EP2A40B724C7ES - APEX II 1.5M Gates 562MHz FPGA | Intel | 724-FCBGA
부품 번호: EP2A40B724C7ES ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $198 | $19,800.00 |
| 500 | $175 | $87,500.00 |
| 1,000 | $155 | $155,000.00 |
EP2A40B724C7ES 개요
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can program after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLD), which also includes CPLDs (Complex Programmable Logic Devices). Within Intel's portfolio, the APEX II family sits between the older APEX 20K and later Stratix families, targeting high-gate-count designs with embedded memory and a MultiCore architecture for parallel processing.
Key features of the EP2A40B724C7ES include 38,400 logic cells, embedded system blocks (ESBs) for RAM/ROM, 4 Phase-Locked Loops (PLLs) for clock management, and LVTTL/LVCMOS/PCI I/O standards. The 724-ball Fine-pitch Chip-Scale BGA (FCBGA) package provides high I/O density and excellent signal integrity for multi-million-gate designs operating in the 100-200 MHz range. The 0.15 µm process and dedicated MultiCore routing fabric deliver deterministic timing closure for high-performance datapath and bus-interface applications.
The architecture uses a MultiCore fabric of LUTs, product-term logic, and embedded memory that supports distributed and block RAM modes. With 562 MHz internal performance, the EP2A40B724C7ES targets designs that previously required ASIC-class integration at the cost of mask charges and NRE. The 1.5 V core supply reduces power versus 2.5 V FPGAs of equivalent gate count, and the 724-pin FCBGA supports up to 4 PLLs and high-speed LVDS I/O for parallel bus and memory interfaces.
Typical applications include telecommunications line cards, ASIC prototyping, DSP co-processing, custom peripheral controllers, high-speed bus bridging (PCI, PCI-X, DDR memory interfaces), and broadcast-video processing. APEX II is particularly well suited for pre-silicon ASIC prototyping where gate count, embedded memory, and deterministic timing closure are critical.
When designing with this FPGA, ensure proper power-plane integrity for the 1.5 V core rail and decoupling per the APEX II pin connection guidelines. The 724-FCBGA package requires PCB layer stack-up with controlled-impedance routing; signal-integrity simulation is recommended above 100 MHz.
This page synthesizes distributor inventory, drop-in APEX II alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing and substitution.
드롭인 대체품: EP2A40B724C7ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A40B724C7ES (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Configuration Method, I/O Standards Supported.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A40B724C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$650 / 개
데이터시트 보기 →EP2A40B652C9
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$92.4 / 개
데이터시트 보기 →EP2A40B652C8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$94.3 / 개
데이터시트 보기 →EP2A40B652C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP2A40B724C7ES 최대 정격 & 전기적 특성
| Family | APEX II |
| Logic Elements / Cells | 38,400 |
| System Gates | 1,500,000 (1.5M) |
| Maximum Operating Frequency | 562 MHz |
| Process Technology | 0.15 µm |
| Core Voltage | 1.5 V |
| 패키지 | 724-ball FCBGA |
| 실장 유형 | Surface Mount |
| Number of PLLs | 4 |
| Embedded Memory | Embedded System Blocks (ESBs) - RAM/ROM |
| Device Family Series | EP2A40 |
| Speed Grade | C7 |
EP2A40B724C7ES 724-ball fcbga 핀 구성 가이드
EP2A40B724C7ES(724-ball fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A40B724C7ES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A40B724C7ES 적합 용도: 6 애플리케이션s: ASIC Prototyping, Telecommunications Line Card, DSP Co-Processing, Custom Peripheral Controller, High-Speed Bus Bridging, Broadcast Video Processing.
ASIC Prototyping
The EP2A40B724C7ES fits ASIC prototyping because its 38,400 logic cells and 1.5M system gates provide capacity to map ASIC netlists of equivalent gate count directly into the APEX II fabric. According to the APEX II datasheet, the device supports incremental compilation with deterministic timing closure, allowing engineers to iterate RTL changes without re-synthesizing the entire design. The 562 MHz internal performance and 4 PLLs enable realistic verification of multi-clock-domain ASIC blocks at 100-200 MHz operating targets. Embedded System Blocks provide distributed RAM and ROM that mirror typical ASIC register/memory structures. Compared with ASIC builds that require mask sets and wafer runs, the FPGA-based prototype cuts development cost to a fraction while preserving cycle-accurate behavior for pre-silicon validation.
추천
Telecommunications Line Card
Telecommunications line cards benefit from the EP2A40B724C7ES because of its high gate count, multiple PLLs, and LVTTL/LVCMOS I/O flexibility for TDM bus and SERDES-style framing. The 1.5 V core reduces power dissipation versus older 2.5 V APEX devices, an important factor in dense multi-line rack equipment. The 724-ball FCBGA package supports high I/O count required for multi-port line interfaces, control processors, and backplane glue logic. According to APEX II application notes, the device's MultiCore fabric and embedded memory are well suited to packet-header processing, ATM/IMA segmentation, and T1/E1 framer functions. Use of 4 PLLs allows independent clock domains for line-side, system-side, and backplane interfaces.
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DSP Co-Processing
DSP co-processing applications use the EP2A40B724C7ES for offloading compute-intensive kernels from a host CPU or DSP. The 38,400 logic cells support wide parallel multipliers, FIR filter pipelines, and FFT butterfly networks that exceed DSP-chip throughput. The 562 MHz fabric enables real-time processing of multi-Megasample-per-second data streams; the 4 PLLs provide independent clocks for ADC/DAC sample rates and host-side interfaces. Compared with discrete DSP processors, the FPGA fabric offers deterministic latency and reconfigurability for protocol or algorithm changes. The embedded system blocks supply local RAM/ROM for coefficient storage and twiddle-factor tables required by FFT and convolutional code kernels.
추천
Custom Peripheral Controller
Custom peripheral controller designs use the EP2A40B724C7ES to implement glue logic, bus bridges, and protocol converters that offload the host CPU. The high gate count supports multi-protocol bridges such as PCI-to-PCI-X, I2C-to-SPI, or legacy-to-modern bus adaptation in a single device. The 4 PLLs synchronize multiple peripheral clock domains, and the LVTTL/LVCMOS I/O standards interface directly to legacy peripheral chips without external level translators. Embedded memory provides buffering for FIFO queues that decouple buses of different bandwidths. Compared with discrete CPLD bridges, the APEX II reduces PCB area and consolidates multiple functions on one programmable die.
추천
High-Speed Bus Bridging
High-speed bus bridging designs use the EP2A40B724C7ES to connect processors, memory, and peripherals operating at different clock rates and bus widths. The MultiCore fabric supports PCI, PCI-X, DDR memory interfaces, and custom parallel buses with deterministic timing closure. The 4 PLLs allow independent clock synthesis for each bus domain; embedded memory supplies buffering between domains of mismatched bandwidth. According to APEX II application notes, the device supports bus widths up to 64 bits and DDR rates that match common memory and processor interfaces of its era. Compared with discrete bridge ASICs, the FPGA allows post-silicon customization of bus widths, timing, and arbitration logic.
추천
Broadcast Video Processing
Broadcast video processing uses the EP2A40B724C7ES for real-time pixel pipelines such as color-space conversion, scaling, de-interlacing, and overlay composition. The 38,400 logic cells support parallel datapaths that handle SD, HD, and early progressive video formats at pixel rates up to 150 MHz. The 562 MHz fabric headroom supports multi-tap filter implementations needed for high-quality scaling. The 4 PLLs derive independent clocks for video input, processing, and output domains; embedded memory provides line buffers for filtering and frame delay. Compared with fixed-function video processors, the APEX II fabric supports evolving video standards and proprietary processing algorithms without requiring new silicon.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A40B724C7ES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A40B724C7 | EP2A40B652C9 | EP2A40B652C8 | EP2A40B652C7 |
|---|---|---|---|---|---|
| Package | 724-ball FCBGA | 724-ball FCBGA - same | 652-ball BGA - different ball count | 652-ball BGA - different ball count | 652-ball BGA - different ball count |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II |
| Logic Elements | 38,400 | 38,400 - identical | 38,400 - identical | 38,400 - identical | 38,400 - identical |
| System Gates | 1.5M | 1.5M - identical | 1.5M - identical | 1.5M - identical | 1.5M - identical |
| Speed Grade | C7 | C7 - identical | C9 - faster | C8 - faster | C7 - identical |
| Max Internal Frequency | 562 MHz | 562 MHz - identical | 562 MHz - identical | 562 MHz - identical | 562 MHz - identical |
| Core Voltage | 1.5 V | 1.5 V - identical | 1.5 V - identical | 1.5 V - identical | 1.5 V - identical |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Packaging Format | Tape & Reel (ES suffix) | Tray (no ES suffix) | Tray | Tray | Tray |
주요 차별점
- Same die, tape-and-reel packaging variant (vs EP2A40B724C7)
- High-density FCBGA ball count (vs EP2A40B652C7)
- Same die, faster speed grade (vs EP2A40B652C9)
설계 노트
The EP2A40B724C7ES requires a clean 1.5 V core supply with bulk decoupling of at least 220 µF low-ESR tantalum or ceramic and 0.1 µF high-frequency decoupling per power pin per the APEX II reference design. Estimated: at typical utilization (~70% LEs switching at 100 MHz I/O), expect 3-5 W core dissipation. Multiple VCCINT and VCCIO pins exist - all must be connected; floating any power pin prevents configuration. Use a dedicated power-plane layer for VCCINT to minimize IR drop and high-frequency impedance.
The 724-ball FCBGA package uses a fine ball pitch and demands a multi-layer PCB (typically 8-12 layers) with controlled-impedance stack-up. Per the APEX II Hardware Reference, route all 4 PLL power pins (VCC_PLL) with isolated analog ground islands, and place 0.1 µF + 10 µF decoupling within 200 mil of each PLL pin. Match trace lengths within ±50 mil for bus interfaces to preserve timing margins. Use a buried via or microvia process for signal escape from the BGA field.
The FCBGA package relies on PCB copper for heat spreading; thermal vias under the die-attach pad are required. Estimated: at 5 W dissipation with theta_JA of approximately 15-20 C/W (typical for this FCBGA), junction temperature rises 75-100 C above ambient without thermal vias. Provide at least 4 thermal vias per power-pad ball, with a continuous copper pour on inner layers. Without thermal management, the device can exceed 125 C Tj and trigger thermal slowdown or damage during sustained 100% utilization.
Do not mix APEX II JTAG configuration with APEX 20K configuration modes - the bitstream formats differ. Ensure all configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) are pulled to the correct logic level via 4.7 kΩ-10 kΩ resistors during power-up; floating MSEL pins can put the device into unsupported configuration modes. Verify EPC2 or EPC4 configuration-device compatibility, and never hot-swap the device - power sequencing requires VCCINT stable before VCCIO ramps. Cross-check against the APEX II Configuration Handbook before board bring-up.
규정 준수 정보
Compliance flags not stated in the verified distributor data; legacy APEX II devices typically predate full RoHS documentation. Refer to Intel/Altera legacy product documentation for specific declarations.
