EP2A40B724C8 - APEX II FPGA 1.5M Gates 540 I/O 724-FCBGA
부품 번호: EP2A40B724C8 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $750.61 | $750.61 |
| 10 | $720.5 | $7,205.00 |
| 100 | $680 | $68,000.00 |
| 250 | $645 | $161,250.00 |
| 500 | $615 | $307,500.00 |
EP2A40B724C8 개요
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device (PLD) semiconductor whose logic fabric, routing, and I/O behaviour are defined by a user-supplied configuration bitstream after manufacture. FPGAs sit at the top of the programmable logic hierarchy (PAL/CPLD -> FPGA -> SoC FPGA) and are widely used to implement glue logic, custom datapaths, and high-throughput parallel signal processing. The APEX II family in particular combines fine-grained Look-Up Tables (LUTs) with embedded memory blocks and supports high-speed serial interfaces up to 1 Gbps, including True-LVDS, LVPECL, PCML, and HyperTransport signalling.
Key features include 38400 logic cells, 540 user I/Os, 655360 bits of RAM, embedded True-LVDS I/O supporting 1 Gbps data rates, and high-speed LVPECL/PCML/HyperTransport support. The device also supports up to eight layers of copper interconnect, enabling high-fanout designs with predictable timing closure on long combinational paths.
The EP2A40B724C8 is built on a 0.15 µm eight-layer copper CMOS process with a 1.5 V core. Its embedded memory blocks and dedicated high-speed I/O channels allow direct connection to DDR-style external memories and backplane serial links without an external PHY, which simplifies board layout in telecom and high-end industrial designs.
Typical applications include telecommunications line cards, high-speed serial backplanes, ASIC prototyping, DSP co-processing, and high-density glue logic in networking equipment. The high I/O count also makes it suitable for industrial imaging and test-and-measurement instrumentation front-ends.
When designing with the EP2A40B724C8, plan thermal dissipation carefully: at high toggle rates the 724-FCBGA can dissipate several watts, so a multi-layer PCB with thermal vias under the die is required for reliable operation. Power sequencing between the 1.5 V core and 3.3 V I/O rails must also be respected to avoid latch-up.
This page synthesizes distributor pricing, drop-in alternatives from the same APEX II family, and practical design notes not found in the manufacturer datasheet, providing engineers with a complete view of the part's lifecycle position, pin-compatible substitutes, and key electrical parameters.
드롭인 대체품: EP2A40B724C8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A40B724C8 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A40B724C7
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP2A40B724C7N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2A40B724C7ES
✅ 드롭인✓ 재고 있음
$155 / 개
데이터시트 보기 →EP2A40B652C9
✅ 드롭인✓ 재고 있음
$92.4 / 개
데이터시트 보기 →EP2A40B652C8
✅ 드롭인✓ 재고 있음
$94.3 / 개
데이터시트 보기 →EP2A40B652C7
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2A40B724C8 최대 정격 & 전기적 특성
| Family | APEX II |
| Device Logic Elements / Cells | 38400 |
| Total System Gates | ~1.5 M |
| Total RAM Bits | 655360 |
| Number of I/O | 540 |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Maximum Internal Frequency | 376 MHz |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers |
| I/O Standards Supported | True-LVDS, LVPECL, PCML, HyperTransport (up to 1 Gbps) |
| 패키지 / 케이스 | 724-BBGA, FCBGA (35 x 35 mm) |
| Supplier Device Package | 724-BGA |
| 동작 온도 | 0 °C to 85 °C (TJ) |
| 실장 유형 | Surface Mount |
| Shipping Media | Tray |
EP2A40B724C8 724-bga 핀 구성 가이드
EP2A40B724C8(724-bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A40B724C8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A40B724C8 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, ASIC Prototyping, High-Speed Serial Backplane, DSP Co-Processing, Industrial Imaging Front-End, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP2A40B724C8 is well-suited for telecom line-card designs because its 1 Gbps True-LVDS I/O and 540 user pins accommodate high-density serializer/deserializer and TDM backplane interfaces. With 38,400 logic elements it can host multi-channel framer, deframer, and forward-error-correction (FEC) datapaths in a single device, eliminating the need for external glue logic. The 1.5 V core minimises power dissipation per logic cell compared to older 0.18 µm FPGAs, while 655,360 bits of embedded RAM support packet buffering without external SRAM. Designers pair it with a 3.3 V I/O bank to interface legacy 3.3 V PHY devices.
추천
ASIC Prototyping
The EP2A40B724C8's combination of 38,400 logic elements and 540 user I/Os makes it a strong fit for ASIC prototyping of mid-complexity ASICs (approximately 1M gates of equivalent random logic). Per the APEX II datasheet, the device supports full readback and incremental recompile, accelerating design verification cycles. The 0.15 µm 8-layer copper process provides predictable timing closure on long combinational paths, which is essential when partitioning a large ASIC across multiple FPGAs. Designers typically choose the C7 speed grade (EP2A40B724C7) for timing-critical prototypes.
추천
High-Speed Serial Backplane
The APEX II family supports 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport signalling natively, which the EP2A40B724C8 leverages for backplane serial links in storage and networking shelves. Designers typically aggregate 4-8 LVDS channels per FPGA to achieve multi-gigabit aggregate bandwidth. The 655 Kbit embedded memory block serves as elastic FIFO buffering between backplane and core logic. Thermal design must consider that 8 simultaneous LVDS channels at full toggle rate can add 1-2 W of dynamic power dissipation.
추천
DSP Co-Processing
The 38,400 logic elements of the EP2A40B724C8 can host multi-channel FIR filters, FFT engines, or video processing pipelines in conjunction with a host DSP or microprocessor. Embedded RAM blocks (655 Kbit total) are ideal for storing filter coefficients and line buffers. Per the APEX II datasheet, the device supports 376 MHz internal register-to-register operation, enabling sample rates up to ~150 MSPS for 8-tap FIR filters. Designers typically use C7 speed grade parts for highest DSP throughput.
추천
Industrial Imaging Front-End
The EP2A40B724C8's 540 user I/Os can fan out to multiple CMOS image sensors, high-speed ADCs, or Camera Link receivers in machine-vision systems. Embedded RAM blocks provide line-buffer storage for real-time image processing. The industrial 0 °C to 85 °C operating temperature range (per Altera APEX II datasheet) suits factory-floor environments without requiring extended-temperature screening. Designers must observe the LVDS 1 Gbps data-rate guideline when interfacing modern high-resolution sensors.
추천
Test and Measurement Instrumentation
The EP2A40B724C8 suits test-and-measurement front-ends where many input channels (540 I/Os) need parallel sampling, decimation, and trigger detection. Its embedded RAM can serve as deep capture memory for transient events. APEX II devices support boundary-scan and readback for in-system test, valuable in production ATE. Designers commonly use the C8 speed grade where timing margins are not critical, reducing cost versus the faster C7 grade.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A40B724C8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A40B724C7 | EP2A40B724C7N | EP2A40B724C7ES | EP2A40B652C9 | EP2A40B652C8 | EP2A40B652C7 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 724-FCBGA (35x35 mm) | 724-FCBGA - same | 724-FCBGA - same | 724-FCBGA - same | 724-FCBGA - same | 724-FCBGA - same | 724-FCBGA - same |
| Logic Elements | 38400 | 38400 | 38400 | 38400 | 38400 | 38400 | 38400 |
| Total RAM Bits | 655360 | 655360 | 655360 | 655360 | 655360 | 655360 | 655360 |
| User I/O Count | 540 | 540 | 540 | 540 | 540 | 540 | 540 |
| Speed Grade | C8 | C7 (faster) | C7 (faster, lead-free) | C7 (faster, ES) | C9 (slower) | C8 (same) | C7 (faster) |
| Core Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process | 0.15 µm 8-layer Cu CMOS | 0.15 µm 8-layer Cu CMOS | 0.15 µm 8-layer Cu CMOS | 0.15 µm 8-layer Cu CMOS | 0.15 µm 8-layer Cu CMOS | 0.15 µm 8-layer Cu CMOS | 0.15 µm 8-layer Cu CMOS |
| LVDS / High-Speed I/O | True-LVDS, LVPECL, PCML, HyperTransport (1 Gbps) | Same LVDS/LVPECL/PCML/HyperTransport | Same LVDS/LVPECL/PCML/HyperTransport | Same LVDS/LVPECL/PCML/HyperTransport | Same LVDS/LVPECL/PCML/HyperTransport | Same LVDS/LVPECL/PCML/HyperTransport | Same LVDS/LVPECL/PCML/HyperTransport |
주요 차별점
- 38,400 logic elements with 540 user I/Os in a single 724-FCBGA (vs EP2A25F672I9)
- 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport support (vs EP20K400FC672-3)
- 0.15 µm 8-layer copper CMOS process (vs EP2A15B724C8)
설계 노트
Estimated: at high toggle rates (e.g. 75% of LEs switching at 100 MHz) the EP2A40B724C8 in a 724-FCBGA may dissipate 3-6 W. The 35 x 35 mm BGA package has theta_JA in the 15-20 C/W range on a 4-layer PCB with thermal vias under the die. For 1 Gbps LVDS operation across 8+ channels, design the PCB with a continuous ground plane under the BGA and a thermal-via array on the centre balls. Without these measures junction temperature may exceed the 85 °C TJ limit.
Per the APEX II datasheet, the EP2A40B724C8 requires a 1.425 V to 1.575 V core supply and a separate I/O bank supply (typically 2.5 V or 3.3 V). Power sequencing must bring up the core supply before the I/O supply to prevent I/O buffers back-powering the core through ESD diodes. Use a sequencing controller or a power-good interlock between rails; allow at least 10 ms between rail assertions. Decoupling: place 0.1 µF X7R ceramic capacitors adjacent to every power pin and bulk 22 µF tantalum or polymer caps on each supply plane.
The 724-FCBGA package requires micro-via technology (typically 4-6 mil laser-drilled vias) on the PCB. Use a high-Tg FR-4 or polyimide substrate to survive assembly reflow (peak ~245 °C for lead-free). Match the BGA pad pitch exactly (typically 1.0 mm pitch) and use non-solder-mask-defined (NSMD) pads for reliable solder joints. Routing escape from inner-row balls requires 4-6 routing layers; plan stackup accordingly.
Differential pair routing for 1 Gbps LVDS must be length-matched within 5 mil and routed over a continuous reference plane. The APEX II datasheet recommends 100 Ω differential impedance with 50 Ω single-ended trace impedance. Keep LVDS pairs away from switching power supply nodes; place ferrite beads on supply rails that enter LVDS regions. Use ground-signal-ground (GSG) via stitching every λ/10 along the pair path to suppress common-mode noise.
Do not substitute EP2A40B724C8 with EP2A40F672C9 or EP2A40F1020C7 without redesigning the PCB - the F672C9 is a 672-ball package and F1020C7 is a 1020-ball package, both with different footprints and pinouts. The C7/C8/C9 speed-grade suffix denotes timing bin (lower = faster); replacing C8 with C7 is safe (only improves timing margin), but replacing C8 with C9 may violate setup/hold. Use Altera Quartus II 9.0 or later for bitstream generation and verify JTAG IDCODE before loading a configuration file.
규정 준수 정보
Compliance fields not present in the verified web data; set to 'unknown' rather than fabricate. The EP2A40B724C7N variant is the lead-free commercial variant if a lead-free pin-compatible substitute is required.
