EP20K600CB652I7N - APEX 20KC FPGA 600K Gates BGA-652 | Intel
부품 번호: EP20K600CB652I7N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $228.5 | $2,285.00 |
| 100 | $198.75 | $19,875.00 |
| 500 | $175.25 | $87,625.00 |
| 1,000 | $158 | $158,000.00 |
EP20K600CB652I7N 개요
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, and programmable interconnect that can be re-programmed at the hardware level to implement arbitrary digital logic. APEX 20KC extends the APEX 20K architecture with MultiCore interconnect, embedded system blocks (ESBs) for memory, and a hierarchy of look-up-table based logic elements. FPGAs sit within the programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor.
Key features include 24,320 logic elements, 311,040 bits of embedded system block memory, four Phase-Locked Loops (PLLs), and a low-voltage 1.8 V core with multi-voltage I/O support. The device supports high-speed LVDS I/O, dedicated Double Data Rate (DDR) memory interfaces, and JTAG-based in-system programmability via IEEE 1149.1, making it suitable for I/O-intensive designs.
Architecturally, APEX 20KC uses Altera's MultiCore interconnect with rows and columns of MegaLAB structures, each containing 16 Logic Elements plus an Embedded System Block. The 0.15 µm process gives a balance of density and performance, with internal speeds up to 375.94 MHz. The FineLine BGA-652 package provides high I/O count with controlled-impedance routing for high-speed designs.
Typical applications include high-speed telecommunications backplanes, ASIC prototyping, DSP co-processing, and high-density glue-logic replacement. The 652-pin BGA exposes the device's full I/O capacity, making it appropriate for interface bridging and parallel processing tasks in networking equipment.
When designing with this device, pay attention to power-supply sequencing (the 1.8 V VCCINT must ramp before VCCIO banks to avoid I/O latch-up) and ensure proper thermal management with sufficient PCB copper area under the BGA's thermal balls. Configuration memory is volatile and must be loaded from a PROM at every power-up.
This page synthesizes APEX 20KC family specifications, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet, presented for engineers maintaining legacy APEX 20K designs.
드롭인 대체품: EP20K600CB652I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600CB652I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Maximum Operating Frequency, Device Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600CB652I8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$175 / 개
데이터시트 보기 →EP20K600CB652I9
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$165 / 개
데이터시트 보기 →EP20K600CB652I7
✅ 드롭인✓ 재고 있음
$149 / 개
데이터시트 보기 →EP20K600CB652C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$305 / 개
데이터시트 보기 →EP20K400CB652I7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP20K600CB652I7N 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Typical Gates | 600,000 |
| Logic Elements (Cells) | 24,320 |
| Maximum Operating Frequency | 375.94 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| 패키지 | 652-pin FineLine BGA |
| 실장 유형 | Surface Mount (BGA) |
| Embedded System Block (ESB) Memory | 311,040 bits |
| Phase-Locked Loops (PLLs) | 4 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 7 |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) |
| RoHS 상태 | unknown |
EP20K600CB652I7N 652-pin fineline bga 핀 구성 가이드
EP20K600CB652I7N(652-pin fineline bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K600CB652I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K600CB652I7N 적합 용도: 6 애플리케이션s: Telecommunications Backplane Bridge, ASIC Prototyping and Emulation, DSP Co-Processing and FIR Filtering, High-Density Glue Logic Consolidation, Industrial Control and Factory Automation, Legacy Network Interface Card (NIC) Design.
Telecommunications Backplane Bridge
The EP20K600CB652I7N's 600K gates and 24,320 logic elements make it a strong fit for telecom backplane bridging applications, where multiple serial protocols (SPI 4.2, POS-PHY, UTOPIA) must be aggregated and rate-matched. The 652-pin FineLine BGA exposes the device's full I/O complement, allowing direct interface to multiple SERDES framer ICs without external muxing. The four PLLs provide independent clock domains for inbound and outbound line cards. At 375.94 MHz internal performance, the EP20K600 can sustain multi-gigabit protocol state machines with single-cycle throughput, while its 311 Kbits of embedded memory buffers packet descriptors and routing tables. The 1.8 V VCCINT keeps power manageable in densely-populated line-card slots.
추천
ASIC Prototyping and Emulation
With 600K gates and 24,320 LEs the EP20K600CB652I7N served as a workhorse ASIC prototype platform in the early 2000s, mapping multi-million-gate ASIC RTL into a small array of APEX 20KC devices. The 652-pin FineLine BGA exposes sufficient user I/O for partial-pin ASIC emulation, while the 311 Kbits of ESB memory per device buffer test vectors and trace data. The IEEE 1149.1 JTAG interface supports multi-device daisy-chaining for partitioned ASIC prototypes. Speed grade 7 at 375.94 MHz internal performance enables meaningful at-speed functional verification of control-plane logic; datapath verification benefits from the speed-grade 8 variant.
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DSP Co-Processing and FIR Filtering
The EP20K600CB652I7N's 24,320 LEs and 4 PLLs support parallel DSP co-processing workloads such as multi-channel FIR filtering, FFT engines, and Reed-Solomon forward-error-correction. The 311 Kbits of ESB memory store coefficient tables and intermediate samples with single-cycle access, eliminating external SRAM for moderate filter lengths. The four PLLs derive independent sample-rate clocks for ADC/DAC companion chips, while the high I/O count of the CB652 BGA interfaces directly to parallel data converters without external muxing. The 375.94 MHz internal Fmax supports >100 MHz aggregate DSP throughput.
추천
High-Density Glue Logic Consolidation
Replacing dozens of 74-series TTL/CMOS glue-logic packages with a single EP20K600CB652I7N simplifies PCB layout, reduces board area, and improves signal integrity in legacy system redesigns. The 652-pin FineLine BGA exposes hundreds of user I/O, enough to absorb even large bus-arbitration and address-decoding tasks. The SRAM-based configuration is volatile and reloads from an EPC-series configuration PROM at every power-up, providing field-upgradable logic. Industrial temperature grade (-40C to +100C) accommodates factory-floor and outdoor enclosures.
추천
Industrial Control and Factory Automation
The EP20K600CB652I7N's industrial temperature grade and high logic capacity suit factory-automation controllers, motor-control state machines, and protocol-converter PLC modules. The 24,320 LEs handle multi-axis motion control loops, while the 311 Kbits of ESB memory buffer encoder feedback and trajectory tables. The four PLLs synchronize to encoder inputs and PWM outputs, and the 652-pin BGA's high I/O count interfaces to many parallel sensor buses simultaneously. The 1.8 V VCCINT plus multi-voltage VCCIO supports mixed 3.3 V and 5 V industrial signal environments on the same device.
추천
Legacy Network Interface Card (NIC) Design
The EP20K600CB652I7N was widely deployed in early-2000s NIC and line-card designs for protocol termination, packet classification, and DMA engine implementation. The 652-pin BGA provides the I/O density to interface directly to multiple MAC/PHY devices and PCI/PCI-X bus interfaces, while the 600K-gate capacity absorbs packet-processing pipelines and classification lookup tables. The four PLLs generate the independent transmit/receive clocks required by gigabit Ethernet and OC-48 interfaces. Speed-grade 7 performance is sufficient for 1 Gbps line-rate processing without external co-processors.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K600CB652I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600CB652I8N | EP20K600CB652I9 | EP20K600CB652I7 | EP20K600CB652C7N | EP20K400CB652I7N |
|---|---|---|---|---|---|---|
| Package | 652-pin FineLine BGA | 652-pin FineLine BGA - same | 652-pin FineLine BGA - same | 652-pin FineLine BGA - same | 652-pin FineLine BGA - same | 652-pin FineLine BGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| Typical Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 400,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 16,640 |
| Speed Grade | 7 | 8 | 9 | 7 | 7 | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Commercial (0C to +85C) | Industrial |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest-density APEX 20KC variant with full CB652 pinout (vs EP20K400CB652I7N)
- Speed grade 7 provides conservative timing margin (vs EP20K600CB652I8N)
- Industrial temperature range for harsh environments (vs EP20K600CB652C7N)
설계 노트
The APEX 20KC requires power-supply sequencing: VCCINT (1.8 V core) must ramp before VCCIO banks, otherwise the I/O buffers can back-drive the unpowered core and cause permanent latch-up damage. Use a power-supply sequencer IC or an RC delay network with a PowerGood comparator tied to the 1.8 V regulator enable pin. Decoupling follows the datasheet's recommendation of 100 nF ceramic under each VCCINT ball group and 10 µF bulk tantalum per VCCIO bank, placed as close as the FineLine BGA pitch allows. Estimated ICCINT at 600 MHz operation with all LEs active is approximately 1.5-2 A, so the 1.8 V regulator must supply at least 3 A peak headroom.
The 652-pin FineLine BGA has an exposed thermal pad array that must be soldered to the PCB thermal land with a via-fence heat-sinking pattern. With all 24,320 LEs switching at 100% utilization, junction-to-ambient thermal resistance (θJA) is approximately 8-12 C/W on a 4-layer 1 oz copper PCB per the APEX 20K family datasheet. Estimated: Pdiss at 100% toggle with 1.8 V × 2 A × 0.25 activity factor ≈ 0.9 W, leading to ~10 C temperature rise. Designs that push above 2 W should add a heatsink or thermal interface material.
The FineLine BGA-652 footprint requires microvia or laser-drilled via technology on the inner BGA ball pitch (typically 1.0 mm). Use 0.5 oz copper outer layers and 1 oz inner planes to maintain 50 Ω controlled-impedance routing for high-speed LVDS pairs. Escape routing should fan out on the top layer with via-in-pad or dogbone fan-out; keep differential pair traces matched within 5 mil length to preserve LVDS skew margins. Reference the Altera Device Package Information Data Sheet for the exact ball-pattern land dimensions.
APEX 20KC configuration memory is volatile SRAM: every power-up must reload the bitstream from an EPC-series configuration PROM via JTAG or passive-serial mode. Forgetting the configuration PROM bricks the board on first power-up. Multi-device JTAG chains require unique TDI/TDO ordering per the BYPASS instruction. Finally, do not confuse APEX 20K (2.5 V VCCINT) with APEX 20KC (1.8 V VCCINT); substituting one for the other destroys the silicon. Source: APEX 20K family datasheet (Mouser apex-1299388.pdf).
규정 준수 정보
Compliance data not present in verified web data; Altera/Intel legacy FPGAs predate widespread RoHS-REACH documentation. RoHS likely compliant per 'I7' industrial grade ordering convention but cannot be confirmed without datasheet cross-reference.
