EP20K1000CF672C9ES - 1M Gate APEX 20KC FPGA 508 I/O | Intel
부품 번호: EP20K1000CF672C9ES ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $437 | $43,700.00 |
| 500 | $410 | $205,000.00 |
| 1,000 | $385 | $385,000.00 |
EP20K1000CF672C9ES 개요
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit that lets designers implement arbitrary digital logic through programmable logic blocks, interconnect, and I/O. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs in the programmable logic family, distinguished from CPLDs by higher logic density and embedded memory. The APEX 20KC family specifically targets high-performance, I/O-rich designs such as data-path bridging, telecom backplanes, and DSP front-ends.
Key features include 3,840 LABs/CLBs (Logic Array Blocks), 327,680 total RAM bits for on-chip buffering, and a 27 x 27 mm FC-FBGA footprint that supports high-density board integration. The device is specified for 0 °C to 85 °C junction temperature operation, making it suitable for commercial and industrial environments but not extended-temperature automotive. Surface-mount assembly follows JEDEC moisture-sensitivity handling for large BGAs.
Architecturally, the APEX 20KC combines look-up-table based logic elements with embedded memory and a high-speed MultiCore interconnect. The 1.8 V core supply and 0.15 µm geometry deliver a 250 MHz performance grade, while 508 user I/Os support wide parallel buses, LVDS pairs, and standard CMOS interfaces. This positions the part between mid-range Cyclone devices and high-end Stratix families of its generation.
Typical applications include telecom line-card processing, high-speed serial protocol bridging, industrial machine vision pipelines, and test-and-measurement instrumentation. Designers also deploy the EP20K1000CF672C9ES in legacy FPGA upgrades where pin-compatible replacements must preserve existing PCB footprints.
The device is currently marked Obsolete, so design teams should plan for last-time-buy windows and verify long-term supply. Quartus II design software (legacy releases) supports this part. Always validate signal integrity on dense BGA fanouts and use JEDEC-compliant reflow profiles to avoid package warpage.
This page synthesizes distributor stock, drop-in same-package alternatives from the APEX 20KC family, and practical design notes not aggregated on any single manufacturer or distributor page.
드롭인 대체품: EP20K1000CF672C9ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K1000CF672C9ES (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Configuration Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K1000CF672C7ES
✅ 드롭인✓ 재고 있음
$89.5 / 개
데이터시트 보기 →EP20K1000CF672C8ES
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP20K1000CF672C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$158 / 개
데이터시트 보기 →EP20K1000CF672C7GZ
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$162.4 / 개
데이터시트 보기 →EP20K1000CF672C8N
✅ 드롭인✓ 재고 있음
$178.4 / 개
데이터시트 보기 →EP20K1000CF672C8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$245.09 / 개
데이터시트 보기 →EP20K1000CF672C9ES 최대 정격 & 전기적 특성
| Series | APEX 20KC |
| Number of Logic Elements/Cells | 38,400 |
| System Gates | 1,000,000 |
| Number of LABs/CLBs | 3,840 |
| Total RAM Bits | 327,680 |
| Number of User I/O | 508 |
| Core Supply Voltage | 1.71 V to 1.89 V |
| Process Technology | 0.15 µm |
| Internal Performance Grade | 250 MHz |
| Operating Temperature (TJ) | 0 °C to 85 °C |
| 패키지 | 672-FBGA (27 x 27 mm) |
| 실장 유형 | Surface Mount |
| Supplier Device Package | 672-FBGA |
EP20K1000CF672C9ES 672-fbga 핀 구성 가이드
EP20K1000CF672C9ES(672-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K1000CF672C9ES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K1000CF672C9ES 적합 용도: 6 애플리케이션s: Telecom Line-Card Processing, High-Speed Serial Protocol Bridging, Industrial Machine Vision Pipelines, Test and Measurement Instrumentation, Legacy FPGA Board Repair and Sustaining, DSP Front-End Data Acquisition.
Telecom Line-Card Processing
The EP20K1000CF672C9ES fits telecom line-card processing because its 38,400 logic elements and 508 user I/Os implement wide parallel backplane buses, ATM/SONET framers, and HDLC controllers on a single die. The 327,680 bits of embedded RAM buffer cells and packet descriptors without external SRAM, while 250 MHz performance grade supports OC-48 (2.5 Gbps) class throughput when paired with external SERDES. Compared with newer Cyclone families, the APEX 20KC delivers equivalent gate density at mature 0.15 µm, which many legacy central-office designs still specify. Designers should pair the FPGA with 1.8 V core and 2.5 V/3.3 V I/O bank supplies, using per-bank VCCIO to interface ECL/CMOS line-interface units. The 672-FBGA package requires JEDEC-compliant reflow and four-layer-plus stack-ups to maintain signal integrity on 508 I/Os.
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High-Speed Serial Protocol Bridging
The EP20K1000CF672C9ES is well suited to high-speed serial protocol bridging between SPI, I2C, UART, proprietary LVDS, and parallel buses where off-the-shelf ASSPs are unavailable. Its 38,400 logic elements implement state machines, FIFO controllers, and CRC engines in parallel, while 327 kbit of embedded RAM stages packets without external memory. The 250 MHz grade supports 200+ MHz internal operation with pipelined datapaths. Compared with CPLDs, the APEX 20KC handles multi-channel bridging without exhausting logic, and 508 I/Os allow direct fanout to backplane connectors. Engineers should use Quartus II's LogicLock to floorplan critical paths and reserve dedicated clock pins for serializer/deserializer logic. Power planning must address the 1.8 V core (linear LDO from 2.5 V) and per-bank VCCIO for mixed-voltage peripherals.
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Industrial Machine Vision Pipelines
The EP20K1000CF672C9ES supports industrial machine vision pipelines where image sensors stream parallel pixel data at 40-80 MHz. The device's 38,400 logic elements implement Bayer demosaicing, color-space conversion, edge detection, and histogram accumulation in real time, while 327 kbit embedded RAM holds line buffers without external SRAM. With 508 user I/Os, designers can interface Camera Link, LVDS, and parallel CMOS sensors directly. The 250 MHz performance grade sustains 1080p60 throughput when pipelined, and the 0 °C to 85 °C junction range covers factory-floor environments. Compared with DSPs, the APEX 20KC achieves higher pixel throughput per watt on custom kernels. Use 1.8 V core LDO with bulk decoupling, expose JTAG for factory programming, and verify reflow profile meets JEDEC J-STD-020 for the 672-FBGA.
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Test and Measurement Instrumentation
The EP20K1000CF672C9ES is used in test-and-measurement instrumentation such as logic analyzers, protocol exercisers, and ATE pin-electronics cards. Its 508 I/Os drive and receive high-channel-count test points, while 38,400 logic elements implement pattern generators, comparator trees, and timing engines in a single device. The 327,680-bit RAM stores captured waveform segments for post-processing, eliminating external SRAM. The 250 MHz grade supports 200 MHz state-based stimulus, which covers most digital bus standards. Compared with microcontrollers, the FPGA delivers deterministic timing and parallel I/O updates. The 672-FBGA footprint simplifies routing on multi-layer test-head boards. Designers should use Quartus II's TimeQuest to constrain setup/hold across 508 I/Os and provision JTAG boundary-scan for board-level test.
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Legacy FPGA Board Repair and Sustaining
The EP20K1000CF672C9ES remains valuable for legacy FPGA board repair and sustaining engineering where existing designs depend on the APEX 20KC silicon and 672-FBGA footprint. Its 1,000,000 system gates and 38,400 logic elements replicate the original design's logic density exactly, and the 672-ball FBGA is pin-compatible with C7/C8 speed-grade variants, allowing same-footprint replacements. Engineers performing board repair can substitute the faster C7/C8 parts to gain timing margin without redesign. The 0 °C to 85 °C junction range matches the original industrial spec. Compared with migrating to newer families, sustaining on APEX 20KC avoids costly PCB rework and qualification cycles. Procure through last-time-buy agreements and validate bitstream compatibility in Quartus II legacy toolchain before deploying.
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DSP Front-End Data Acquisition
The EP20K1000CF672C9ES supports DSP front-end data acquisition by implementing FIR filters, FFT pre-processors, and decimation chains ahead of external DSP or DAC. Its 38,400 logic elements and embedded multipliers handle 18-bit x 18-bit MAC operations in parallel, while 327,680 bits of RAM stage coefficients and overlap-save buffers. The 508 I/Os accept parallel ADC data at sample rates up to 200 MHz when pipelined. Compared with dedicated DSP processors, the APEX 20KC achieves higher throughput on custom kernels and avoids software overhead. Designers should use Quartus II DSP Builder or hand-coded RTL for filter implementations, and constrain clock-domain crossings carefully between the 250 MHz logic and the ADC sample clock. The 672-FBGA package requires 6+ layer PCB stack-up for signal integrity.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K1000CF672C9ES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K1000CF672C7ES | EP20K1000CF672C8ES | EP20K1000CF672C7 | EP20K1000CF672C7GZ | EP20K1000CF672C8N | EP20K1000CF672C8 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (27x27) | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Speed Grade | C9 (9 ns) | C7 (faster) | C8 (faster) | C7 (faster) | C7 (faster) | C8 (faster) | C8 (faster) |
| User I/O | 508 | 508 | 508 | 508 | 508 | 508 | 508 |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Total RAM Bits | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 |
| Shipping Media | Tray (ES) | Tray (ES) | Tray (ES) | Tray/Tape | Green/RoHS | Lead-free (N) | Tray/Tape |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- ES suffix denotes engineering-sample shipping media (vs EP20K1000CF672C7ES)
- C9 speed grade is the slowest tier in the APEX 20KC 672-FBGA family (vs EP20K1000CF672C7ES)
- Lead-free N media variant available (vs EP20K1000CF672C8N)
설계 노트
The EP20K1000CF672C9ES draws significant core current from the 1.8 V VCCINT rail under full utilization. Estimated: at 250 MHz with 80% logic utilization, typical core current reaches 2-3 A, requiring a low-dropout regulator with at least 4 A headroom. Use bulk decoupling (4 x 100 µF tantalum + 16 x 0.1 µF ceramic) directly under the BGA, and route a power plane on an inner PCB layer for VCCINT. Per-bank VCCIO supplies (2.5 V or 3.3 V) must be independently decoupled to prevent I/O switching noise from coupling into the core supply.
The 672-FBGA package has a 1.0 mm ball pitch, requiring microvia (laser-drilled) or via-in-pad PCB technology to fan out 508 user I/Os plus power and ground. Estimated: a 6-layer stack-up with two signal layers and two dedicated power planes is the practical minimum. Trace impedance should target 50 Ω single-ended and 100 Ω differential for LVDS pairs. Follow JEDEC J-STD-020 reflow profiles and MSL3 handling (or better) to avoid package warpage; large BGAs are sensitive to moisture-induced delamination during assembly.
Estimated: at full 250 MHz operation with high toggle rates, junction-to-ambient thermal resistance (theta_JA) for the 27 x 27 mm FBGA on a 6-layer JEDEC board is approximately 15-18 °C/W. With 2.5 W dissipation, junction temperature rises 38-45 °C above ambient, well within the 85 °C TJ limit. Designers pushing 4 W or more should add thermal vias under the exposed die pad and consider forced-air cooling. Always validate thermal performance with the manufacturer's PowerPlay Early Power Estimator before committing to a PCB stack-up.
Common pitfalls when designing with the EP20K1000CF672C9ES include: (1) using a Quartus Prime version that has dropped APEX 20KC support — pin Quartus II 13.0 or earlier; (2) ignoring per-bank VCCIO mixing rules, which causes input buffer latch-up; (3) omitting JTAG chain termination on boards with multiple FPGAs, leading to configuration failures; (4) relying on asynchronous reset logic, which fails metastability testing on high-speed paths. Always generate the bitstream with the 'Verify' option enabled and run TimeQuest timing analysis across all 508 I/Os before tape-out.
규정 준수 정보
Compliance status not explicitly stated in the verified web data. The 'ES' suffix on this part indicates engineering-sample shipping media; the 'N' suffix variants (e.g., EP20K1000CF672C8N) typically denote lead-free finishes per Intel/Altera naming convention, but this should be confirmed against the lot-specific Certificate of Conformance. AEC-Q100 is not applicable to commercial-grade FPGAs in this family.
