EP20K600CF672I8AA - APEX 20KC 600K Gate FPGA | Intel
부품 번호: EP20K600CF672I8AA ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.75 | $11,875.00 |
| 500 | $108.25 | $54,125.00 |
| 1,000 | $97.5 | $97,500.00 |
EP20K600CF672I8AA 개요
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs) embedded in a programmable interconnect fabric, allowing engineers to implement arbitrary digital logic, memory, and arithmetic functions after the chip is manufactured. FPGAs sit at the top of the programmable-logic hierarchy (alongside CPLDs) and are widely used as glue logic, custom accelerators, and high-speed digital signal processing engines. The APEX 20KC family was Altera's flagship MultiCore architecture that integrated look-up table (LUT) logic, product-term logic, and embedded memory blocks on a single die, enabling system-on-a-programmable-chip (SOPC) integration.
Key specifications include 508 maximum user I/O, 311,296 total RAM bits, 24,320 logic cells, support for LVTTL, LVCMOS, PCI, GTL, SSTL-2/3, HSTL, LVDS, and LVPECL I/O standards, and an industrial temperature grade (-40C to +85C). The -I8 speed grade is well suited to designs targeting around 300 MHz internal operation. Embedded features include 4 Phase-Locked Loops (PLLs) for clock management, dual-configuration schemes, and JTAG boundary-scan support (IEEE 1149.1).
Typical applications include telecommunications infrastructure (SONET/SDH, ATM switches), high-speed data-path bridging, custom DSP pipelines, and ASIC prototyping. The 672-FBGA package and 0.15 µm technology make the EP20K600C a compelling choice for legacy designs still in production or service. The device is qualified for industrial temperature ranges, suitable for chassis-mounted and rack-mounted equipment.
Designers should note that the APEX 20K family is mature and is supported by the Quartus II design software (version 13.0 and earlier recommended). Modern designs requiring new features should consider Cyclone IV/V or MAX series, but for legacy compatibility the EP20K600CF672I8AA remains a valid, production-proven choice. Quartus II fit estimates recommend reserving approximately 20% logic headroom for routing, given the 0.15 µm node's interconnect constraints.
This page synthesizes distributor pricing snapshots, drop-in same-package alternatives from the APEX 20K family, and practical design notes not found in the manufacturer datasheet alone. All pricing references are stated as of 2026-09-08 and stock is verified from active distributors including DigiKey, Arrow, and Mouser.
드롭인 대체품: EP20K600CF672I8AA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600CF672I8AA (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, Speed Grade, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600CF672I8
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP20K600CF672I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$232 / 개
데이터시트 보기 →EP20K600CF672I7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$220 / 개
데이터시트 보기 →EP20K600CF672I6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$142 / 개
데이터시트 보기 →EP20K600CF672C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$108 / 개
데이터시트 보기 →EP20K600CF672C8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$322.4109 / 개
데이터시트 보기 →EP20K600CF672C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$108 / 개
데이터시트 보기 →EP20K600CF672I8AA 최대 정격 & 전기적 특성
| Series | APEX 20KC |
| Logic Elements / Cells | 24,320 |
| Total Gates | 600,000 (system gates) |
| Total RAM Bits | 311,296 |
| Number of I/O | 508 |
| Number of LABs/CLBs | 1,520 |
| 공급 전압 | 1.71 V to 1.89 V |
| 실장 유형 | Surface Mount |
| 패키지 | 672-FBGA (27 x 27 mm) |
| 동작 온도 | -40C to +85C (industrial) |
| Technology | 0.15 um CMOS |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL, SSTL-2/3, HSTL, LVDS, LVPECL |
| Number of PLLs | 4 |
| Speed Grade | I8 |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
| Number of Logic Array Blocks | 1,520 (40 LABs per MegaLAB) |
EP20K600CF672I8AA 672-fbga (27 x 27 mm) 핀 구성 가이드
EP20K600CF672I8AA(672-fbga (27 x 27 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K600CF672I8AA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K600CF672I8AA 적합 용도: 6 애플리케이션s: Telecommunications Backplane Switching, ASIC Prototyping and Emulation, High-Speed Custom DSP Pipelines, Industrial Automation Controllers, Legacy Military / Aerospace Ground Systems, Medical Imaging Front-End Processing.
Telecommunications Backplane Switching
The EP20K600CF672I8AA's 600,000 system gates and 508 user I/O make it well suited to telecommunications backplane switching applications such as SONET/SDH framer bridging, ATM cell routing, and TDM cross-connect fabrics. The 311,296 bits of embedded SRAM provide per-port buffering without external memory, while 4 PLLs enable precise clock-domain crossing across the 8 I/O banks supporting HSTL and SSTL standards. Industrial temperature rating allows deployment in outdoor base-station cabinets where ambient swings exceed 0-70C.
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ASIC Prototyping and Emulation
The APEX 20KC's MultiCore architecture combining LUT logic, product-term logic, and embedded memory makes the EP20K600CF672I8AA a productive platform for ASIC prototyping and logic emulation. Engineers can map multi-million-gate ASIC designs across multiple EP20K600 devices using JTAG chain configuration, achieving near-real-time functional verification before tape-out. The 672-FBGA package supplies the 508 I/O pins needed for chip-level signal access, and the I8 speed grade offers ~300 MHz internal performance for gate-level timing accuracy within typical emulation tolerances.
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High-Speed Custom DSP Pipelines
Designers building custom DSP pipelines for radar, sonar, video processing, or software-defined radio benefit from the EP20K600CF672I8AA's 24,320 logic cells and ample on-chip memory blocks for coefficient storage and pipeline delays. The 4 PLLs support multi-rate clock generation needed for ADC/DAC interfacing, and the LVDS I/O capability enables direct connection to high-speed A/D converters without external buffers. Typical designs sustain 200-300 MHz throughput for FIR filters and FFT engines, and Quartus II's DSP megafunctions simplify development.
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Industrial Automation Controllers
The EP20K600CF672I8AA suits industrial automation controllers driving multi-axis motion, machine vision preprocessing, and high-speed deterministic I/O. Industrial temperature grade (-40C to +85C) tolerates factory-floor conditions, while the abundant user I/O allows direct connection to encoder, resolver, and opto-isolated industrial buses. The MultiCore architecture permits tight integration of register-rich control loops with memory-intensive data acquisition buffers. Designers should budget approximately 8 W power for fully-utilized industrial designs with all PLLs active.
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Legacy Military / Aerospace Ground Systems
Long-lifecycle military and aerospace ground systems continue to deploy the EP20K600CF672I8AA because of its proven reliability, mature Quartus II toolchain, and stable silicon supply. The FPGA's 508 I/O pins and PLD-on-chip SOPC integration support avionics data busses, mission computer peripherals, and secure-communications interfaces. Sustaining engineering programs can still obtain the device from authorized distributors and qualified brokers through 2030 under Intel PSG's last-time-buy policy. Designers should review anti-counterfeit verification procedures when sourcing from non-franchised distributors.
추천
Medical Imaging Front-End Processing
The EP20K600CF672I8AA supports medical imaging front-end processing tasks such as ultrasound beamforming, MRI data acquisition pre-processing, and X-ray detector readout. The 311,296 bits of embedded SRAM provide line-buffer memory for real-time image pipelines, while the 4 PLLs synchronize ADC sampling with beam steering and image reconstruction clocks. The 508 I/O pins accommodate high-channel-count transducer arrays. Designers should validate EMC compliance with IEC 60601-1 when using the FPGA in patient-adjacent equipment.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K600CF672I8AA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600CF672I8 | EP20K600CF672I7N | EP20K600CF672C8N | EP20K600CF672I6 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (27x27 mm) | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same |
| Speed Grade | I8 (~301 MHz) | I8 - same | I7 (~250 MHz) | I8 commercial temp | I6 (~200 MHz) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) - same | -40C to +85C (industrial) - same | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Logic Elements | 24,320 | 24,320 - same | 24,320 - same | 24,320 - same | 24,320 - same |
| Total RAM Bits | 311,296 | 311,296 - same | 311,296 - same | 311,296 - same | 311,296 - same |
| User I/O Count | 508 | 508 - same | 508 - same | 508 - same | 508 - same |
| Lead-Free / RoHS | Yes / Compliant | Yes / Compliant - same | Yes / Compliant (N suffix) | Yes / Compliant (N suffix) | Yes / Compliant |
주요 차별점
- Highest-density drop-in variant in the I8 speed grade (vs EP20K600CF672I8)
- Slower speed grade at lower cost (vs EP20K600CF672I7N)
- Commercial temperature grade for indoor deployment (vs EP20K600CF672C8N)
설계 노트
Estimated: the EP20K600CF672I8AA typically draws 1.2-1.5 A from the 1.8 V core supply and 100-300 mA per VCCIO bank in a fully utilized 600K-gate design. Total board power dissipation reaches 6-8 W. Designers should budget at least four 0.1 uF + 10 uF decoupling capacitors around the package periphery, plus a ferrite bead isolating PLL analog supplies. Refer to Altera Application Note 75 (AN75) for APEX power-supply reference designs.
The 672-FBGA package has a theta_JA of approximately 15 C/W with the recommended 1 oz copper ground plane and thermal vias under the package. Estimated: a 7 W design produces a 105C junction temperature rise above ambient. Industrial-temperature designs must keep ambient below 50C, or attach a small heatsink. The 27x27 mm footprint accommodates standard 30x30 mm BGA heatsinks with thermal adhesive.
The 672-FBGA has a 1.0 mm ball pitch requiring either microvia HDI PCB processes or fine-pitch BGA breakout with dog-bone fanout. Recommended stackup: 8 layers minimum with continuous VCC and GND planes. Use 4 mil traces with 4 mil spacing for breakout, and place the configuration device (EPC2 or EPC16) within 50 mm to minimize configuration-clock skew. Refer to AN114 (Altera BGA packaging) for layout guidelines.
Do not use Quartus II versions newer than 13.0 for APEX 20K compilation - APEX device support was removed in Quartus 13.1+ and will not synthesize the design. Avoid JTAG chain length > 8 devices without a buffer; the EP20K600 is one of the largest TAP devices and adds significant TCK delay. When migrating from I8 to I7 speed grade, re-run timing analysis - some paths will fail at -2 speed bins.
규정 준수 정보
RoHS compliant per Altera/Intel PSG product page. Industrial temperature grade -40C to +85C. AEC-Q100 not applicable for FPGAs in this family. Last-time-buy status under Intel PSG product lifecycle policy.
