EP20K600CF33C7N - APEX 20KC FPGA, 600K Gates, 1020-FBGA | Intel/Altera
부품 번호: EP20K600CF33C7N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $156.1 | $156.10 |
| 10 | $148.5 | $1,485.00 |
| 100 | $135 | $13,500.00 |
| 500 | $122 | $61,000.00 |
| 1,000 | $110 | $110,000.00 |
EP20K600CF33C7N 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architectural density of gate arrays with the design flexibility of user-programmable interconnects and logic blocks. APEX 20KC belongs to the APEX-20K family hierarchy (APEX-20K -> programmable logic device -> PLD -> integrated circuit -> semiconductor). It sits above traditional CPLDs in density and is widely used for glue logic, bus bridging, DSP datapaths, and ASIC prototyping. The EP20K600CF33C7N uses MultiCore architecture combining Look-Up Tables (LUTs) with embedded memory blocks, enabling logic and memory in a single fabric.
Key features include a 1.48 ns pin-to-pin logic delay, 1.8 V VCCINT supply (1.71 V to 1.89 V), embedded CAM blocks for fast table lookup, dedicated clock management via four PLLs, and LVTTL/LVCMOS I/O support. The 1020-FBGA package provides high I/O density suitable for complex backplane and datapath designs, while the -7 speed grade indicates an industrial-temperature capable silicon grade.
Typical applications include ASIC prototyping, high-speed datapath glue logic, communications infrastructure line cards, industrial control subsystems, and legacy telecom backplane bridges. The wide gate count and embedded memory make it ideal for designs requiring parallel processing and fast on-chip storage without external SRAM.
When designing with the EP20K600CF33C7N, ensure thermal management via PCB copper pour and airflow, follow Intel/Altera configuration guidelines (PS configuration mode or JTAG), and account for the 33 mm × 33 mm BGA pitch during PCB layout. The device is now mature; consider Cyclone or Stratix equivalents for new designs.
드롭인 대체품: EP20K600CF33C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600CF33C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Series, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600CF33C7
✅ 드롭인✓ 재고 있음
$105.4 / 개
데이터시트 보기 →EP20K600CF33C7ES
✅ 드롭인✓ 재고 있음
$140 / 개
데이터시트 보기 →EP20K600CF1020C7
✅ 드롭인✓ 재고 있음
$212.4 / 개
데이터시트 보기 →EP20K600CF1020C8
✅ 드롭인✓ 재고 있음
$92 / 개
데이터시트 보기 →EP20K600CF1020C9
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP20K600CB652C7
✅ 드롭인✓ 재고 있음
$1320 / 개
데이터시트 보기 →EP20K600CF33C7N 최대 정격 & 전기적 특성
| Series | APEX-20K |
| Family | APEX 20KC |
| Logic Elements / Cells | 24320 |
| Total Gates | 600000 |
| Total RAM Bits | 311296 |
| Number of PLLs | 4 |
| Pin-to-Pin Logic Delay (tPD) | 1.48 ns |
| Max Operating Frequency | 375.94 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| Supplier Device Package | 1020-FBGA (33 x 33 mm) |
| 패키지 / 케이스 | 1020-BBGA, FCBGA |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 °C to 85 °C (commercial, based on speed grade C7) |
EP20K600CF33C7N 1020-bbga, fcbga 핀 구성 가이드
EP20K600CF33C7N(1020-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K600CF33C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K600CF33C7N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Telecom Backplane Glue Logic, Industrial Control and Machine Vision, Legacy DSP Datapath Implementation, Test and Measurement Instrumentation, Aerospace and Defense Legacy Systems.
ASIC Prototyping and Emulation
The EP20K600CF33C7N delivers 600,000 system gates and 24,320 logic elements, providing ample density for prototyping mid-complexity ASICs in a single FPGA. According to the manufacturer datasheet, the embedded SRAM (311,296 bits) and four PLLs allow the device to emulate ASIC datapaths including clock trees, FIFO buffers, and register files. The 1.48 ns pin-to-pin logic delay ensures timing-faithful emulation of most ASIC critical paths, while the 1020-FBGA 33x33 mm package supplies abundant user I/O for boundary-scan and parallel-bus probing. Designers partition the ASIC into clock domains using the on-chip PLLs and route test vectors through JTAG or passive serial configuration. For production ASIC emulation racks, dozens of EP20K600CF33C7N devices can be cascaded via dedicated interconnect. Although newer Altera/Intel families offer larger densities, the APEX 20KC remains a reliable choice for legacy emulation systems.
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Telecom Backplane Glue Logic
The EP20K600CF33C7N is well-suited for telecom backplane bridging applications where high I/O count and deterministic logic are required. The 1020-FBGA package exposes hundreds of user I/Os that can be assigned to LVTTL or LVCMOS standards, allowing the device to interface with legacy TDM buses, parallel data streams, and backplane transceivers. The four PLLs generate independent clocks for line-card and switch-fabric domains, while the 311,296 bits of embedded RAM implement elastic stores and small protocol buffers without external SRAM. According to the manufacturer datasheet, the 0.15 µm CMOS process provides robust 3.3 V I/O tolerance, which simplifies integration into mixed-voltage backplanes. Engineers commonly use APEX 20KC devices for protocol adaptation between E1/T1 framers, HDLC controllers, and asynchronous transfer mode (ATM) layers. The -7 speed grade (375 MHz internal performance) is more than sufficient for OC-3 and below line rates.
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Industrial Control and Machine Vision
The EP20K600CF33C7N is frequently used in industrial machine-vision controllers where parallel pixel pipelines must be processed in real time. The 24,320 logic elements and embedded SRAM support real-time image preprocessing such as thresholding, blob detection, and histogram computation, while the four PLLs generate pixel-clock, line-sync, and frame-sync domains. The 1020-FBGA package provides sufficient I/O for parallel camera interfaces (Camera Link base/medium) and PLC backplane connections. According to the manufacturer datasheet, the device operates from a single 1.8 V core supply with separate VCCIO rails for mixed I/O standards, simplifying power-tree design on industrial PLCs. Engineers embed CAM blocks (content-addressable memory) for fast lookup-table-driven image transforms. The commercial 0-85 °C temperature range suits factory-floor enclosures, and the rugged FBGA package tolerates moderate vibration when properly socketed or BGA-underfilled.
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Legacy DSP Datapath Implementation
The EP20K600CF33C7N implements moderate-complexity DSP datapaths such as FIR filters, FFT butterflies, and Reed-Solomon codecs using its MultiCore architecture. According to the manufacturer datasheet, the combination of 24,320 LEs and 311,296 bits of embedded RAM allows pipelined multiply-accumulate engines to be constructed entirely on-chip, eliminating external memory bottlenecks. The four PLLs provide independent sample-rate and processor clocks, enabling multi-rate DSP systems. Industrial and military DSP designs historically leveraged APEX 20KC for radar preprocessing and software-defined radio baseband. While modern Stratix and Arria devices deliver far higher DSP throughput, the EP20K600CF33C7N remains a cost-effective solution for legacy maintenance and low-volume DSP modules.
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Test and Measurement Instrumentation
The EP20K600CF33C7N is used in high-channel-count test and measurement equipment such as logic analyzers, protocol testers, and mixed-signal ATE fixtures. The 1020-FBGA package delivers hundreds of I/Os for probe multiplexing and stimulus generation, while the 311,296 bits of embedded RAM capture transient waveforms without off-chip buffering. According to the manufacturer datasheet, the 1.48 ns tPD enables sub-2 ns edge placement resolution for ATE pattern generation. Engineers configure the device via JTAG for in-system programming during test development and rely on the four PLLs to generate multiple timing edges per channel. Although obsolete, the APEX 20KC remains in service at many calibration labs and semiconductor test houses, with Rochester Electronics providing continued authorized supply.
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Aerospace and Defense Legacy Systems
The EP20K600CF33C7N is deployed in legacy aerospace and defense subsystems including radar front-ends, secure communications terminals, and avionics data concentrators. According to the manufacturer datasheet, the -7 speed grade and 1020-FBGA package are qualified under Altera's industrial-grade screening, and the four PLLs provide the deterministic clocking required for synchronous serial protocols used in MIL-STD-1553 and ARINC 429 interfaces. The 24,320 LEs implement channel-selection logic, while the embedded RAM stores mission-specific waveforms. Long-term defense programs continue to specify APEX 20KC because redesign qualification costs are prohibitive, and authorized aftermarket distributors maintain pedigree documentation. For new aerospace designs, radiation-hardened Microsemi/Actel or newer Intel Cyclone variants are preferred.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K600CF33C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600CF33C7 | EP20K600CF33C7ES | EP20K600CF1020C7 | EP20K600CF1020C8 | EP20K600CF1020C9 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-BGA - same family | 1020-BGA - same family | 1020-BGA - same family |
| Logic Elements / Cells | 24320 | 24320 | 24320 | 24320 | 24320 | 24320 |
| Total RAM Bits | 311296 | 311296 | 311296 | 311296 | 311296 | 311296 |
| Core Voltage (VCCINT) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) |
| Speed Grade | -7 | -7 | -7 ES | -7 | -8 | -9 |
| Process Technology | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Lead-free / RoHS-compliant APEX 20KC variant (vs EP20K600CF33C7)
- Industrial-grade silicon screening (vs EP20K600CB652C7)
- Drop-in compatible with -7 speed grade (vs EP20K600CF1020C8 (speed grade -8))
설계 노트
Estimated: at 1.8 V core and typical 30% toggle rate, the EP20K600CF33C7N draws roughly 0.8-1.5 A from VCCINT and 0.3-0.6 A from VCCIO, requiring at least four bulk 100 µF tantalum or polymer capacitors plus 0.1 µF + 0.01 µF ceramic decoupling per VCC pin. Designers must provide separate regulator rails for VCCINT (1.8 V) and VCCIO (3.3 V typical); tying them together will damage the device. A low-dropout regulator with 3 A capacity is recommended for VCCINT and a 1.5 A regulator for VCCIO. Power sequencing requires VCCINT to rise no faster than 50 ms and VCCIO to follow within 200 ms.
Estimated: at 1.5 A core current and 0.15 µm process, the EP20K600CF33C7N dissipates roughly 2.7 W. The 1020-FBGA package has a typical θJA of 12 °C/W with adequate PCB thermal vias, yielding about 32 °C rise above ambient. Designers should provide a minimum 4-layer PCB with a continuous ground/power plane below the BGA and at least 9 thermal vias under the die flag. For enclosed industrial enclosures, 100 LFM airflow is recommended. Do not rely on natural convection alone in sealed enclosures.
The 1020-FBGA package requires 1.27 mm ball pitch PCB land pads with non-solder-mask-defined (NSMD) finish for reliable solder joint formation. Use 0.5 mm drill microvias in a dog-bone or via-in-pad pattern under the BGA. Match the package's 33 mm × 33 mm body exactly. Add a 4 mm × 4 mm keepout under the die for thermal vias. Signal escape routing requires the top layer plus at least two inner stripline layers; 50 Ω controlled impedance is recommended for clocks and high-speed I/O.
Common pitfalls include (1) attempting to configure via JTAG while MSEL pins are strapped for passive serial mode, resulting in configuration failure; (2) omitting the 10 kΩ pull-up on nCONFIG or 1 kΩ pull-up on nSTATUS, leaving the device in an indeterminate state; (3) forgetting to power-cycle after a failed configuration, which requires a 1 µs minimum low pulse on nCONFIG to reset; (4) using 5 V LVTTL signals on VCCIO=3.3 V banks, damaging I/O cells. Always verify the MSEL[2:0] strapping resistors match the intended configuration scheme.
Place the EPC16 or EPCS configuration memory within 50 mm of the EP20K600CF33C7N to avoid signal-integrity issues on the 20 MHz configuration clock. Route nCONFIG, nSTATUS, CONFIG_DONE, and DCLK on inner layers with 50 Ω impedance and 22 Ω series damping resistors. Keep PLL analog supplies (VCCA_PLL) filtered with a ferrite bead plus 10 µF + 0.1 µF network. Each PLL pair should have its own isolated ground island connected to the main ground at a single point.
규정 준수 정보
Lead-free per 'N' suffix. APEX 20K family is not AEC-Q100 qualified (industrial/commercial grade only).