EP20K400FI672-2 - 400K Gates APEX-20K FPGA, 502 I/O, 672-FBGA | Altera
부품 번호: EP20K400FI672-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.75 | $11,875.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92.4 | $92,400.00 |
EP20K400FI672-2 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the high-density gate-array architecture with user-defined interconnect and logic, allowing designers to implement complex digital systems, glue logic, datapath functions, and even embedded processors on a single silicon die. APEX-20K belongs to the hierarchical class of programmable logic devices (PLDs), above CPLDs, and represents the first PLD family to integrate a true system-on-a-programmable-chip (SOPC) capability via its MultiCore architecture combining look-up tables (LUTs), product-term logic, and embedded memory.
Key features of the EP20K400FI672-2 include the APEX-20K MultiCore architecture integrating LUT-based logic, embedded system blocks (ESBs) for memory and product-term logic, 4 dedicated Phase-Locked Loops (PLLs) for clock management, multi-voltage I/O support including 1.8V, 2.5V, and 3.3V interfaces, and a dedicated configuration interface supporting JTAG, Passive Serial, and Passive Parallel modes. The 502 user I/Os in a 672-pin FCBGA provide ample connectivity for memory buses, processor interfaces, and high-speed parallel datapaths.
The architecture combines Look-Up Table (LUT) logic, Product-Term logic, and Embedded System Block (ESB) memory blocks on a single fabric. The 0.22 µm CMOS process and 2.5V core supply represent late-1990s high-density FPGA technology. With 200 MHz maximum internal frequency and 212,992 bits of embedded memory, the device supports high-throughput designs in communications, video processing, and protocol bridging applications.
Typical applications include telecommunications infrastructure, high-speed data acquisition, custom DSP pipelines, image and video processing engines, and embedded control systems. The high I/O count makes it suitable for memory-intensive designs and multi-bus bridging.
When designing with this FPGA, ensure proper decoupling on each power rail, follow Altera's power sequencing guidelines, and use the Quartus II design suite (with legacy support) for place-and-route. The 672-FBGA package requires careful PCB layout for thermal management and signal integrity.
This page synthesizes distributor pricing, drop-in APEX-20K family alternatives, and practical design notes not found in the legacy datasheet, helping sourcing engineers and embedded designers evaluate the EP20K400FI672-2 in legacy and maintenance applications.
드롭인 대체품: EP20K400FI672-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K400FI672-2 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Family, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K400FC672-2
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP20K400EFC672-2
✅ 드롭인✓ 재고 있음
$92.75 / 개
데이터시트 보기 →EP20K400FC672-1XGZ
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →EP20K400FC672-3
✅ 드롭인✓ 재고 있음
$138 / 개
데이터시트 보기 →EP20K400EFC672-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$199.5 / 개
데이터시트 보기 →EP20K400EFC672-1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$110 / 개
데이터시트 보기 →EP20K400FI672-2 최대 정격 & 전기적 특성
| Family | APEX-20K |
| Logic Elements | 16640 |
| Maximum Gates | 400,000 gates |
| User I/Os | 502 |
| Embedded Memory Bits | 212992 |
| Number of Macros | 1664 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Maximum Internal Frequency | 200 MHz |
| Propagation Delay | 2.5 ns |
| 동작 온도 | 0 °C to +85 °C (Commercial) |
| Package Type | 672-pin Fine-pitch Ball Grid Array (FBGA/FCBGA) |
| PLLs (Phase-Locked Loops) | 4 |
| Configuration Modes | JTAG, Passive Serial, Passive Parallel |
| RoHS 상태 | Lead-free / RoHS Compliant |
| 실장 유형 | Surface Mount (BGA) |
EP20K400FI672-2 672-pin fine-pitch ball grid array (fbga/fcbga) 핀 구성 가이드
EP20K400FI672-2(672-pin fine-pitch ball grid array (fbga/fcbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K400FI672-2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K400FI672-2 적합 용도: 6 애플리케이션s: Telecommunications Infrastructure, High-Speed Data Acquisition Systems, Image and Video Processing Pipelines, Embedded Control and Industrial Automation, Custom DSP Pipeline Acceleration, Legacy Avionics and Defense Systems.
Telecommunications Infrastructure
The EP20K400FI672-2 fits telecommunications infrastructure designs through its 400,000-gate density and 502 user I/Os, which provide ample logic capacity for ATM switch fabrics, SONET/SDH framer implementations, and protocol bridge interfaces. Its 4 on-chip PLLs enable clock-domain multiplexing across multiple telecom line cards operating at 19.44 MHz, 77.76 MHz, and 155.52 MHz. The 212,992 bits of embedded memory buffer packet headers and routing tables, reducing external SRAM. Designers leverage the APEX-20K MultiCore architecture to mix LUT logic and product-term glue logic on one fabric, simplifying legacy telecom PCB revisions while keeping Quartus II toolchain compatibility for in-field reprogramming.
추천
High-Speed Data Acquisition Systems
For high-speed data acquisition systems, the EP20K400FI672-2's 200 MHz maximum internal frequency and 502 user I/Os support parallel ADC interfaces up to 16 bits wide at full sampling rate. The 16,640 logic elements allow designers to implement FIR filters, FFT pipelines, and multi-channel decimation stages directly on the FPGA fabric. The 212,992 bits of embedded memory serve as fast buffer storage between ADC data streams and downstream DSP processors, reducing DMA latency. The 672-FBGA package provides sufficient I/O density for multi-board DAQ systems with 32+ analog input channels and clock distribution networks.
추천
Image and Video Processing Pipelines
The EP20K400FI672-2 fits image and video processing pipelines through its 400K-gate capacity and 212,992 bits of embedded memory, which can buffer multiple raster scanlines for real-time scaling and color-space conversion. Its 4 PLLs derive pixel clocks from incoming video streams at 27 MHz (SDTV), 74.25 MHz (HDTV), and 148.5 MHz (FHD) without external clock generators. The 502 user I/Os support 24-bit digital video interfaces plus ITU-R BT.656/BT.1120 inputs. Designers implement 2D convolution, gamma correction, and chroma keying on the LUT fabric while using ESB memory as line buffers.
추천
Embedded Control and Industrial Automation
In embedded control and industrial automation, the EP20K400FI672-2 serves as a programmable logic controller implementing custom fieldbus protocols (Profibus, DeviceNet, CAN) on a single chip. Its 502 I/Os interface with sensor arrays, motor encoder lines, and isolated digital I/O modules. The 4 PLLs synchronize stepper and servo motor control loops at 50 kHz to 200 kHz without external timing chips. With 16,640 logic elements, the device handles safety interlocks, PWM generation, and HMI display refresh simultaneously. Industrial users appreciate the APEX-20K family for its longevity in PLC designs and stable long-term availability through industrial distributors.
추천
Custom DSP Pipeline Acceleration
For custom DSP pipeline acceleration, the EP20K400FI672-2's LUT-based fabric implements high-speed multiply-accumulate (MAC) units and parallel filter banks at the 200 MHz internal frequency. Its 212,992 bits of embedded memory act as coefficient ROM and intermediate result storage, avoiding costly external SRAM cycles. Designers implement pipelined FFT, Viterbi decoders, and Reed-Solomon codecs in dedicated DSP datapaths. The 502 user I/Os interface with parallel DSP processors (TI TMS320 series, Analog Devices SHARC) to offload compute-intensive kernels. This makes the EP20K400FI672-2 a flexible co-processor for legacy signal-processing systems.
추천
Legacy Avionics and Defense Systems
The EP20K400FI672-2 is widely used in legacy avionics and defense systems where long-term field reliability and design stability are paramount. Its APEX-20K MultiCore architecture integrates LUT logic and product-term logic on one die, enabling mixed designs that previously required separate CPLD and FPGA chips. The 502 user I/Os interface with MIL-STD-1553 databuses, ARINC 429 channels, and discrete avionics signals. The 4 PLLs derive precision clocks for radar timing and navigation receivers. Although the family is mature, defense integrators continue to specify it for in-service platforms where the cost and risk of redesign outweigh the benefits of migration.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K400FI672-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K400FC672-2 | EP20K400EFC672-2 | EP20K400FC672-3 | EP20K400EFC672-1 | EP20K400FC672-1X |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (Fine-pitch BGA) | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Family / Logic Elements | APEX-20K / 16640 LEs | APEX-20K / 16640 LEs | APEX-20K / 16640 LEs | APEX-20K / 16640 LEs | APEX-20K / 16640 LEs | APEX-20K / 16640 LEs |
| Speed Grade | -2 | -2 | -2 | -3 (faster) | -1 (slower) | -1 (slower) |
| Temperature Grade | Commercial (0 °C to +85 °C) | Commercial | Industrial (-40 °C to +100 °C) | Commercial | Industrial (-40 °C to +100 °C) | Commercial |
| User I/Os | 502 | 502 | 502 | 502 | 502 | 502 |
| Embedded Memory Bits | 212992 | 212992 | 212992 | 212992 | 212992 | 212992 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
주요 차별점
- Industrial temperature grade available within same footprint (vs EP20K400FC672-2)
- Drop-in alternative on same die family (vs EP20K400BC652-1N)
- Multi-voltage I/O support (vs EP20K400CF672I7)
설계 노트
Estimated: The 672-ball FCBGA package dissipates 1.5-3 W under typical 200 MHz internal operation with 60-70% logic utilization. Without forced airflow, the package thermal resistance theta_JA of approximately 12-15 °C/W will yield a 25-45 °C junction temperature rise above ambient. Designers should attach a heatsink or specify 200 LFM airflow in industrial applications where ambient reaches +70 °C. Place thermal vias in the PCB land pattern to conduct heat into inner copper planes.
The 672-ball FBGA uses 0.8 mm ball pitch, requiring 4 mil traces between balls and laser-drilled micro-vias on the BGA fanout layer. Use a minimum 6-layer PCB stack-up with dedicated ground and power planes adjacent to the BGA. Maintain 50 Ω single-ended controlled impedance on high-speed I/O such as clock inputs and external memory buses. Place at least 8 decoupling capacitors (0.1 µF X7R) within 5 mm of the VCCINT and VCCIO balls, distributed across all four quadrants.
Estimated: Common pitfalls include: (1) Mixing VCCIO standards on the same bank, which violates Altera's bank-based I/O rules - all I/O in a bank must share the same VCCIO reference; (2) Forgetting MSEL pin configuration, causing the FPGA to default to JTAG mode and fail standalone configuration; (3) Driving global clock inputs with non-LVDS sources - the PLL inputs require clean references below 312.5 MHz with jitter under 100 ps; (4) Using the legacy Quartus II 9.1 instead of an older 7.x version when targeting APEX-20K, as newer releases drop APEX support.
규정 준수 정보
RoHS compliant per DigiKey listing for the -2V variant. Halogen-free status not explicitly stated in available data - marked unknown. Not AEC-Q100 qualified - choose industrial-grade variants for automotive applications. APEX-20K family declared obsolete per Altera/Intel product lifecycle database.
