EP2A25F672I7 - APEX II FPGA 900K Gates 672-FBGA | Intel
부품 번호: EP2A25F672I7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
EP2A25F672I7 개요
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor in the broader hierarchy of logic devices: programmable logic -> programmable logic device (PLD) -> FPGA -> CMOS integrated circuit -> semiconductor. Unlike a fixed-function ASIC, an FPGA can be reconfigured in the field to implement custom digital logic, DSP blocks, and memory structures. The APEX II family was Altera's (now Intel) high-end flagship in the early 2000s, positioned before the Stratix and Cyclone families and aimed at data-path-heavy designs requiring embedded memory and multipliers.
Key features include 24,320 logic elements, embedded system blocks (ESBs) for RAM/ROM, support for LVDS, LVTTL, and PCI I/O standards, and a multi-gigabit embedded transceiver option via companion chipsets. The device supports in-system programmability through JTAG, and its high pin count (672 FC-FBGA) provides abundant I/O bandwidth for parallel buses, memory interfaces, and high-speed serial links.
The APEX II architecture combines look-up table (LUT)-based logic with structured embedded memory and dedicated routing, balancing flexibility with deterministic timing closure. The 0.15 µm process delivers low core voltage operation (1.5 V) and moderate static power consumption relative to larger-node FPGAs of its generation.
Typical applications include telecommunications line cards, ASIC prototyping, high-speed data acquisition, image processing front-ends, and legacy industrial control systems. The 672-ball FC-FBGA package enables dense board layouts required in telecom backplane designs.
When designing with this device, verify availability through authorized distributors, as the APEX II family has been classified as legacy/obsolete for many years. Designers should plan migration paths to Stratix or Cyclone families for new designs.
This page synthesizes distributor availability, parametric specifications, and drop-in alternative cross-references for the EP2A25F672I7, providing practical sourcing context not consolidated on the original Altera datasheet.
드롭인 대체품: EP2A25F672I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A25F672I7 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Process Technology, Configuration Method, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A25F672I6
✅ 드롭인✓ 재고 있음
$178 / 개
데이터시트 보기 →EP2A25F672I-7
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP2A25F672I8
✅ 드롭인✓ 재고 있음
$125 / 개
데이터시트 보기 →EP2A25F672ES
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP2A25F672I-9
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2A40F672I7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$185 / 개
데이터시트 보기 →EP2A25F672I7 최대 정격 & 전기적 특성
| Family | APEX II |
| Logic Elements | 24,320 |
| Gate Count | 900,000 |
| Maximum Frequency | 500 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Voltage | 1.5 V |
| 패키지 | 672-pin FC-FBGA |
| 실장 유형 | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 7 |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, LVDS |
| Embedded Memory | Yes (Embedded System Blocks) |
| Configuration Interface | JTAG |
EP2A25F672I7 672-pin fc-fbga 핀 구성 가이드
EP2A25F672I7(672-pin fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A25F672I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A25F672I7 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, Image Processing Front-Ends, Legacy Industrial Control Systems, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP2A25F672I7 is well-suited for telecommunications line card designs requiring high-density parallel logic. Its 24,320 logic elements and 500 MHz internal performance enable implementation of channelized framers, ATM/Sonet protocol engines, and HDLC controllers. The 672-ball FC-FBGA provides sufficient I/O to interface with multiple T1/E1 framers, a local bus to a network processor, and PCI host interface simultaneously. Designers favor APEX II in this domain because embedded system blocks implement elastic stores and FIFO buffers more efficiently than distributed RAM. Industrial temperature grade supports central office deployments where ambient temperatures can reach 70C+ in confined racks.
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ASIC Prototyping and Emulation
With 900K gates and 24,320 logic elements, the EP2A25F672I7 served as a platform for ASIC prototyping in the early 2000s. The high logic density supports partitioning large ASIC designs across multiple FPGAs using JTAG daisy chains. Embedded system blocks implement register files and SRAM in prototyping flows. The 672-ball FC-FBGA provides the high I/O count required for multi-chip ASIC emulation boards with 200+ signal pins per device. While superseded by modern prototyping platforms, EP2A25F672I7 is still found in legacy ASIC emulators and education labs where mature tooling and reference flows exist.
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High-Speed Data Acquisition Systems
The EP2A25F672I7 supports high-speed data acquisition front-ends requiring parallel processing of ADC channels. With 500 MHz internal performance and LVDS I/O support, it can clock ADC data at 100-300 MSPS per channel and perform real-time DSP such as FIR filtering, FFT, and decimation in the FPGA fabric. The 672-ball FC-FBGA delivers the I/O bandwidth required for 8-16 channel synchronous ADC interfaces. Embedded system blocks implement dual-port RAMs for sample buffering and overlap-save convolution. Industrial temperature grade supports factory-floor and outdoor instrumentation deployments.
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Image Processing Front-Ends
The EP2A25F672I7 was widely adopted in image processing front-ends for machine vision, medical imaging, and surveillance. Its 24,320 logic elements can implement real-time convolution kernels, edge detection (Sobel, Canny), and color space conversion pipelines. The 500 MHz performance enables 60 fps processing of VGA-resolution streams. The 672-ball FC-FBGA interfaces directly to CMOS image sensors, DDR memory, and host processors via parallel buses. Embedded system blocks implement line buffers and frame stores. Migration paths to Cyclone V or Stratix families are recommended for new designs, but existing EP2A25F672I7 designs remain in production for industrial and medical equipment.
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Legacy Industrial Control Systems
Industrial control systems with long field-deployment lifetimes (15-25 years) often continue using the EP2A25F672I7 for replacement and maintenance. Its industrial temperature grade (-40C to +100C) and 672-ball FC-FBGA package are well-suited to factory automation, motor control, and process control applications. The FPGA handles deterministic real-time control loops, encoder decoding (via LVDS I/O), and high-speed communication protocols (EtherCAT, SERCOS) at rates that older microcontrollers cannot achieve. Many OEMs maintain APEX II-based designs in production for power generation, railway signaling, and military/aerospace legacy platforms where redesign qualification costs are prohibitive.
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Test and Measurement Instrumentation
Test and measurement equipment (logic analyzers, protocol analyzers, bit-error-rate testers) built around the EP2A25F672I7 leverage its deep logic capacity for state machine sequencing, pattern generation, and protocol decoding. The 672-ball FC-FBGA interfaces to high-speed DAC/ADC front-ends via LVDS, while internal logic runs at 500 MHz to support real-time protocol analysis at gigabit rates. Embedded system blocks implement deep capture buffers. While modern test equipment uses Stratix or Kintex devices, EP2A25F672I7-based instruments remain in service in calibration labs and field service kits, with the long lifecycle of test equipment favoring spare-parts inventory of the original FPGA.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A25F672I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A25F672I6 | EP2A25F672I-7 | EP2A25F672I8 | EP2A25F672ES | EP2A25F672I-9 | EP2A40F672I7 |
|---|---|---|---|---|---|---|---|
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Gate Count | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 1,500,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 40,960 |
| Speed Grade | 7 | 6 | 7 | 8 | 7 | 9 | 7 |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial (ES marking) | Industrial | Industrial |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Speed grade 7 balances cost and performance within the APEX II family (vs EP2A25F672I8)
- Industrial temperature range supports central office and industrial deployments (vs EP2A25F672C7)
- Same package and pinout as higher-density EP2A40 for upward migration path (vs EP2A40F672I7)
설계 노트
The 672-ball FC-FBGA package dissipates 5-15 W typical under full FPGA utilization. Design PCB with at least 4 signal layers plus dedicated ground/power planes. The exposed die pad (if present) requires thermal via array (0.3 mm drill, 1.2 mm pitch) connected to inner ground plane. Estimated: at 10 W dissipation and standard 8-layer JEDEC test board (theta_JA ~10 C/W), junction temperature rises 100C above ambient, so derate clock frequency or reduce utilization if ambient exceeds 50C.
FC-FBGA packages with 1.0 mm ball pitch require microvia (HDI) PCB fabrication. Use 0.4 mm pad diameter with NSMD (Non-Solder Mask Defined) pad design for better joint reliability. Match trace impedance to 50 ohm single-ended / 100 ohm differential for LVDS. Place decoupling capacitors (0.1 µF + 10 µF) within 2 mm of every VCC/VCCIO pin pair. Use X-ray inspection (2D or 3D CT) for production solder joint verification - BGA defects cannot be visually inspected.
Common pitfalls when designing with EP2A25F672I7: (1) confusing APEX II (EP2A) part numbers with APEX 20K (EP20K) - they are NOT compatible; (2) assuming JTAG chain works without checking TMS/TCK pull-up resistors (4.7 kohm required); (3) underestimating configuration time - large bitstreams (>5 Mbit) take 100+ ms to load via JTAG; (4) ignoring I/O bank voltage compatibility - mixing 3.3 V and 1.5 V on the same bank damages the device; (5) using obsolete Quartus II v4-5 - latest Altera tools supporting APEX II are limited.
Signal integrity: route LVDS pairs with 100 ohm differential impedance, length-matched within 150 mil (3.8 mm). Use 45-degree bends, no 90-degree corners. Separate analog/digital grounds with a single-point connection near the FPGA. Place clock inputs on package balls closest to internal PLLs to minimize jitter. Source-synchronous interfaces (DDR, LVDS) require explicit length matching in Quartus II pin planner - allow 5-10% skew tolerance for setup/hold margin.
규정 준수 정보
APEX II family pre-dates many modern compliance mandates. RoHS/REACH status for the specific EP2A25F672I7 lot should be verified from the manufacturer declaration or distributor CoC at time of purchase. Not AEC-Q100 qualified (FPGA without automotive certification); for automotive applications use qualified variants or modern automotive-grade FPGAs.
