately 1.5-2.0 A under full DSP utilization; derate the regulator by at least 25% for margin. Power sequencing requires VCCINT to ramp before VCCAUX, with a maximum delta of 200 mV during ramp to prevent latch-up - use a sequencer IC if your regulator lacks built-in tracking.
Common pitfalls include: (1) forgetting that configuration mode (PS vs FPP vs JTAG) is selected by MSEL pins - wire them correctly to avoid bricking during programming; (2) underestimating the JTAG chain length when using both a USB-Blaster and a microcontroller debugger on the same TCK/TMS; (3) neglecting to enable the CRC error check during configuration in safety-critical designs; (4) ignoring the need for an external configuration device (e.g., EPCS) when using passive serial mode. Review the Cyclone IV E handbook configuration chapter before board bring-up.
규정 준수 정보
RoHS and REACH compliant per Altera/Intel product page. C8 commercial temperature grade; not AEC-Q100 - choose A7N variant for automotive. Lead-free BGA balls; halogen-free per JEDEC JS709.