EP20K600CB652I7 - 600K Gate APEX 20KC FPGA BGA-652 | Intel
부품 번호: EP20K600CB652I7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 250 | $168 | $42,000.00 |
| 500 | $149 | $74,500.00 |
EP20K600CB652I7 개요
An APEX 20KC FPGA is a programmable logic device that combines look-up table (LUT) based logic elements, embedded system blocks (ESBs) for memory and specialized functions, and a high-bandwidth MultiCore interconnect. The APEX family sits within the broader taxonomy of programmable logic -> FPGA -> SRAM-based FPGA -> PLD (programmable logic device) -> semiconductor, and is the predecessor to the Stratix/Arria series that Intel (formerly Altera) ships today. APEX 20KC was widely used in telecom line cards, DSP front-ends, and high-speed bus bridges during the early 2000s.
Key differentiating features of the EP20K600CB652I7 include 488 user I/O pins (4 dedicated inputs plus 480 I/O lines), four embedded PLL-style clock blocks per row, embedded system blocks configurable as dual-port RAM, ROM, or CAM, MultiVolt I/O support for interfacing with 1.8 V, 2.5 V, 3.3 V, and 5.0 V buses, and JTAG-based IEEE 1149.1 boundary-scan plus in-system programmability. The 652-ball FineLine BGA exposes a generous number of differential pairs and global clock networks, which is why the part was popular in communications infrastructure.
In terms of architecture depth, the 24,320 logic elements are organised into MegaLAB structures of 16 Logic Array Blocks (LABs), each LAB containing 10 Logic Elements (LEs). ESBs can be configured as 4 Kbit memory blocks, and the MultiCore interconnect provides predictable routing delays that scale with fan-out rather than die position, simplifying timing closure versus earlier FPGAs.
Typical applications include telecommunications backplane glue logic, high-speed serial protocol bridging (UTOPIA, POS-PHY, SPI-4.2), DSP co-processing front-ends, image and video pipeline processing, and PCI bus bridging. The wide I/O count also makes it well suited to test instrumentation and ASIC prototyping platforms.
When designing with the EP20K600CB652I7, ensure the 1.8 V core rail has bulk decoupling close to the BGA, provide proper MultiVolt reference biasing for any 5 V-tolerant banks, and respect the JTAG chain ordering if the device is cascaded with other programmable logic on the board. A thermal copper pour under the BGA is recommended because the -7 industrial speed grade can dissipate several watts under full utilisation.
This page synthesizes distributor pricing for the obsolete APEX 20KC family, same-brand Intel/Altera drop-in alternatives that share the 652-ball footprint, and practical design notes that are not consolidated in the original datasheet.
드롭인 대체품: EP20K600CB652I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600CB652I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Device Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600CB652C7
✅ 드롭인✓ 재고 있음
$1320 / 개
데이터시트 보기 →EP20K600CB652C7N
✅ 드롭인✓ 재고 있음
$305 / 개
데이터시트 보기 →EP20K600CB652C7ES
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP20K600CB652C7E5
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP20K600CB652C8
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EP20K600CB652I8N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP20K600CB652I7 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Manufacturer | Intel (formerly Altera) |
| Technology | 0.15 µm CMOS, SRAM-based |
| System Gates | 600,000 |
| Logic Elements | 24,320 |
| Maximum Internal Frequency | 375.94 MHz |
| Propagation Delay | 1.6 ns |
| Core Supply Voltage | 1.8 V (1.71 V to 1.89 V range) |
| User I/O Count | 488 (4 dedicated inputs + 480 I/O) |
| 출력 수 | 480 |
| 패키지 | 652-ball FineLine BGA (LBGA, 1.27 mm pitch) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40 °C to +85 °C (industrial, 'I' suffix) |
| Speed Grade | -7 |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Embedded Memory | ESBs configurable as dual-port RAM / ROM / CAM |
| MultiVolt I/O Support | 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant banks |
| RoHS 상태 | unknown |
EP20K600CB652I7 652-ball fineline bga (lbga, 1.27 mm pitch) 핀 구성 가이드
EP20K600CB652I7(652-ball fineline bga (lbga, 1.27 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K600CB652I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K600CB652I7 적합 용도: 6 애플리케이션s: Telecom Backplane Glue Logic, High-Speed Protocol Bridging, DSP Co-Processing Front-End, Image and Video Pipeline Processing, PCI Bus Bridging, ASIC Prototyping Platform.
Telecom Backplane Glue Logic
The EP20K600CB652I7's 488 user I/Os and 24,320 logic elements make it well suited to telecom backplane glue logic where bus bridging, parity generation, and protocol conversion are required. The 652-ball BGA exposes enough global clock networks and differential pairs to support parallel backplane buses, while the APEX 20KC MultiCore interconnect gives predictable routing delays across the die. In one typical use, the FPGA bridges a UTOPIA / POS-PHY interface to an internal ASIC, replacing several discrete CPLDs and saving PCB area. Industrial temperature rating (-40 °C to +85 °C) covers outdoor base-station enclosures, and 5 V-tolerant MultiVolt I/O banks interface directly to legacy 5 V backplane transceivers without level shifters.
추천
High-Speed Protocol Bridging
The EP20K600CB652I7 is frequently used as a parallel-bus bridge between ASICs, network processors, and ASSPs. With 375 MHz internal performance and 488 I/O, the device can implement wide parallel interfaces such as SPI-4.2, UTOPIA Level 2/3, and PCI 64-bit with parity, all on a single chip. The ESBs (embedded system blocks) provide the dual-port RAM needed for packet buffering, eliminating external SRAM in many designs. Industrial temperature and -7 speed make it viable for both carrier-grade and ruggedised embedded systems, while the 652-ball BGA exposes enough I/O to terminate multiple parallel buses simultaneously. A typical reference design consumes less than half of the logic elements and uses roughly a quarter of the I/O.
추천
DSP Co-Processing Front-End
The EP20K600CB652I7 was widely deployed as a DSP co-processing front-end that handles high-bandwidth preprocessing before data is handed to a dedicated DSP or GPP. With 24,320 logic elements the device can implement FIR filters, FFT address generators, sample-rate converters, and ADPCM codecs entirely in fabric. The ESBs provide the dual-port RAM needed for sample buffering, while the 375 MHz internal clock handles sustained sample rates well above 100 MSPS. Industrial temperature rating lets the FPGA sit close to the ADC on a daughter card without thermal derating, and the 1.8 V core keeps power dissipation manageable in dense signal-processing channels.
추천
Image and Video Pipeline Processing
The EP20K600CB652I7's combination of 600 K system gates, ESB-based line buffers, and 488 I/O pins makes it a viable pipeline processor for image and video applications such as medical imaging front-ends, machine-vision frame grabbers, and broadcast video routers. The 652-ball BGA exposes enough pins to interface directly to parallel digital video buses (e.g. BT.1120, Camera Link), while the embedded system blocks can be configured as line buffers, lookup tables for gamma correction, or dual-port RAM for frame storage. The -7 industrial speed grade sustains 375 MHz internal rates, sufficient for real-time HD video at 148.5 MHz pixel clock plus margin for pipeline latency.
추천
PCI Bus Bridging
The EP20K600CB652I7 was a popular PCI bridge solution in the early 2000s because it can implement a full 64-bit/66 MHz PCI master/target with parity and other side signals in fabric, with abundant logic elements left over for application logic. The 652-ball BGA exposes 488 I/Os which can comfortably absorb both the 64-bit PCI bus plus the local side bus, and the 1.8 V core keeps the device within the PCI 5 V signalling envelope via the MultiVolt I/O banks. Industrial temperature rating makes the FPGA suitable for industrial backplane and embedded computing platforms.
추천
ASIC Prototyping Platform
Designers frequently chose the EP20K600CB652I7 as an ASIC prototyping vehicle because 24,320 logic elements are large enough to map mid-complexity ASICs (300 K to 500 K gates) when combined with multiple APEX 20KC devices. The 652-ball BGA exposes enough I/O to break out the entire ASIC pin list, while the JTAG-based in-system programming allows rapid design-iteration cycles. The ESBs map easily onto ASIC RAM macros, and the MultiVolt I/O banks let the FPGA emulate ASIC I/O standards without level translators. Industrial temperature rating lets the same prototype board validate in both lab and field environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K600CB652I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600CB652C7 | EP20K600CB652C7N | EP20K600CB652C8 | EP20K600CB652I8N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 652-ball LBGA (1.27 mm pitch) | 652-ball LBGA (1.27 mm pitch) - same | 652-ball LBGA (1.27 mm pitch) - same | 652-ball LBGA (1.27 mm pitch) - same | 652-ball LBGA (1.27 mm pitch) - same |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Speed Grade | -7 (fastest) | -7 | -7 | -8 (slower by ~10%) | -8 (slower by ~10%) |
| Operating Temperature | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Industrial -40C to +85C |
| Max Internal Frequency | 375.94 MHz | 375.94 MHz | 375.94 MHz | ~338 MHz (slower bin) | ~338 MHz (slower bin) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Industrial -40C to +85C temperature grade with -7 (fastest) speed bin (vs EP20K600CB652C7)
- Same-density APEX 20KC silicon as the EP20K600CB652C7 family (vs EP20K600CB652I8N)
- 652-ball FineLine BGA exposes 488 user I/Os (vs EP20K400CB652I7)
설계 노트
Estimated: At 375 MHz with 50% logic utilisation the EP20K600CB652I7 draws approximately 1.5-2.0 A from the 1.8 V core rail (2.7-3.6 W). Use a low-impedance 1.8 V plane with bulk ceramic decoupling (47 µF tantalum + 10 µF + 0.1 µF) within 1 cm of the BGA. The MultiVolt I/O banks draw additional current that scales with switching frequency and bank voltage (5 V banks draw the most). Include a VCCIO plane per bank voltage to avoid ground bounce.
The 652-ball FineLine BGA at 1.27 mm pitch requires 4-6 layer PCB stack-up with microvia-in-pad for breakout. Escape routing on the top layer should use 0.1 mm (4 mil) trace-and-space with the second layer dedicated as a continuous GND pour for return paths. Place at least four 4x4 via arrays under the BGA thermal balls for thermal relief, and stitch the perimeter with GND vias every 5 mm to control EMI from the MultiVolt I/O edges.
APEX 20KC MultiVolt I/O banks require VREF bias for any bank driving a 5 V TTL/CMOS bus. Tie VREF to the midpoint between VCCIO and GND (typically 2.5 V for a 5 V tolerant bank) through a 10 kΩ resistor with 0.1 µF bypass. Unused I/O pins should be configured as outputs driving low or as inputs with internal pull-ups to avoid floating-input oscillation that injects noise into adjacent banks.
Do not assume the EP20K600CB652I7 is compatible pin-to-pin with the APEX 20K (non-KC) family - the KC suffix denotes faster ESBs and a different speed-grade curve. Verify the Quartus APEX 20KC device library is installed before synthesising, and respect the JTAG chain order if cascading with other programmable logic. Finally, the APEX 20KC is NOT recommended for new designs - prefer Stratix or Cyclone for active lifecycle support.
규정 준수 정보
Compliance information not present in the verified web data. APEX 20KC family was originally released in the early 2000s before RoHS was mandated on most FPGA packages; some variants (e.g. the C7N suffix) indicate lead-free reflow compatibility but full RoHS / REACH status must be verified with the specific distributor's certificate of conformance.
