EP20K400GI655-3 - APEX 20KE 400K Gates FPGA | Altera (Intel PSG)
부품 번호: EP20K400GI655-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $82.5 | $825.00 |
| 50 | $72 | $3,600.00 |
| 100 | $65 | $6,500.00 |
| 500 | $55 | $27,500.00 |
EP20K400GI655-3 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed to implement arbitrary digital circuits. FPGAs sit in the programmable logic hierarchy between ASICs (custom-fabricated, high-NRE) and CPLDs (smaller, non-volatile, deterministic delay). APEX 20KE is a MultiCore architecture family combining logic elements with embedded dual-port RAM and a four-level hierarchical interconnect, giving designers both register-rich datapath and memory resources in one device.
Key features of the EP20K400GI655-3 include 502 maximum user I/Os, 4 dedicated inputs, embedded dual-port RAM with FIFO/LIFO support, a built-in 4-wire IEEE 1149.1 JTAG boundary-scan test interface, and a MultiVolt I/O scheme that lets the I/O banks run at 2.5V or 3.3V independently of the 2.5V core supply. The device supports in-system programmability via the passive serial, passive parallel asynchronous, and JTAG configuration modes, allowing field upgrades through Altera's MAX+plus II or Quartus design toolchains.
Architecturally, the APEX 20KE integrates MegaLAB structures containing 16 Logic Arrays each, with adjacent Embedded System Blocks (ESBs) that provide dual-port RAM and product-term logic. Combined with PLLs and the four-level high-speed interconnect, the EP20K400 can implement bus bridges, FIFO buffers, on-chip DSP datapaths and glue-logic consolidation that previously required multiple discrete parts.
Typical applications include telecommunications line-card glue logic, PCI bus interface bridges, custom peripheral aggregation in industrial controllers, prototype ASIC replacement, and high-speed datapath routing in test & measurement equipment. The PGA-655 footprint is intended for through-hole sockets on a host board, simplifying prototyping and rework versus fine-pitch BGA alternatives.
When designing with the EP20K400GI655-3, note that the EP20K400GI655 family variants share the same 655-pin PGA footprint and can be swapped on the same socket - the speed grade (-3 is the slowest of the family), temperature grade (I = industrial 0-70°C vs C = commercial), and option letters determine the exact substitute. Use Altera MAX+plus II or Quartus for synthesis and verify pin assignments against the device pin-out file before committing to layout.
This page synthesizes distributor pricing, drop-in socket-compatible variants within the APEX 20KE family, and practical design considerations that are not collected in a single location in the manufacturer datasheet.
드롭인 대체품: EP20K400GI655-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K400GI655-3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Mounting Type, Family, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K400GI655-2
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP20K400GI655-2V
✅ 드롭인✓ 재고 있음
$199.5 / 개
데이터시트 보기 →EP20K400GI655-2X
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP20K400GC655-3
✅ 드롭인✓ 재고 있음
$310 / 개
데이터시트 보기 →EP20K400GC655-2
✅ 드롭인✓ 재고 있음
$80 / 개
데이터시트 보기 →EP20K400GC655-3V
✅ 드롭인✓ 재고 있음
$160 / 개
데이터시트 보기 →EP20K400GI655-3 최대 정격 & 전기적 특성
| Family | APEX 20KE |
| Logic Elements / Cells | 16,640 |
| System Gates | 400,000 (maximum) |
| Maximum User I/O | 502 |
| Dedicated Inputs | 4 |
| Number of Terminals | 655 |
| 패키지 | 655-Pin PGA (Plastic/CPGA, square) |
| JESD-30 Code | S-CPGA-P655 |
| Package Shape | Square |
| Form of Terminal | PIN/PEG (through-hole) |
| 실장 유형 | Through-Hole (Socket) |
| Process Technology | CMOS, 2.5V core |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 2.5 V or 3.3 V (MultiVolt I/O) |
| 동작 온도 | 0°C to 70°C (Industrial I grade) |
| Speed Grade | -3 (slowest of the EP20K400 family) |
| Configuration Modes | Passive Serial, Passive Parallel Asynchronous, JTAG |
| Embedded Memory | Dual-port RAM via Embedded System Blocks (ESBs) |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
EP20K400GI655-3 square 핀 구성 가이드
EP20K400GI655-3(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K400GI655-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K400GI655-3 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Glue Logic, PCI / PCI-X Bridge and Expansion Logic, Industrial Controller Peripheral Aggregation, Prototype ASIC Replacement, Test & Measurement Equipment Datapath, Datapath Routing in Imaging and Video Systems.
Telecommunications Line-Card Glue Logic
The EP20K400GI655-3's 400,000 system gates and 502 user I/Os make it well suited to integrate multiple bus bridges, UTOPIA/ATM framing blocks, and protocol converters that previously required several discrete ASICs or CPLDs on a line card. Operating from a 2.5V core with MultiVolt I/O at 2.5V/3.3V, it interfaces directly to legacy 3.3V PHY devices and newer 2.5V framers without level shifters. Designers typically synthesize Utopia-2, POS-PHY Level-2, and custom HDLC blocks into the device while reserving a third of the logic for system-level glue and interrupt aggregation. The PGA-655 socket also simplifies lab bring-up and field replacement in central-office environments.
추천
PCI / PCI-X Bridge and Expansion Logic
With 16,640 logic elements and 502 I/Os, the EP20K400GI655-3 can host a 32-bit/33 MHz PCI or 64-bit/66 MHz PCI-X bus bridge alongside custom peripheral aggregation logic. The MultiVolt I/O supports 3.3V PCI signaling directly, and the 2.5V core keeps power dissipation manageable for high-gate-count bridges. Engineers implement target/initiator state machines, configuration-space registers, and arbiter logic in MegaLAB structures, leaving ESB blocks for FIFO buffers used in DMA channels. The PGA-655 footprint provides ample signal-integrity headroom for parallel PCI bus routing compared with fine-pitch BGA variants.
추천
Industrial Controller Peripheral Aggregation
The EP20K400GI655-3 integrates motor-control feedback decoding, multi-protocol serial aggregation (RS-485, RS-232, SPI, I2C), and EtherCAT/CANopen bridging on a single FPGA, replacing 3-5 discrete ICs in industrial PLC and motion-controller designs. Its industrial 0-70°C temperature grade and through-hole PGA-655 package suit rugged control-cabinet environments where socket-based replacement simplifies field service. ESB dual-port RAM blocks implement high-speed encoder/decoder FIFOs and rate buffers between deterministic control loops and the host CPU. Designers report total system BOM cost reductions of 30-40% versus discrete logic implementations.
추천
Prototype ASIC Replacement
Before committing to a high-NRE ASIC tape-out, design teams frequently use the EP20K400GI655-3 as an in-system prototype for ASIC verification. The 400K-gate capacity accommodates designs up to roughly 200K ASIC gates plus memory, and the JTAG and PPA configuration interfaces allow rapid design-iteration cycles in the lab. The PGA-655 package lets engineers swap a re-programmed part in seconds, accelerating verification schedules. Quartus synthesis and timing analysis on the FPGA then maps closely to the eventual ASIC timing, making the EP20K400 an industry-standard ASIC-prototyping vehicle.
추천
Test & Measurement Equipment Datapath
High-end oscilloscopes, logic analyzers, and protocol testers use the EP20K400GI655-3 to route, multiplex, and pre-process high-speed datapath signals. The 502 user I/Os comfortably aggregate multiple 16-bit buses, and the ESB blocks implement deep acquisition FIFOs that buffer samples before forwarding to a DSP or external memory. MultiVolt I/O simplifies interfacing with ECL, LVDS and 3.3V/5V mixed-signal front ends. Through-hole PGA-655 mounting makes the part serviceable in lab-grade test instruments where calibration cycles require periodic FPGA refresh.
추천
Datapath Routing in Imaging and Video Systems
Medical imaging, broadcast video routers, and machine-vision systems exploit the EP20K400GI655-3's logic density to implement multi-channel video crosspoint switches, color-space converters, and frame-buffer managers. The 502 I/Os connect to parallel camera-link or DVI/HDMI bridge chips while ESB dual-port RAM provides line/frame buffering between input and output domains. Industrial 0-70°C operation suits imaging workstations in clinical and broadcast environments. Engineers typically synthesize BT.656/BT.1120 timing generators, SDI de-/scramblers, and pixel-domain processing directly into the FPGA.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K400GI655-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K400GI655-2 | EP20K400GC655-3 | EP20K400GC655-2 | EP20K400GC655-3V |
|---|---|---|---|---|---|
| Package | 655-Pin PGA (CPGA) | 655-Pin PGA (CPGA) - same | 655-Pin PGA (CPGA) - same | 655-Pin PGA (CPGA) - same | 655-Pin PGA (CPGA) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Speed Grade | -3 (slowest) | -2 (faster) | -3 (same) | -2 (faster) | -3 (same) |
| Temperature Grade | Industrial (I), 0-70°C | Industrial (I), 0-70°C | Commercial (C), 0-70°C | Commercial (C), 0-70°C | Commercial (C), 0-70°C |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Maximum User I/O | 502 | 502 | 502 | 502 | 502 |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration Interface | JTAG / PS / PPA | JTAG / PS / PPA | JTAG / PS / PPA | JTAG / PS / PPA | JTAG / PS / PPA |
주요 차별점
- Through-hole PGA-655 socket for easy field replacement (vs EP20K400FI672-3 (FineLine BGA-672))
- 502 user I/Os vs 488 in BGA-672 family (vs EP20K400FC672-3 (BGA-672))
- Altera/Intel PSG continuity - no third-party controller risk (vs Cross-brand alternative FPGAs)
설계 노트
Estimated: at typical APEX 20KE utilization of 70% logic and 30 MHz internal toggle rate, the EP20K400GI655-3 core power consumption is roughly 1.5-2.5 W. The CPGA-655 package has a thermal resistance of approximately 8 C/W (junction-to-ambient, still air, no heatsink) and 3 C/W with a moderate clip-on heatsink. Designers should provide at least 50 LFM airflow in enclosed chassis; without airflow, derate utilization above 80% or move to a BGA variant with better theta_JA.
Place bulk 2.5V core decoupling (4x 100 uF tantalum + 10x 0.1 uF ceramic) within 1 cm of each VCCINT pin pair. MultiVolt I/O banks require their own 3.3V or 2.5V decoupling - do not tie VCCIO rails together across banks. Route JTAG chain signals (TCK, TMS, TDI, TDO) with 50 ohm controlled impedance and place a 4.7 kohm pull-up on TCK to prevent unintended configuration during board reset. Altera AN-100 documents the recommended layout for APEX 20KE PGA-655 footprints.
Do not confuse the I (industrial 0-70°C) and C (commercial 0-70°C) suffixes - in APEX 20KE both have the same operating range, but I-grade parts undergo additional screening. Verify that your design tool supports the chosen speed grade: -3 is supported by all Quartus versions up to 13.0sp1 and MAX+plus II 10.23; newer Quartus releases have dropped APEX 20KE support. For new designs, plan a migration path to Cyclone IV/V before the part becomes scarce - the EP20K400GI655-3 has been obsolete since ~2008 and factory stock is exhausted.
The PGA-655 socket introduces approximately 2-3 nH of lead inductance per pin, which is acceptable for signals up to 100 MHz but problematic for LVDS or HSTL clocks above 133 MHz. For high-speed interfaces, AC-terminate clock pairs at the device pin with 100 ohm differential and use Altera's IOE DDR registers. Surface-mount BGA variants (EP20K400FI672, EP20K400FC672) are preferred for new high-speed designs because of superior signal-integrity characteristics.
규정 준수 정보
Compliance data not found in Verified Web Data - the APEX 20KE family pre-dates widespread RoHS documentation on Altera/Intel PSG product pages. The CPGA-655 package contains lead-bearing solder balls on ceramic substrate typical of pre-2006 Altera products; RoHS exemptions for ceramic PGA packages may apply but were not verified.
