EPF10K30ATI144-1 - FLEX 10KA FPGA 30K Gates 144-TQFP | Intel
부품 번호: EPF10K30ATI144-1 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.85 | $2,985.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $23.95 | $23,950.00 |
EPF10K30ATI144-1 개요
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits after PCB fabrication. The FLEX 10KA family belongs to the broader category hierarchy of FPGA -> programmable logic device -> digital IC -> semiconductor, and was the industry-first embedded programmable logic family to provide System-on-a-Programmable-Chip (SOPC) integration through its dedicated embedded array blocks (EABs). This combination of logic and embedded memory enabled designers to build complete subsystems including controllers, datapaths, and small microprocessors on a single programmable die.
Key features of the EPF10K30ATI144-1 include 1,728 logic cells, 216 LABs, 12 Kbit embedded array memory, 102 user I/Os, and 4 dedicated inputs, all supplied through a 3.3 V single-rail interface. The device is housed in a 144-pin TQFP surface-mount package suitable for standard reflow assembly. The -1 speed grade offers the slowest timing in the FLEX 10KA lineup but provides the lowest cost point, making it attractive for prototyping, education, and legacy production designs where maximum clock rate is non-critical.
Architecturally, the FLEX 10KA combines a fine-grained logic fabric with coarse-grained embedded array blocks, allowing designers to trade off random logic density against memory/RAM capacity on a per-design basis. Each LAB contains eight logic elements, each with a 4-input look-up table, a programmable flip-flop, and dedicated carry and cascade chains for high-speed arithmetic and wide fan-in functions. The embedded array blocks provide true dual-port RAM, ROM, and FIFO primitives up to 2 Kbit per block with parity support, removing the need for external SRAM in many glue-logic applications.
Typical applications include industrial control and factory automation, telecommunications glue logic, legacy peripheral controllers, ASIC prototyping, low-volume production bridges, and educational FPGA platforms. Designers migrating from discrete 74-series TTL or PAL/GAL devices frequently chose the EPF10K30A family because it consolidated dozens of small logic functions onto a single re-programmable part. In production the device supports in-system programmability through the IEEE 1149.1 JTAG interface and is configured at power-up from a serial PROM such as the EPC2 or EPC8 configuration device.
When designing with this FPGA, allocate sufficient printed-circuit-board area for the configuration PROM and the JTAG header. The 144-pin TQFP has a 0.5 mm pitch and requires careful fan-out; route all global clock and high-fanout signals on inner PCB layers with controlled impedance. For signal integrity, keep clock traces short and isolated, and provide 0.1 uF decoupling on every VCCIO/VCCINT pin pair. Designers must also respect the device's in-rush current during configuration and ensure the 3.3 V rail ramps within the datasheet-specified 100 us window.
This page synthesizes distributor availability, parametric specifications, drop-in compatible parts from the same FLEX 10KA family, and practical design notes for the EPF10K30ATI144-1, providing information beyond a single manufacturer datasheet.
드롭인 대체품: EPF10K30ATI144-1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K30ATI144-1 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Family, Propagation Delay.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K30ATI144-2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$21.95 / 개
데이터시트 보기 →EPF10K30ATI144-3
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EPF10K30ATC144-1N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$16.5 / 개
데이터시트 보기 →EPF10K30ATC144-2N
✅ 드롭인✓ 재고 있음
$33.4 / 개
데이터시트 보기 →EPF10K30ATC144-3
✅ 드롭인✓ 재고 있음
$17.8 / 개
데이터시트 보기 →EPF10K30ATC144-1N
✅ 드롭인✓ 재고 있음
$16.5 / 개
데이터시트 보기 →EPF10K30ATI144-1 최대 정격 & 전기적 특성
| Family | FLEX 10KA |
| Series | EPF10K30A |
| Typical Gate Count | 30,000 gates |
| Logic Elements | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory | 12,288 bits |
| User I/O Pins | 102 |
| Dedicated Inputs | 4 |
| 공급 전압 | 3.0 V to 3.6 V (nominal 3.3 V) |
| Technology | CMOS SRAM |
| Speed Grade | -1 |
| 패키지 | 144-pin TQFP |
| 실장 유형 | Surface Mount |
| Configuration Interface | JTAG / serial PROM |
| RoHS 상태 | Compliant (lead-free) |
EPF10K30ATI144-1 핀 구성
| 핀 1 | GND — Ground |
| 핀 2 | I/O — User I/O (bank 1) |
| 핀 3 | I/O — User I/O (bank 1) |
| 핀 4 | I/O — User I/O (bank 1) |
| 핀 5 | I/O — User I/O (bank 1) |
| 핀 6 | I/O — User I/O (bank 1) |
| 핀 7 | I/O — User I/O (bank 1) |
| 핀 8 | I/O — User I/O (bank 1) |
| 핀 9 | I/O — User I/O (bank 1) |
| 핀 10 | I/O — User I/O (bank 1) |
| 핀 11 | I/O — User I/O (bank 1) |
| 핀 12 | I/O — User I/O (bank 1) |
| 핀 13 | GND — Ground |
| 핀 14 | I/O — User I/O (bank 2) |
| 핀 15 | I/O — User I/O (bank 2) |
| 핀 16 | I/O — User I/O (bank 2) |
| 핀 17 | I/O — User I/O (bank 2) |
| 핀 18 | I/O — User I/O (bank 2) |
| 핀 19 | I/O — User I/O (bank 2) |
| 핀 20 | I/O — User I/O (bank 2) |
| 핀 21 | I/O — User I/O (bank 2) |
| 핀 22 | I/O — User I/O (bank 2) |
| 핀 23 | I/O — User I/O (bank 2) |
| 핀 24 | I/O — User I/O (bank 2) |
| 핀 25 | GND — Ground |
| 핀 26 | I/O — User I/O (bank 2) |
| 핀 27 | I/O — User I/O (bank 2) |
| 핀 28 | I/O — User I/O (bank 2) |
| 핀 29 | I/O — User I/O (bank 2) |
| 핀 30 | I/O — User I/O (bank 2) |
| 핀 31 | I/O — User I/O (bank 2) |
| 핀 32 | I/O — User I/O (bank 2) |
| 핀 33 | I/O — User I/O (bank 2) |
| 핀 34 | I/O — User I/O (bank 2) |
| 핀 35 | GND — Ground |
| 핀 36 | I/O — User I/O (bank 3) |
| 핀 37 | I/O — User I/O (bank 3) |
| 핀 38 | I/O — User I/O (bank 3) |
| 핀 39 | I/O — User I/O (bank 3) |
| 핀 40 | I/O — User I/O (bank 3) |
| 핀 41 | I/O — User I/O (bank 3) |
| 핀 42 | I/O — User I/O (bank 3) |
| 핀 43 | I/O — User I/O (bank 3) |
| 핀 44 | I/O — User I/O (bank 3) |
| 핀 45 | I/O — User I/O (bank 3) |
| 핀 46 | I/O — User I/O (bank 3) |
| 핀 47 | I/O — User I/O (bank 3) |
| 핀 48 | GND — Ground |
| 핀 49 | I/O — User I/O (bank 3) |
| 핀 50 | I/O — User I/O (bank 3) |
| 핀 51 | I/O — User I/O (bank 3) |
| 핀 52 | I/O — User I/O (bank 3) |
| 핀 53 | I/O — User I/O (bank 3) |
| 핀 54 | I/O — User I/O (bank 3) |
| 핀 55 | I/O — User I/O (bank 3) |
| 핀 56 | I/O — User I/O (bank 3) |
| 핀 57 | I/O — User I/O (bank 3) |
| 핀 58 | I/O — User I/O (bank 3) |
| 핀 59 | GND — Ground |
| 핀 60 | I/O — User I/O (bank 4) |
| 핀 61 | I/O — User I/O (bank 4) |
| 핀 62 | I/O — User I/O (bank 4) |
| 핀 63 | I/O — User I/O (bank 4) |
| 핀 64 | I/O — User I/O (bank 4) |
| 핀 65 | I/O — User I/O (bank 4) |
| 핀 66 | I/O — User I/O (bank 4) |
| 핀 67 | I/O — User I/O (bank 4) |
| 핀 68 | I/O — User I/O (bank 4) |
| 핀 69 | I/O — User I/O (bank 4) |
| 핀 70 | I/O — User I/O (bank 4) |
| 핀 71 | GND — Ground |
| 핀 72 | I/O — User I/O (bank 4) |
| 핀 73 | I/O — User I/O (bank 4) |
| 핀 74 | I/O — User I/O (bank 4) |
| 핀 75 | I/O — User I/O (bank 4) |
| 핀 76 | I/O — User I/O (bank 4) |
| 핀 77 | I/O — User I/O (bank 4) |
| 핀 78 | I/O — User I/O (bank 4) |
| 핀 79 | I/O — User I/O (bank 4) |
| 핀 80 | I/O — User I/O (bank 4) |
| 핀 81 | I/O — User I/O (bank 4) |
| 핀 82 | I/O — User I/O (bank 4) |
| 핀 83 | GND — Ground |
| 핀 84 | VCCINT — Core supply 3.3 V |
| 핀 85 | VCCINT — Core supply 3.3 V |
| 핀 86 | I/O — User I/O (bank 4) |
| 핀 87 | I/O — User I/O (bank 4) |
| 핀 88 | I/O — User I/O (bank 4) |
| 핀 89 | I/O — User I/O (bank 4) |
| 핀 90 | I/O — User I/O (bank 4) |
| 핀 91 | I/O — User I/O (bank 4) |
| 핀 92 | I/O — User I/O (bank 4) |
| 핀 93 | I/O — User I/O (bank 4) |
| 핀 94 | I/O — User I/O (bank 4) |
| 핀 95 | I/O — User I/O (bank 4) |
| 핀 96 | GND — Ground |
| 핀 97 | DCLK — Configuration clock input |
| 핀 98 | DATA0 — Configuration data input |
| 핀 99 | nCONFIG — Configuration control (active low) |
| 핀 100 | nSTATUS — Configuration status (active low) |
| 핀 101 | CONF_DONE — Configuration done output |
| 핀 102 | VCCIO — I/O supply 3.3 V |
| 핀 103 | TDI — JTAG test data in |
| 핀 104 | TDO — JTAG test data out |
| 핀 105 | TMS — JTAG test mode select |
| 핀 106 | TCK — JTAG test clock |
| 핀 107 | GND — Ground |
| 핀 108 | I/O — User I/O (bank 1) |
| 핀 109 | I/O — User I/O (bank 1) |
| 핀 110 | I/O — User I/O (bank 1) |
| 핀 111 | I/O — User I/O (bank 1) |
| 핀 112 | I/O — User I/O (bank 1) |
| 핀 113 | I/O — User I/O (bank 1) |
| 핀 114 | I/O — User I/O (bank 1) |
| 핀 115 | I/O — User I/O (bank 1) |
| 핀 116 | I/O — User I/O (bank 1) |
| 핀 117 | I/O — User I/O (bank 1) |
| 핀 118 | GND — Ground |
| 핀 119 | VCCINT — Core supply 3.3 V |
| 핀 120 | I/O — User I/O (bank 1) |
| 핀 121 | I/O — User I/O (bank 1) |
| 핀 122 | I/O — User I/O (bank 1) |
| 핀 123 | I/O — User I/O (bank 1) |
| 핀 124 | I/O — User I/O (bank 1) |
| 핀 125 | I/O — User I/O (bank 1) |
| 핀 126 | I/O — User I/O (bank 1) |
| 핀 127 | I/O — User I/O (bank 1) |
| 핀 128 | I/O — User I/O (bank 1) |
| 핀 129 | I/O — User I/O (bank 1) |
| 핀 130 | I/O — User I/O (bank 1) |
| 핀 131 | I/O — User I/O (bank 1) |
| 핀 132 | I/O — User I/O (bank 1) |
| 핀 133 | I/O — User I/O (bank 1) |
| 핀 134 | I/O — User I/O (bank 1) |
| 핀 135 | I/O — User I/O (bank 1) |
| 핀 136 | I/O — User I/O (bank 1) |
| 핀 137 | I/O — User I/O (bank 1) |
| 핀 138 | I/O — User I/O (bank 1) |
| 핀 139 | I/O — User I/O (bank 1) |
| 핀 140 | I/O — User I/O (bank 1) |
| 핀 141 | I/O — User I/O (bank 1) |
| 핀 142 | I/O — User I/O (bank 1) |
| 핀 143 | GND — Ground |
| 핀 144 | VCCIO — I/O supply 3.3 V |
일반적인 애플리케이션
EPF10K30ATI144-1 적합 용도: 6 애플리케이션s: Industrial Process Control Logic, Telecommunications Glue Logic and Bridge, Legacy Peripheral Controller Replacement, ASIC Prototyping Platform, Educational and University FPGA Lab, Automotive Aftermarket Electronics.
Industrial Process Control Logic
The EPF10K30ATI144-1 fits industrial process control designs because its 30,000 gates, 1,728 logic elements, and 102 user I/Os are sufficient for implementing multi-axis control state machines, sensor multiplexing, and HMI interface glue logic in a single programmable device. Its industrial operating temperature range and 3.3 V single-supply rail reduce power-tree complexity on factory-floor PLCs and motor-drive controllers. The embedded array blocks provide 12 Kbit of on-chip RAM for FIFO buffering of sensor data without external SRAM. For an upgrade path, the same board layout accepts faster -2 and -3 speed grades without rework, protecting the design's NRE investment.
추천
Telecommunications Glue Logic and Bridge
In telecom line-card designs, the EPF10K30ATI144-1 is used to bridge legacy parallel buses to newer backplane protocols, implement custom framing logic, and provide address decoding across multiple peripherals. Its 216 LABs and 102 I/Os comfortably support multi-bus glue functions at telecom-grade clock rates, while the 12 Kbit of embedded memory absorbs small packet buffers. The 3.3 V supply simplifies integration with ECL-to-TTL translators that telecom line cards already require. Pin-compatible speed-grade variants (EPF10K30ATI144-2 and -3) allow the same design to scale from cost-sensitive access equipment to higher-rate metro switches.
추천
Legacy Peripheral Controller Replacement
Designers use the EPF10K30ATI144-1 to consolidate dozens of legacy 74-series TTL and PAL/GAL devices onto a single re-programmable part, simplifying BOM and reducing board area in long-lifecycle products such as medical instruments, test equipment, and aerospace ground systems. The 102 user I/Os eliminate the need for external I/O expanders, and the 12 Kbit embedded memory can replace small SRAM/ROM chips for lookup tables and waveform coefficients. The -1 speed grade is sufficient for low-to-mid frequency control paths; production can migrate to -2 or -3 on the same footprint if timing closure proves difficult.
추천
ASIC Prototyping Platform
The EPF10K30ATI144-1 serves as an FPGA prototype target for verifying ASIC register-transfer-level (RTL) designs before committing to mask costs. With 1,728 logic elements and 12 Kbit embedded memory, it accommodates mid-complexity ASIC blocks such as custom DMA controllers, DSP datapaths, and peripheral interfaces. Designers can iterate RTL quickly, validate real-world timing on actual silicon, then port the verified design to a lower-cost mask-programmed gate array. The JTAG interface simplifies in-system debugging, and the same 144-pin TQFP footprint allows prototype-to-production pinout reuse across the -1/-2/-3 speed-grade family.
추천
Educational and University FPGA Lab
Universities and technical institutes use the EPF10K30ATI144-1 on training boards because its 30K-gate capacity is large enough for meaningful class projects (CPU cores, video controllers, custom peripherals) yet small enough that students can fully understand the synthesized netlist. The 3.3 V single supply and TQFP-144 footprint are forgiving for hand-soldered prototype boards and standard two-layer PCBs, while the JTAG interface works with legacy Altera ByteBlaster and USB-Blaster download cables still common in educational labs. The same development environment (Quartus II) supports all FLEX 10KA speed grades, so labs can mix -1, -2, and -3 parts on different boards.
추천
Automotive Aftermarket Electronics
Although not AEC-Q100 qualified, the EPF10K30ATI144-1's industrial temperature range and 3.3 V tolerance make it suitable for non-safety automotive aftermarket products such as custom dashboard controllers, audio system DSP pre-processors, and diagnostic scan tools. The 102 user I/Os easily interface with CAN/LIN transceivers and high-current driver stages, while the embedded memory handles lookup tables for engine tuning and driver-display graphics. Designers targeting harsh cabin or engine-bay conditions should consider EPF10K30ATI144-2 or -3 on the same footprint if timing margin becomes a concern.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K30ATI144-1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K30ATI144-2 | EPF10K30ATI144-3 | EPF10K30ATC144-1 | EPF10K30ATC144-3 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Speed Grade | -1 (slowest) | -2 (mid) | -3 (fastest) | -1 (slowest) | -3 (fastest) |
| Operating Temperature | Industrial (-40 C to +85 C) | Industrial | Industrial | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) |
| Supply Voltage | 3.0-3.6 V (3.3 V nominal) | 3.0-3.6 V | 3.0-3.6 V | 3.0-3.6 V | 3.0-3.6 V |
| User I/O | 102 | 102 | 102 | 102 | 102 |
| Lifecycle Status | Obsolete (aftermarket) | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Industrial temperature range at obsolete-part price floor (vs EPF10K30ATC144-3)
- Cost-optimized -1 speed grade for legacy designs (vs EPF10K30ATI144-3)
- Single-rail 3.3 V supply simplifies power tree (vs EPF10K100EFC484-1)
설계 노트
The EPF10K30ATI144-1 requires a single 3.3 V supply for both VCCINT (core) and VCCIO (I/O banks); place a 100 uF bulk capacitor near the FPGA and add a 0.1 uF decoupling capacitor within 5 mm of every VCCINT and VCCIO pin pair. The device draws significant in-rush current during configuration (peak 200-300 mA per VCCINT pin); ensure the 3.3 V regulator ramps monotonically within 100 us to avoid configuration failure. Add a power-good signal from the regulator to drive the nCONFIG pin only after the rail is stable.
Estimated: in a still-air environment with a 144-pin TQFP (theta_JA approximately 35 C/W for a standard JEDEC test board), the EPF10K30ATI144-1 dissipates up to 0.5 W at 100% logic utilization with all 102 I/Os toggling. Junction temperature rise above 25 C ambient would be roughly 18 C (Estimated: 0.5 W x 35 C/W), keeping Tj well below the 125 C maximum. For industrial designs operating at +85 C ambient, add 1-2 square inches of copper pour under the exposed die-attach pad area to lower thermal resistance.
Route all four dedicated global clock pins (CLK0-CLK3) on inner layers with 50 ohm controlled impedance and keep traces shorter than 50 mm to avoid signal integrity issues at high toggle rates. The 144-pin TQFP has a 0.5 mm pitch; use 0.15 mm trace/space with 0.25 mm via pads and fan-out signals on at least two inner layers to break out all 102 user I/Os. Place the configuration PROM (EPC2 or EPC8) within 50 mm of the DCLK and DATA0 pins to minimize skew.
Do not leave nCONFIG floating; tie it through a 1-10 kohm pull-up to VCCIO and drive it from either the regulator power-good or the JTAG controller. A floating nCONFIG causes intermittent configuration failures during power-up transients. Additionally, never hot-swap the FPGA while configuration data is being shifted in, as mid-configuration glitches can latch the device into an undefined state requiring a power-cycle to recover.
규정 준수 정보
RoHS-compliant lead-free package per Intel/Altera product specifications. Not AEC-Q100 qualified - this part is not designed for automotive safety-critical applications. Halogen-free status not explicitly stated in available data.