EP20K600CF33C8 - APEX 20KC FPGA, 600K Gates, 1.8V | Altera
부품 번호: EP20K600CF33C8 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $428.37 | $428.37 |
| 10 | $410.5 | $4,105.00 |
| 100 | $372.2 | $37,220.00 |
| 500 | $320 | $160,000.00 |
| 1,000 | $285.75 | $285,750.00 |
EP20K600CF33C8 개요
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable I/O cells. FPGAs sit in the programmable logic hierarchy between CPLDs (smaller, non-volatile) and ASICs (high-volume, fixed-function). The APEX 20KC family specifically combines LUT-based logic with embedded memory, making it suitable for high-density data-path and DSP-style designs of its era, typically powered by an external linear or switching regulator such as a TI TPS7A4701.
Key features of the EP20K600CF33C8 include 24,320 logic elements, 311,296 bits of embedded SRAM, MultiCore architecture with FastTrack routing, and LVDS I/O support up to 840 Mbps per channel. The device operates from a 1.8 V core supply with separate VCCIO banks for 1.8 V, 2.5 V, or 3.3 V I/O interfacing, and supports in-system programmability via IEEE 1532 or passive serial configuration modes. Up to four enhanced PLLs provide clock synthesis and skew management for high-speed designs.
The EPEX 20KC architecture uses a MultiCore fabric where each MegaLAB structure combines 16 logic elements (LEs) with a shared embedded system block (ESB) that can be configured as either additional logic or dual-port RAM. This dual-role memory architecture, combined with FastTrack continuous interconnect routing, enables predictable timing closure for designs up to 600K gates with internal frequencies typically targeting 100-300 MHz in commercial FPGAs of this node.
Typical applications include high-density data-path controllers, telecom switching fabrics, prototyping platforms for ASIC development, DSP co-processing cards, and industrial imaging pipelines. The wide I/O count and high gate density also make it useful for legacy systems requiring parallel bus interfaces, custom protocol bridging, or backplane glue logic in long-lifecycle programs.
When designing with this device, note that the part is now classified NRND/EOL; long-term availability is restricted, and second-source or Altera/Intel migration paths should be evaluated early. Designers must respect simultaneous-switching output (SSO) limits on the 1020-ball BGA, maintain continuous ground stitching beneath the package, and configure unused pins per the datasheet (typically as tri-stated inputs) to minimize leakage. Power sequencing of VCCINT before VCCIO is also required.
This page synthesizes distributor pricing, package-level same-footprint alternatives, and practical design notes not found in the Altera datasheet alone.
드롭인 대체품: EP20K600CF33C8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600CF33C8 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Core Supply Voltage (VCCINT), RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600CF33C7
✅ 드롭인✓ 재고 있음
$105.4 / 개
데이터시트 보기 →EP20K600CF33C7N
✅ 드롭인✓ 재고 있음
$110 / 개
데이터시트 보기 →EP20K600CF33C7ES
✅ 드롭인✓ 재고 있음
$140 / 개
데이터시트 보기 →EP20K600CF33C-7ES
✅ 드롭인✓ 재고 있음
$125.8 / 개
데이터시트 보기 →EP20K600CF33C-7ES
✅ 드롭인✓ 재고 있음
$125.8 / 개
데이터시트 보기 →EP20K600CF33C8 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Device Type | FPGA (Field Programmable Gate Array) |
| Typical Gates | 600,000 |
| Logic Elements | 24,320 |
| Embedded RAM Bits | 311,296 |
| Embedded System Blocks (ESB) | 152 |
| Maximum User I/O | 488 |
| Process Technology | 0.15 µm CMOS |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (bank-selectable) |
| LVDS Support | Yes, up to 840 Mbps |
| PLLs | 4 enhanced PLLs |
| 패키지 | 1020-ball FineLine BGA (FC-FBGA), 33 x 33 mm |
| Speed Grade | -8 |
| 동작 온도 | Commercial (0 °C to +85 °C) |
| Configuration Modes | Passive Serial, Passive Parallel Asynchronous, Passive Parallel Synchronous, JTAG |
| RoHS 상태 | Compliant (lead-free version) / non-compliant for legacy C-speed grade variant |
| Status | NRND / Last-Time-Buy (per Altera/Intel product notice) |
EP20K600CF33C8 1020-ball fineline bga (fc-fbga), 33 x 33 mm 핀 구성 가이드
EP20K600CF33C8(1020-ball fineline bga (fc-fbga), 33 x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K600CF33C8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K600CF33C8 적합 용도: 6 애플리케이션s: Telecom Switching Fabric, ASIC Prototyping Platform, Industrial Imaging Pipeline, DSP Co-Processor Card, Custom Protocol Bridging & Glue Logic, Legacy Test & Measurement Backplane.
Telecom Switching Fabric
The EP20K600CF33C8 fits telecom switching fabrics by combining 24,320 logic elements with 311,296 bits of dual-port embedded SRAM, enabling parallel cell processing and queue management. Its 488 user I/O pins handle multi-channel data planes at typical bus widths of 32-64 bits per direction, and the four enhanced PLLs support per-channel clock synthesis. Per the Altera datasheet, LVDS I/O at 840 Mbps is sufficient for legacy STS-1/STS-3 tributary interfaces. Designers typically pair it with TI TPS7A4701 LDOs for analog cleanliness and Micron SRAMs for packet buffering. The CF33 BGA's 33x33 mm form factor is well-suited to ATCA-style line cards with parallel backplane routing.
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ASIC Prototyping Platform
ASIC prototyping uses the EP20K600CF33C8's 600K-gate capacity and 488 I/O to map large RTL designs onto a programmable fabric. The MultiCore architecture and FastTrack interconnect preserve critical-path timing predictability, which is essential for clock-domain crossings and bus interfaces in pre-silicon validation. Its 311 Kbit ESB memory aids bus-functional models and on-chip transaction logging. The -8 speed grade supports internal frequencies up to ~200 MHz, matching typical ASIC target clocks. Developers often use it on validation boards alongside DDR2 memory controllers (e.g., Micron MT47H64M16) and high-speed SERDES for IO emulation.
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Industrial Imaging Pipeline
Industrial imaging systems leverage the EP20K600CF33C8's logic density to implement Bayer demosaicing, color-space conversion, and real-time image filtering at multi-megapixel resolutions. The 152 ESBs configured as FIFOs smooth pixel data flow between line-scan sensors and external memory, while the 488 I/O enable parallel LVDS or sub-LVDS camera-link inputs. With -8 speed grade, frame-level pipelines can sustain 60-100 MHz pixel clocks, suiting 5MP sensors at 30 fps. The 1.8 V core plus selectable VCCIO rails (1.8/2.5/3.3 V) simplify interfacing with CMOS image sensors (e.g., ON Semi MT9P031) and DDR memory controllers.
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DSP Co-Processor Card
DSP co-processor designs use the EP20K600CF33C8 to implement hardware accelerators offloading FFTs, FIR filters, or encryption from a host DSP or embedded CPU. The 24,320 logic elements and 311 Kbit embedded RAM realize multiply-accumulate (MAC) pipelines with single-cycle ESB access, and the LVDS I/O enables high-throughput data exchange with adjacent DSPs (e.g., TI TMS320C6x). Four enhanced PLLs provide low-skew clock distribution across parallel data lanes. The CF33 1020-ball BGA allows dense PCB layout with controlled-impedance traces for >100 MHz bus operation. Power is typically 4-6 W at full utilization.
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Custom Protocol Bridging & Glue Logic
Custom protocol bridges use the EP20K600CF33C8 to convert between legacy buses (VME, PCI, I2C, SPI) and modern serial protocols, removing ASIC design cycles. The 488 user I/O and MultiCore logic fabric support multiple protocol stacks simultaneously, and JTAG/IEEE 1532 configuration enables field firmware updates. The 1.8 V core with 3.3 V-tolerant I/O banks eases interfacing with legacy 5 V-translating buffers via external level shifters. With its large RAM blocks, the EP20K600CF33C8 also hosts on-chip protocol buffers. Designers use it for VME-to-PCI bridges in test equipment and backplane interface cards.
추천
Legacy Test & Measurement Backplane
Test & measurement backplanes deploy the EP20K600CF33C8 as a programmable pattern generator, frame synchronizer, or data aggregator. Its high I/O count and 24K logic elements support multi-channel waveform synthesis, while the 311 Kbit ESB memory accommodates deep circular sample buffers. The -8 speed grade enables real-time triggering at hundreds of MHz, and LVDS I/O interfaces directly to high-speed ADCs (e.g., ADI AD9226). The CF33 BGA's dense ball array supports compact line-card layouts that fit PXI/cPCI architectures for instrumentation systems.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K600CF33C8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600CF33C7 | EP20K600CF33C7N | EP20K600CF33C7ES | EP20K600CF33C-7 | EP20K600CF33C-7ES |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA (33x33 mm) | 1020-ball FC-FBGA (33x33 mm) - same | 1020-ball FC-FBGA (33x33 mm) - same | 1020-ball FC-FBGA (33x33 mm) - same | 1020-ball FC-FBGA (33x33 mm) - same | 1020-ball FC-FBGA (33x33 mm) - same |
| Speed Grade | -8 | -7 (slower) | -7 (slower) | -7 (slower) | -7 (slower) | -7 (slower) |
| Typical Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded RAM (bits) | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 |
| Lead-Free / RoHS | Varies (legacy C-suffix is non-RoHS; modern -N suffix is RoHS) | Varies | Yes (RoHS) | Varies | Varies | Varies |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Faster -8 speed grade (vs EP20K600CF33C7)
- High I/O count in single package (vs EP20K600CB652C8 (652-ball BGA))
- MultiCore fabric with FastTrack routing (vs EP20K400CF672C8 (400K gates, smaller density))
설계 노트
Estimated: at 200 MHz internal frequency with 80% logic utilization, the EP20K600CF33C8 dissipates approximately 4-6 W from VCCINT (1.8 V). Use at least 100 µF bulk plus 0.1 µF and 0.01 µF ceramic decoupling near each VCCINT pin. VCCIO banks must be powered before VCCINT to avoid latch-up; sequence the 1.8 V core with a TI TPS7A4701 LDO or equivalent switching regulator with proper soft-start.
The 1020-ball FC-FBGA uses 1.27 mm ball pitch on a 33x33 mm substrate. Use microvia (HDI) PCB technology with sequential lamination to route inner balls. Per the Altera package design guide, place at least one full power/ground plane pair as the second layer stack-up, and provide continuous ground stitching vias around the BGA perimeter to suppress SSO noise.
Do not leave user I/O pins floating. Unused pins should be configured as tri-stated inputs with weak pull-ups via Quartus Pin Planner. Monitor nSTATUS during configuration; if it stays low, VCCINT has not reached the trip voltage or the configuration bitstream is corrupted. For JTAG programming, TMS and TDI must have pull-ups and TCK a pull-down if no programmer is attached.
When routing LVDS pairs on this device, maintain 100 Ω differential impedance and keep intra-pair skew below 50 ps. Use length-matching within 150 ps of the LVDS clock for source-synchronous interfaces. The EP20K600CF33C8 supports up to 840 Mbps LVDS, which corresponds to roughly 16 ps unit interval - PCB material loss (FR-4 vs low-loss) becomes critical above 500 Mbps.
규정 준수 정보
Compliance flags vary by date code and suffix: -N suffix parts are typically RoHS compliant / lead-free, while legacy C-suffix parts may be non-RoHS. The original APEX 20KC family pre-dates mandatory RoHS. Verify with date code and distributor documentation.
