EP2A25F672I9 - APEX II 900K Gates FPGA | Intel (Altera) | FC-FBGA-672
부품 번호: EP2A25F672I9 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $135 | $135,000.00 |
EP2A25F672I9 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure in-circuit to implement custom digital circuits. Within the broader semiconductor taxonomy, FPGAs belong to the programmable logic family, which sits between fixed-function ASICs and software-defined microcontrollers; APEX II specifically targets high-density, multi-million-system-gate designs.
Key specifications of the EP2A25F672I9 include 24,320 logic cells, 900K ASIC-equivalent gates, embedded system blocks (ESBs) for dual-port RAM and ROM, up to 422,400 RAM bits, and four phase-locked loops (PLLs) for clock management. The device also features high-speed LVDS I/O support, dedicated multiplier circuitry, and a multi-voltage I/O standard set including LVCMOS, LVTTL, SSTL, and HSTL. Its 672-pin FC-FBGA package provides the high I/O count and signal-integrity characteristics required by telecommunications and high-performance data-path designs.
Architecturally, the EPEX II device uses a MultiCore architecture combining fine-grain logic elements with embedded memory and a high-bandwidth interconnect fabric. The 0.15 µm metal-layer process supports the high gate count while keeping die area manageable; flip-chip BGA packaging reduces lead inductance and enables the high toggle rates needed at 236 MHz. APEX II introduced the first embedded system blocks for RAM/ROM in an Altera high-density family, replacing earlier distributed-RAM schemes and simplifying synchronous memory inference.
Typical applications for the EP2A25F672I9 include telecommunications backplane interfacing, custom DSP pipelines, high-speed data-acquisition front-ends, networking ASIC prototyping, and industrial motion-control subsystems. Its high gate count and embedded RAM also make it useful for system-on-chip (SoC) prototyping and bridge-chip designs that precede ASIC tape-out.
When designing with this FPGA, pay close attention to power-rail sequencing (1.5 V core and a separate VCCIO bank supply), thermal management through adequate PCB copper area, and signal-integrity on LVDS pairs. Plan configuration mode (e.g., passive serial, JTAG) and decoupling before layout finalization.
This page consolidates distributor pricing, design considerations, and verified pin-compatible alternatives that complement the Intel/Altera APEX II datasheet. It is intended to accelerate component selection and BOM risk assessment for engineering teams evaluating legacy FPGAs.
드롭인 대체품: EP2A25F672I9 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A25F672I9 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Operating Temperature, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A25F672I8N
✅ 드롭인✓ 재고 있음
$198.5 / 개
데이터시트 보기 →EP2A25F672I8
✅ 드롭인✓ 재고 있음
$125 / 개
데이터시트 보기 →EP2A25F672I7N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2A25F672I7
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP2A25F672I6
✅ 드롭인✓ 재고 있음
$178 / 개
데이터시트 보기 →EP2A25F672C9N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2A25F672C9
✅ 드롭인✓ 재고 있음
$700 / 개
데이터시트 보기 →EP2A25F672I9 최대 정격 & 전기적 특성
| Family | APEX II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 24,320 |
| System Gates (typical) | 900,000 |
| Maximum Operating Frequency | 236 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Voltage (VCCINT) | 1.5 V |
| 패키지 | 672-pin FC-FBGA |
| 핀 수 | 672 |
| Temperature Grade | Industrial (-40 °C to +100 °C) |
| Speed Grade | 9 (fastest APEX II grade) |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM/ROM) |
| Maximum Memory Bits | 422,400 bits |
| PLLs | 4 |
| 실장 유형 | Surface Mount (flip-chip BGA) |
| Peak Reflow Temperature | 220 °C (per distributor listing) |
| 습도 민감도 레벨 (MSL) | 3 |
| RoHS 상태 | Unknown (legacy 2000s part; verify lot certificate) |
EP2A25F672I9 672-pin fc-fbga 핀 구성 가이드
EP2A25F672I9(672-pin fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A25F672I9.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A25F672I9 적합 용도: 6 애플리케이션s: Telecommunications Backplane Interfacing, ASIC Prototyping and Pre-Silicon Validation, High-Speed Data Acquisition Front-Ends, Custom DSP Pipeline Implementation, Industrial Motion Control Subsystems, Networking ASIC Bridge Chip (Pre-Tapeout).
Telecommunications Backplane Interfacing
The EP2A25F672I9 fits telecommunications backplane bridging because its 24,320 LEs and 900K system gates provide headroom for multi-channel framing, serializer/deserializer glue logic, and protocol-state machines on the same die. Its 236 MHz fmax at speed grade 9 and embedded dual-port RAM (ESBs) handle serial-to-parallel conversions and small FIFO buffers commonly used at line-card to switch-fabric boundaries. The 672-pin FC-FBGA package supports the high I/O count needed for parallel backplane buses and LVDS pairs running at hundreds of megabits per second. Engineers should pair the FPGA with external PHY transceivers and budget careful timing for clock-domain crossings between backplane and core logic.
추천
ASIC Prototyping and Pre-Silicon Validation
The 900K system-gate capacity of the EP2A25F672I9 makes it a credible target for ASIC prototyping where the design-under-test typically maps to 70-90% of an FPGA's available logic. Industrial temperature grading supports validation in chassis that emulate production environments, while 422,400 bits of embedded RAM cover medium-sized register files and FIFO structures common to ASIC prototypes. Speed grade 9 provides timing margin that emulates ASIC performance more accurately than slower grades. Designers use this FPGA in conjunction with partitioning scripts to map ASIC RTL into multiple APEX II devices when logic exceeds one chip's capacity.
추천
High-Speed Data Acquisition Front-Ends
In data-acquisition front-ends, the EP2A25F672I9 provides the parallel processing fabric required for waveform capture, real-time filtering, and data reduction before host transfer. Its embedded system blocks implement dual-port RAM line buffers, while the four PLLs generate multiple sample-rate clocks from a single reference. Industrial temperature grading allows deployment in field instrumentation, not just controlled labs. The flip-chip BGA package offers the signal-integrity margin needed for low-jitter sampling at high analog bandwidths when paired with high-speed ADCs.
추천
Custom DSP Pipeline Implementation
The EP2A25F672I9 is well-suited to custom DSP pipelines because its 24,320 LEs can realize hundreds of multiplier-accumulator stages, and embedded memory supports coefficient tables and circular delay-line buffers. At 236 MHz, the fabric supports FIR filter sample rates in the hundreds of MSPS depending on filter length. Industrial temperature grading makes it deployable in outdoor or factory DSP applications such as vibration analysis, condition monitoring, and software-defined radio baseband preprocessing. Designers should pipeline aggressively and use the dedicated ESB blocks to free logic resources for arithmetic.
추천
Industrial Motion Control Subsystems
Industrial motion control benefits from the EP2A25F672I9 because its high gate count and 672-pin BGA accommodate multi-axis servo loops, encoder decoding, and safety logic in a single device. Industrial temperature grading (-40 °C to +100 °C) is essential for cabinet or machine-mount environments. The embedded dual-port RAM simplifies PID controller tables and trajectory buffers, while PLLs allow precise switching-frequency synthesis for PWM outputs. Engineers should design with adequate decoupling and follow APEX II power-sequencing recommendations to ensure deterministic startup under load.
추천
Networking ASIC Bridge Chip (Pre-Tapeout)
Before committing a networking ASIC to fabrication, design teams often deploy the EP2A25F672I9 as a bridge chip to emulate packet-processing behavior and validate software stacks against real hardware. The 900K system-gate capacity is sufficient for full L2/L3 forwarding tables, while embedded memory holds route-cache structures. Speed grade 9 delivers realistic timing for backplane interfaces, reducing the risk of late-tapeout surprises. Industrial temperature grading allows validation in commercial-grade chassis as well as outdoor pilot deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A25F672I9 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A25F672I8N | EP2A25F672I8 | EP2A25F672I7N | EP2A25F672C9N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FC-FBGA-672 | FC-FBGA-672 - same | FC-FBGA-672 - same | FC-FBGA-672 - same | FC-FBGA-672 - same |
| Logic Elements (LEs) | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Speed Grade | 9 (fastest) | 8 | 8 | 7 | 9 |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial | Industrial | Industrial | Commercial (0 °C to +85 °C) |
| Maximum Frequency | 236 MHz | ~225 MHz (grade 8 estimate) | ~225 MHz (grade 8 estimate) | ~210 MHz (grade 7 estimate) | 236 MHz |
| Embedded RAM Bits | 422,400 | 422,400 | 422,400 | 422,400 | 422,400 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest speed grade within APEX II 672-pin family (vs EP2A25F672I8N)
- Industrial temperature range (-40 °C to +100 °C) (vs EP2A25F672C9N)
- Full 900K system-gate capacity (vs EP2A15F672I8)
설계 노트
The EP2A25F672I9 requires two power rails: a 1.5 V VCCINT for the core and a separate VCCIO for each I/O bank (commonly 3.3 V, 2.5 V, 1.8 V or 1.5 V depending on the I/O standard). Power sequencing must follow Altera APEX II recommendations - VCCINT should rise before or simultaneously with VCCIO, and the device's POR (power-on-reset) circuit must see a monotonic ramp. Bulk decoupling of 100 µF plus 0.1 µF ceramics at each supply pin, and 10 µF near each PLL VCC pin, are mandatory. Decoupling layout is critical because the 236 MHz toggle rate couples high-frequency current into the planes.
Estimated: at 236 MHz toggling across 50% of LEs at typical APEX II utilization, the EP2A25F672I9 can dissipate 2-4 W. The FC-FBGA-672 package's thermal performance depends strongly on PCB copper area and inner-plane stitching. Design at least 4 thermal vias in the BGA thermal pad region and use a continuous ground plane on layer 2 to spread heat. For sealed enclosures, derate junction temperature by ensuring airflow or attach a heatsink with thermal interface material. Industrial-grade parts must keep Tj below 100 °C for full-temperature operation.
The FC-FBGA-672 has a fine pitch (typically 1.27 mm or 1.0 mm ball pitch depending on density code) - follow Altera APEX II package guidelines for escape routing, microvia stack-ups, and BGA pad design. Use 50 Ω controlled impedance for LVDS pairs, and 60-100 Ω differential for high-speed clocks. Match trace lengths within ±150 ps across LVDS data and clock pairs to meet APEX II LVDS timing budgets. Avoid routing signals across power-plane splits, which would inject noise into sensitive PLL supply pins.
Do not assume a Cyclone or newer Altera/Intel FPGA is a drop-in replacement - those families use different packages, different I/O standards, and different configuration schemes. Also, do not confuse APEX II (EP2A prefix) with APEX 20K (EP20K prefix); the architectures are related but differ in embedded memory organization. Verify the configuration mode (passive serial, JTAG, etc.) is supported by your programmer before board bring-up. MSL 3 requires dry-pack handling and floor-life accounting before reflow.
규정 준수 정보
The EP2A25F672I9 is a legacy 2000s-era Altera FPGA whose RoHS/REACH status varies by date code and lot. -N suffixed variants are typically lead-free; non-suffixed variants may be SnPb. Always request a certificate of conformance (CoC) and material declaration from the distributor before procurement.
