EP20K300EFC672-2X - APEX 20KE FPGA 300K Gates 672-BGA | Intel
부품 번호: EP20K300EFC672-2X ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $119 | $11,900.00 |
| 500 | $108.75 | $54,375.00 |
| 1,000 | $99.5 | $99,500.00 |
EP20K300EFC672-2X 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can program post-manufacturing to implement arbitrary digital logic. FPGAs occupy a unique position in the digital design hierarchy: above fixed-function ASICs in flexibility, below microprocessors in software programmability, and at the apex (literally) of parallel, deterministic, hardware-timed logic implementation. The APEX 20KE family pioneered System-on-a-Programmable-Chip (SOPC) integration, combining logic, memory, and dedicated I/O on a single die.
Key features of the EP20K300EFC672-2X include 4 PLLs for clock management, support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS, in-system programmability via IEEE 1149.1 JTAG, and true dual-port RAM capability within its ESB blocks. The device operates across the commercial 0 °C to 85 °C temperature range and supports the -2 speed grade, indicating a moderate performance tier within the APEX 20KE family. Its MultiCore architecture combines fine-grained LUT logic with coarse-grained ESB blocks optimized for memory-intensive operations.
Typical applications include telecommunications infrastructure (ATM switches, SONET/SDH framer interfaces), high-speed data acquisition systems, DSP co-processing engines, and complex glue logic replacement in multi-board designs. The 672-pin FBGA package (also denoted F672) provides ample I/O for memory-bus interfacing and parallel data-path implementations, making it suitable for designs that previously required multiple CPLDs or mid-density FPGAs.
드롭인 대체품: EP20K300EFC672-2X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K300EFC672-2X (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Process Technology, Family, Package, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K300EFC672-2N
✅ 드롭인✓ 재고 있음
$59.2 / 개
데이터시트 보기 →EP20K300EFC672-2
✅ 드롭인✓ 재고 있음
$58.5 / 개
데이터시트 보기 →EP20K300EFC672-2XA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K300EFC672-1N
✅ 드롭인✓ 재고 있음
$250 / 개
데이터시트 보기 →EP20K300EBC652-2X
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →EP20K300EFC672-2X 최대 정격 & 전기적 특성
| Family | APEX 20KE |
| Logic Elements | 11,520 |
| System Gates | 300,000 |
| Embedded Memory Bits | 147,456 bits |
| Maximum User I/O | 408 |
| 패키지 | 672-pin FBGA (Fine-pitch BGA) |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V |
| Maximum Internal Frequency | 350 MHz |
| Propagation Delay | 1.68 ns |
| Speed Grade | -2 |
| PLLs | 4 |
| 동작 온도 | 0 °C to +85 °C (Commercial) |
| Architecture | MultiCore (LUT + Embedded System Blocks) |
| JTAG Support | Yes (IEEE 1149.1) |
EP20K300EFC672-2X 672-pin fbga (fine-pitch bga) 핀 구성 가이드
EP20K300EFC672-2X(672-pin fbga (fine-pitch bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K300EFC672-2X.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K300EFC672-2X 적합 용도: 6 애플리케이션s: Telecommunications Infrastructure, High-Speed Data Acquisition, DSP Co-Processing Engine, Industrial Control and Glue Logic Replacement, Networking Equipment (Routers/Switches), Legacy Avionics and Military Systems.
Telecommunications Infrastructure
The EP20K300EFC672-2X is well suited for telecommunications infrastructure applications such as ATM switches, SONET/SDH framers, and protocol converters. Its 300K system gates and 147 Kbits of embedded memory enable designers to implement deep FIFOs and lookup tables required for cell buffering and route lookup, while 408 user I/Os support wide parallel backplane interfaces. The four on-chip PLLs allow flexible clock synthesis for multi-rate telecom interfaces, and the 1.68 ns propagation delay meets the timing budget for 622 MHz POS-PHY connections. APEX 20KE devices were widely deployed in 1999-2005-era telecom gear, making this part common in legacy base-station and central-office sustainment programs.
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High-Speed Data Acquisition
For high-speed data acquisition systems the EP20K300EFC672-2X provides the logic density and I/O count needed to interface parallel ADC/DAC banks, manage DMA channels, and implement real-time pre-processing filters. The 408 user I/Os comfortably accommodate 16-bit parallel ADC interfaces with margin for control and status signals, while the 11,520 logic elements can implement FIR filter chains, FFT engines, or DDC stages at sample rates up to 100 MSPS. The four PLLs and FastTrack interconnect keep clock-domain crossing clean. The 672-pin FBGA package allows dense PCB layouts with controlled-impedance routing, which is critical for preserving analog signal integrity when the FPGA sits next to sensitive front-end analog circuitry.
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DSP Co-Processing Engine
The EP20K300EFC672-2X serves as a DSP co-processor that offloads compute-intensive kernels such as FFT, Viterbi decoding, or convolution from a host processor. Its embedded memory bits (147,456) are organized into ESB blocks that can be configured as true dual-port RAM, enabling parallel coefficient and data storage for systolic filter arrays. The 350 MHz maximum internal frequency combined with 1.68 ns propagation delay supports pipelined multiply-accumulate structures that deliver hundreds of MMACs. In radio-baseband applications, this part was historically used alongside DSP chips such as the TI TMS320C6x family to handle baseband demodulation and channel coding functions.
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Industrial Control and Glue Logic Replacement
The EP20K300EFC672-2X is an effective consolidator for industrial control systems where multiple CPLDs and discrete glue-logic ICs previously cluttered the board. By absorbing address decoding, bus arbitration, interrupt prioritization, and timing generation into a single 672-pin FBGA device, designers can reduce board area, improve reliability, and lower BOM cost. The 408 user I/Os support multi-bus architectures such as PCI, VME, or ISA bridges common in factory automation. Combined with its commercial temperature rating and JTAG-supported in-system programmability, this FPGA accelerated time-to-market for industrial OEMs building PLCs, motor controllers, and process automation platforms during the early 2000s.
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Networking Equipment (Routers/Switches)
Within router and switch line-card designs, the EP20K300EFC672-2X provided the high I/O count and logic density needed to implement packet classification engines, traffic-shaping schedulers, and cell/frame delineation logic. The 408 user I/Os accommodate multiple SPI-4 or POS-PHY interfaces feeding an integrated switch fabric, while the 11,520 logic elements support TCAM-emulation or hash-based lookup tables that classify flows at wire speed. The device's 1.8 V core supply aligns with low-power line-card architectures, and its support for LVTTL/LVCMOS/SSTL I/O standards simplifies interfacing with PHY and switch-fabric companion chips. Legacy line cards sustaining OC-48 and Gigabit Ethernet links frequently rely on this exact part.
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Legacy Avionics and Military Systems
The military-temperature EP20K300EFC672-2XA variant (note the 'A' suffix) is qualified for harsh-environment avionics and defense applications where extended temperature operation and screening are required. Even the standard -2X commercial variant saw use in development and pre-production military prototypes that benefit from APEX 20KE's deterministic timing and parallel processing for sensor-fusion, radar preprocessing, and secure-communication front-ends. The 672-pin FBGA package's mechanical robustness suits vibration-intensive platforms. For deployed military systems, designers should explicitly source the -2XA variant from approved QML-V or equivalent supply chains to ensure compliance with aerospace qualification requirements.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K300EFC672-2X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K300EFC672-2N | EP20K300EFC672-2 | EP20K300EFC672-2XA | EP20K300EFC672-1N | EP20K300EBC652-2X |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin FBGA | 672-pin FBGA - same | 672-pin FBGA - same | 672-pin FBGA - same | 672-pin FBGA - same | 672-pin FBGA - same family |
| Logic Elements | 11,520 | 11,520 | 11,520 | 11,520 | 11,520 | 11,520 |
| System Gates | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 |
| Embedded Memory (bits) | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 |
| Speed Grade | -2 | -2 | -2 | -2 | -1 (slower) | -2 |
| Operating Temperature | 0 to 85 C (Commercial) | -40 to 100 C (Industrial) | 0 to 85 C (Commercial) | Extended/Military | -40 to 100 C (Industrial) | 0 to 85 C (Commercial) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
주요 차별점
- Industrial-temperature support for harsh environments (vs EP20K300EFC672-2 (commercial-temperature baseline))
- Higher speed grade for tight timing budgets (vs EP20K300EFC672-1N (-1 speed grade))
- Military-grade screening option (vs EP20K300EFC672-2 (commercial))
- True drop-in pin compatibility across speed grades (vs EP20K300EBC652-2X (different BGA family))
설계 노트
The 672-pin FBGA package of the EP20K300EFC672-2X has a relatively high thermal resistance (theta_JA typically ~12-15 C/W on a standard JEDEC test board) due to its fine-pitch BGA construction and limited exposed die area. For designs operating near full 300 MHz internal frequency with high toggle rates, ensure the PCB thermal design includes at least 4 thermal vias under the package center and a copper pour on inner layers. Although the commercial 0-85 C range is wide, the APEX 20KE family was built on a 0.22 µm process that can dissipate 1.5-2.5 W under typical workloads; inadequate thermal relief will trigger junction-temperature derating and reduce long-term reliability.
BGA fanout for the 672-pin FBGA should follow Altera's recommended 4-layer or 6-layer stackup with microvia or via-in-pad construction for the inner rows of balls. Trace widths of 0.1 mm (4 mil) with matched impedance (50 ohm single-ended, 100 ohm differential) are typical. Maintain at least 0.4 mm clearance between BGA pads and adjacent vias, and provide a continuous ground plane beneath the device to control return-path impedance for high-speed I/O such as LVDS. Decoupling requires 0.1 µF X7R capacitors within 2 mm of each power-ball cluster plus a single 10 µF tantalum bulk capacitor near the package.
Three pitfalls to avoid when working with the EP20K300EFC672-2X: (1) The 1.8 V core supply must ramp monotonically; use a power-supply sequencer if your system also drives 3.3 V or 2.5 V I/O rails to prevent latch-up. (2) Do not confuse the 672-pin FBGA (EFC672) with the 652-pin BGA (EBC652) — the package pinout differs and the parts are not drop-in compatible. (3) Quartus II versions older than 9.0sp2 are required for APEX 20KE support; modern Quartus Prime releases do not include this legacy device family, so preserve your legacy toolchain for ongoing bitstream generation.
LVDS I/O on the EP20K300EFC672-2X requires 100 ohm differential termination at the receiver end; do not place the termination resistor more than 7 mm from the receiver pin to avoid reflections. SSTL-2 I/O used for DDR-style memory interfaces requires external VTT termination at the memory module. The four PLLs each have dedicated power pins (VCCA_PLL) that must be filtered with a pi-network (ferrite bead + 0.1 µF + 10 µF) to prevent jitter coupling into the global clock network. Keep PLL analog supply traces short and shielded by ground pour on both adjacent layers.
규정 준수 정보
APEX 20KE devices predate many modern compliance regimes. RoHS and REACH status was not documented in the provided web data; verify with Intel (Altera) legacy product documentation or distributor compliance statements before using in jurisdictions requiring RoHS compliance.
