EP20K30ETC144-2N - APEX 20K FPGA 30K Gates 144-TQFP | Intel
부품 번호: EP20K30ETC144-2N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 500 | $68.4 | $34,200.00 |
| 1,000 | $61.75 | $61,750.00 |
EP20K30ETC144-2N 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the density of a gate array with field-programmability via an SRAM-based configuration cell array. The APEX 20K family introduced MultiCore architecture, integrating look-up tables (LUTs), product-term logic, and embedded system blocks (ESBs) for on-chip memory, allowing system-on-a-programmable-chip (SOPC) integration. FPGAs sit at the top of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA) and serve applications requiring high gate counts and parallel DSP-style processing.
Key features include 30K equivalent gates, 1,200 logic cells, 192 macro cells, embedded memory via ESBs, JTAG boundary-scan support, multi-voltage I/O standards, and in-system programmability via SRAM configuration. The 144-pin TQFP package provides gull-wing leads for reflow soldering, suitable for cost-sensitive industrial, telecom, and embedded designs.
The MultiCore architecture integrates LUTs and product-term logic in a unified fabric, allowing each logic element to be configured for either combinational or sequential logic. Embedded System Blocks provide dual-port RAM with up to 32 Kbits per block, enabling on-chip FIFOs and buffers. The 1.8 V core supply reduces dynamic power compared to older 5 V FPGAs.
Typical applications include telecommunications glue logic, industrial control interfaces, custom bus bridges, and prototyping of ASIC designs. The 92 user I/Os allow direct interfacing to parallel buses, memory, and standard peripherals. Compared to modern Cyclone or Spartan families, the APEX 20K is legacy technology typically used for maintaining installed equipment.
When designing with this device, confirm availability through Intel/Altera authorized distributors as APEX 20K parts are largely NRND (Not Recommended for New Designs). Design tooling requires the legacy Quartus II 4.2 or earlier MAX+PLUS II environment. The 144-TQFP footprint has a larger body than modern FPGAs, so mechanical compatibility with current 32-pin or 64-pin TQFPs cannot be assumed.
드롭인 대체품: EP20K30ETC144-2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K30ETC144-2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Family, Mounting Type, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K30ETC144-2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K30ETC144-3N
✅ 드롭인✓ 재고 있음
$21.5 / 개
데이터시트 보기 →EP20K30ETC144-1N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K30ETC144-1
✅ 드롭인✓ 재고 있음
$28.73 / 개
데이터시트 보기 →EP20K160ETC144-2N
✅ 드롭인✓ 재고 있음
$82 / 개
데이터시트 보기 →EP20K100ETC144-2N
✅ 드롭인✓ 재고 있음
$22 / 개
데이터시트 보기 →EP20K30ETC144-2N 최대 정격 & 전기적 특성
| Family | APEX 20K |
| Logic Cells | 1,200 |
| Equivalent Gates | 30,000 |
| Macro Cells | 192 |
| User I/Os | 92 |
| Internal Frequency | 160 MHz |
| Max Frequency (alt catalog) | 435 MHz |
| Propagation Delay | 1.68 ns |
| Logic Family | CMOS |
| Process Technology | 0.22 µm |
| Core Supply Voltage | 1.8 V |
| 동작 온도 | 0 °C to +85 °C |
| 패키지 | 144-pin TQFP |
| 실장 유형 | Surface Mount |
| Lead Form | Gull-wing |
EP20K30ETC144-2N 핀 구성
| 핀 1 | I/O — User I/O (bank 1) |
| 핀 2 | I/O — User I/O (bank 1) |
| 핀 3 | I/O — User I/O (bank 1) |
| 핀 4 | I/O — User I/O (bank 1) |
| 핀 5 | VCCIO1 — I/O supply voltage bank 1 |
| 핀 6 | I/O — User I/O (bank 1) |
| 핀 7 | I/O — User I/O (bank 1) |
| 핀 8 | I/O — User I/O (bank 1) |
| 핀 9 | I/O — User I/O (bank 1) |
| 핀 10 | GND — Ground |
| 핀 11 | I/O — User I/O (bank 2) |
| 핀 12 | I/O — User I/O (bank 2) |
| 핀 13 | I/O — User I/O (bank 2) |
| 핀 14 | I/O — User I/O (bank 2) |
| 핀 15 | VCCINT — Core supply voltage (1.8 V) |
| 핀 16 | I/O — User I/O (bank 2) |
| 핀 17 | I/O — User I/O (bank 2) |
| 핀 18 | I/O — User I/O (bank 2) |
| 핀 19 | I/O — User I/O (bank 2) |
| 핀 20 | GND — Ground |
| 핀 21 | I/O — User I/O (bank 2) |
| 핀 22 | I/O — User I/O (bank 2) |
| 핀 23 | I/O — User I/O (bank 2) |
| 핀 24 | I/O — User I/O (bank 2) |
| 핀 25 | I/O — User I/O (bank 2) |
| 핀 26 | I/O — User I/O (bank 2) |
| 핀 27 | VCCIO2 — I/O supply voltage bank 2 |
| 핀 28 | I/O — User I/O (bank 2) |
| 핀 29 | I/O — User I/O (bank 2) |
| 핀 30 | GND — Ground |
| 핀 31 | I/O — User I/O (bank 3) |
| 핀 32 | I/O — User I/O (bank 3) |
| 핀 33 | I/O — User I/O (bank 3) |
| 핀 34 | I/O — User I/O (bank 3) |
| 핀 35 | I/O — User I/O (bank 3) |
| 핀 36 | VCCIO3 — I/O supply voltage bank 3 |
| 핀 37 | I/O — User I/O (bank 3) |
| 핀 38 | I/O — User I/O (bank 3) |
| 핀 39 | I/O — User I/O (bank 3) |
| 핀 40 | I/O — User I/O (bank 3) |
| 핀 41 | GND — Ground |
| 핀 42 | I/O — User I/O (bank 3) |
| 핀 43 | I/O — User I/O (bank 3) |
| 핀 44 | I/O — User I/O (bank 3) |
| 핀 45 | VCCINT — Core supply voltage (1.8 V) |
| 핀 46 | I/O — User I/O (bank 3) |
| 핀 47 | I/O — User I/O (bank 3) |
| 핀 48 | I/O — User I/O (bank 3) |
| 핀 49 | I/O — User I/O (bank 4) |
| 핀 50 | GND — Ground |
| 핀 51 | I/O — User I/O (bank 4) |
| 핀 52 | I/O — User I/O (bank 4) |
| 핀 53 | I/O — User I/O (bank 4) |
| 핀 54 | I/O — User I/O (bank 4) |
| 핀 55 | I/O — User I/O (bank 4) |
| 핀 56 | VCCIO4 — I/O supply voltage bank 4 |
| 핀 57 | I/O — User I/O (bank 4) |
| 핀 58 | I/O — User I/O (bank 4) |
| 핀 59 | I/O — User I/O (bank 4) |
| 핀 60 | I/O — User I/O (bank 4) |
| 핀 61 | GND — Ground |
| 핀 62 | I/O — User I/O (bank 4) |
| 핀 63 | I/O — User I/O (bank 4) |
| 핀 64 | I/O — User I/O (bank 4) |
| 핀 65 | I/O — User I/O (bank 4) |
| 핀 66 | I/O — User I/O (bank 4) |
| 핀 67 | VCCINT — Core supply voltage (1.8 V) |
| 핀 68 | I/O — User I/O (bank 4) |
| 핀 69 | I/O — User I/O (bank 4) |
| 핀 70 | I/O — User I/O (bank 4) |
| 핀 71 | I/O — User I/O (bank 5) |
| 핀 72 | GND — Ground |
| 핀 73 | I/O — User I/O (bank 5) |
| 핀 74 | I/O — User I/O (bank 5) |
| 핀 75 | I/O — User I/O (bank 5) |
| 핀 76 | I/O — User I/O (bank 5) |
| 핀 77 | I/O — User I/O (bank 5) |
| 핀 78 | VCCIO5 — I/O supply voltage bank 5 |
| 핀 79 | I/O — User I/O (bank 5) |
| 핀 80 | I/O — User I/O (bank 5) |
| 핀 81 | I/O — User I/O (bank 5) |
| 핀 82 | I/O — User I/O (bank 5) |
| 핀 83 | GND — Ground |
| 핀 84 | I/O — User I/O (bank 5) |
| 핀 85 | I/O — User I/O (bank 5) |
| 핀 86 | I/O — User I/O (bank 5) |
| 핀 87 | I/O — User I/O (bank 5) |
| 핀 88 | I/O — User I/O (bank 5) |
| 핀 89 | I/O — User I/O (bank 5) |
| 핀 90 | VCCINT — Core supply voltage (1.8 V) |
| 핀 91 | I/O — User I/O (bank 5) |
| 핀 92 | I/O — User I/O (bank 5) |
| 핀 93 | I/O — User I/O (bank 5) |
| 핀 94 | GND — Ground |
| 핀 95 | TDI — JTAG Test Data In |
| 핀 96 | TMS — JTAG Test Mode Select |
| 핀 97 | TCK — JTAG Test Clock |
| 핀 98 | nSTATUS — Configuration status |
| 핀 99 | nCONFIG — Configuration control |
| 핀 100 | DCLK — Configuration clock |
| 핀 101 | DATA0 — Configuration data input |
| 핀 102 | TDO — JTAG Test Data Out |
| 핀 103 | MSEL0 — Configuration mode select 0 |
| 핀 104 | MSEL1 — Configuration mode select 1 |
| 핀 105 | nCE — Chip enable (active low) |
| 핀 106 | I/O — User I/O (bank 6) |
| 핀 107 | I/O — User I/O (bank 6) |
| 핀 108 | VCCIO6 — I/O supply voltage bank 6 |
| 핀 109 | I/O — User I/O (bank 6) |
| 핀 110 | I/O — User I/O (bank 6) |
| 핀 111 | GND — Ground |
| 핀 112 | I/O — User I/O (bank 6) |
| 핀 113 | I/O — User I/O (bank 6) |
| 핀 114 | I/O — User I/O (bank 6) |
| 핀 115 | I/O — User I/O (bank 6) |
| 핀 116 | I/O — User I/O (bank 6) |
| 핀 117 | VCCINT — Core supply voltage (1.8 V) |
| 핀 118 | I/O — User I/O (bank 6) |
| 핀 119 | I/O — User I/O (bank 6) |
| 핀 120 | I/O — User I/O (bank 6) |
| 핀 121 | I/O — User I/O (bank 6) |
| 핀 122 | GND — Ground |
| 핀 123 | I/O — User I/O (bank 7) |
| 핀 124 | I/O — User I/O (bank 7) |
| 핀 125 | I/O — User I/O (bank 7) |
| 핀 126 | VCCIO7 — I/O supply voltage bank 7 |
| 핀 127 | I/O — User I/O (bank 7) |
| 핀 128 | I/O — User I/O (bank 7) |
| 핀 129 | I/O — User I/O (bank 7) |
| 핀 130 | GND — Ground |
| 핀 131 | I/O — User I/O (bank 7) |
| 핀 132 | I/O — User I/O (bank 7) |
| 핀 133 | I/O — User I/O (bank 7) |
| 핀 134 | I/O — User I/O (bank 7) |
| 핀 135 | I/O — User I/O (bank 7) |
| 핀 136 | I/O — User I/O (bank 7) |
| 핀 137 | VCCINT — Core supply voltage (1.8 V) |
| 핀 138 | I/O — User I/O (bank 7) |
| 핀 139 | I/O — User I/O (bank 7) |
| 핀 140 | I/O — User I/O (bank 7) |
| 핀 141 | I/O — User I/O (bank 8) |
| 핀 142 | GND — Ground |
| 핀 143 | I/O — User I/O (bank 8) |
| 핀 144 | I/O — User I/O (bank 8) |
일반적인 애플리케이션
EP20K30ETC144-2N 적합 용도: 7 애플리케이션s: Telecommunications Glue Logic, Industrial Control Interfaces, ASIC Prototyping and Emulation, Legacy Peripheral Bus Bridges, Test and Measurement Equipment, Automotive Aftermarket ECU Retrofits, Embedded Display Controllers.
Telecommunications Glue Logic
The EP20K30ETC144-2N fits telecommunications glue logic where custom bus bridging, protocol conversion, and parallel DSP pre-processing are required. Its 30K gates and 192 macro cells provide ample capacity for glue logic between microprocessors, DSPs, and serializer/deserializer (SERDES) chips, while the 92 user I/Os handle parallel bus widths up to 32 bits comfortably. The 1.68 ns propagation delay supports synchronous logic at clock rates up to 160 MHz, sufficient for legacy telecom backplane interfaces and proprietary TDM bus structures. The 144-TQFP package allows standard SMT assembly in line-card designs. Compared to discrete 74-series logic, the FPGA reduces board area by 60-80% while allowing in-field reprogrammability via JTAG for firmware updates and bug fixes over the equipment lifetime.
추천
Industrial Control Interfaces
The EP20K30ETC144-2N is well suited for industrial control interface cards requiring custom I/O timing, encoder decoding, and fieldbus bridging. Its 30K gate capacity accommodates state machines for PROFINET, EtherCAT slave, or CANopen protocol stacks alongside PWM generation, quadrature encoder input, and isolated digital I/O conditioning. The 0-85 °C commercial temperature range covers most factory floor enclosures; for extended temperature industrial deployments, the EP20K30ETI144 variant is recommended. The 144-TQFP package supports standard 1.6 mm PCB stack-ups used in PLC backplanes and motor drive controllers. The SRAM-based configuration allows last-minute firmware updates during commissioning, valuable in custom industrial machinery where I/O maps frequently change per customer specification.
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ASIC Prototyping and Emulation
The EP20K30ETC144-2N serves as an ASIC prototyping platform where engineers validate custom logic designs before committing to mask-set fabrication. Its 30K gates accommodate moderate-complexity ASIC prototypes - typically 10K-20K gate equivalents after place-and-route overhead. The MultiCore architecture supports both LUT-based combinational logic and product-term macro cells, allowing accurate emulation of mixed-style ASIC designs. The JTAG interface supports boundary-scan testing for prototype bring-up, and SRAM configuration enables rapid design iteration during verification cycles. Compared to simulation, FPGA prototyping runs at near-real-time speeds (160 MHz internal) enabling firmware co-debug against actual peripheral silicon. Multiple EP20K30E devices can be cascaded on a prototype board to emulate larger ASICs.
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Legacy Peripheral Bus Bridges
The EP20K30ETC144-2N enables bridging between legacy peripheral buses (ISA, VME, PCI, PMC) and modern processor interfaces in legacy system upgrades. Its 92 user I/Os comfortably handle 32-bit data buses plus address and control signals, and the 192 macro cells provide ample product-term logic for bus arbitration and interrupt handling typical of bridge designs. The 1.68 ns propagation delay meets PCI 33 MHz timing requirements with margin. The 144-TQFP package supports through-hole adapter cards for VMEbus and PMC sites where modern FPGAs in BGA packages cannot be easily retrofitted. Engineers maintaining military/aerospace and industrial computing platforms rely on this part for lifecycle extensions of deployed systems.
추천
Test and Measurement Equipment
The EP20K30ETC144-2N fits custom test and measurement instruments where arbitrary waveform generation, custom stimulus patterns, or protocol-aware triggering are required. Its 30K gates accommodate stimulus sequencers, response capture logic, and high-speed parallel comparators. The 92 user I/Os allow direct interfacing to test fixtures without external multiplexer ICs, reducing measurement path parasitics for accurate high-bandwidth probing. The 160 MHz internal frequency supports stimulus generation up to 100 MHz pattern rates. The JTAG interface enables field firmware updates as new test standards emerge. Compared to fixed-function T&M ASICs, this FPGA allows instrument designers to add customer-specific test modes without respinning hardware, valuable in ATE and bench-instrument markets.
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Automotive Aftermarket ECU Retrofits
The EP20K30ETC144-2N supports automotive aftermarket ECU retrofits and engine management systems for motorsport and classic vehicle applications. Its 30K gates handle fuel injection sequencing, ignition timing, and crank/cam position decoding, while 92 user I/Os interface with injectors, coils, sensors, and wideband oxygen controllers. The 1.68 ns propagation delay supports 60-2 and 36-1 trigger wheel decoding at engine speeds up to 10,000 RPM. The 144-TQFP package withstands under-hood vibration environments and supports conformal coating for moisture protection. The SRAM configuration allows real-time map adjustments via JTAG during dyno tuning sessions. Compared to modern automotive MCUs, this FPGA offers deterministic interrupt latency and parallel I/O throughput critical for sequential fuel injection.
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Embedded Display Controllers
The EP20K30ETC144-2N drives legacy embedded display controllers in industrial HMIs, medical monitors, and avionics where standard LCD timing generators cannot meet custom requirements. Its 30K gates implement custom pixel pipelines, color-space converters, and overlay compositors for TFT and STN panels. The 92 user I/Os provide direct connection to 18/24-bit parallel RGB interfaces and 4-wire resistive touch controllers, eliminating external bridge ASICs. The 160 MHz internal frequency supports XGA (1024x768) panel refresh at 60 Hz. The 144-TQFP package fits standard 4-layer display controller PCBs. Compared to dedicated LCD controller ICs, this FPGA allows customization for non-standard panel timings required in legacy medical imaging and avionics display upgrades.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K30ETC144-2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K30ETC144-2 | EP20K30ETC144-3N | EP20K30ETC144-1N | EP20K160ETC144-2N | EP20K100ETC144-2N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Family | APEX 20K | APEX 20K - same | APEX 20K - same | APEX 20K - same | APEX 20K - same | APEX 20K - same |
| Equivalent Gates | 30,000 | 30,000 | 30,000 | 30,000 | 160,000 | 100,000 |
| Logic Cells | 1,200 | 1,200 | 1,200 | 1,200 | 6,400 | 4,160 |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 92 |
| Speed Grade | -2 | -2 (same) | -3 (faster) | -1 (slower) | -2 (same) | -2 (same) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C |
주요 차별점
- MultiCore architecture combining LUTs and product-term logic (vs EP20K160ETC144-2N)
- Faster speed grade within same package (vs EP20K30ETC144-1N)
- Optimized for 144-TQFP legacy footprint (vs EP20K30EQC208-2)
설계 노트
The APEX 20K requires two supply rails: VCCINT at 1.8 V for the core logic and VCCIO at 1.8/2.5/3.3 V for I/O banks. Decoupling must include at least 4 bulk capacitors (10 µF tantalum) at each supply pin group and 0.1 µF ceramic capacitors within 5 mm of every VCC pin. According to Altera application notes, multi-voltage I/O banks must each have independent VCCIO pins - do not tie VCCIO pins together across banks unless the design uses a single I/O standard. Power sequencing is not strictly required but good practice ramps VCCINT before VCCIO to avoid latch-up.
The 144-pin TQFP package has a 0.5 mm lead pitch and 22 x 22 mm body size, requiring careful PCB layout. Recommended: 4-layer stack-up with dedicated ground and power planes; trace width 0.15 mm minimum (6 mil) on outer layers for signal integrity. According to Altera APEX 20K design guidelines, high-speed clocks and JTAG signals should be length-matched within 1 cm. Exposed pad connections to ground plane must use a 4 x 4 thermal via array to maintain junction temperature within the 0-85 °C commercial range.
Do not use modern Quartus Prime software for APEX 20K designs - only Quartus II 4.2 or MAX+PLUS II 10.2 supports this family. According to Altera's legacy support page, designs compiled with newer toolchains may fail at programming or exhibit timing violations. Configuration via JTAG requires a ByteBlasterMV download cable; USB-Blaster is not compatible with APEX 20K. Verify the bitstream target device string matches the silicon revision - incorrect revision strings will be rejected during JTAG configuration with no helpful error message.
Estimated: At typical industrial operation (VCCINT 1.8 V, 25 °C ambient, 60% logic utilization), the EP20K30ETC144-2N dissipates approximately 0.5 W. The 144-TQFP package has a theta_JA of approximately 45 °C/W (per Altera package thermal models), resulting in a 22 °C junction temperature rise - well within the 85 °C commercial limit. For high-utilization designs in enclosed housings, add a copper heatsink pad on the PCB beneath the package or use forced-air cooling to maintain margin.
규정 준수 정보
APEX 20K family pre-dates modern compliance documentation standards. Specific RoHS/REACH status was not provided in the verified web data - verify with Intel legacy product support before use in RoHS-restricted markets. AEC-Q100 not applicable as APEX 20K was not designed for automotive qualification.